GaN CLAMP WITH UNIFORM PRESSURE | Matter42 Literature
Patent
Atlas literature
Patent
US 12,397,362 B2
GaN CLAMP WITH UNIFORM PRESSURE
Stephan R. Fatschel
MKS Inc., Andover, MA (US)·Aug. 26, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the 55 present disclosure;
FIG. 2
apparatus side view
FIG. 2 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the present disclosure;
FIG. 3
apparatus side view
FIG. 3 is a partial, cross-sectional side view of a circuit 60 board and multiple clamp assembly arranged in accordance with the present disclosure;
FIG. 4
process tool top view
FIG. 4 is a top view of the circuit board and multiple clamp assembly of
FIG. 5
apparatus side view
FIG. 5 is a side view of a circuit board and clamp 65 assembly arranged in accordance with the present disclo- sure. B₂ In the drawings, reference numbers may …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 6 dependent
1
Independentcircuit board clamp
A circuit board clamp comprising: a clamp frame including a first frame support passing through a first aperture of a circuit board and fastened to a heat sink, a second frame support passing through a second aperture of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener engaging the top plate aperture, the piston arranged to be displaced relative to the top plate in accordance with adjustment of the threaded fastener, the piston includ-ing a tubular section having a bias seat; 5 a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting a surface mounted integrated circuit between the circuit board and the pressure plate; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
2
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein the bias member is one of a coil spring or a Belleville washer.
3
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the circuit board clamp to the heat sink.
4
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 further comprising a cylinder supported by the top plate, where in the piston translates within the cylinder.
5
Independentcircuit board assembly
A circuit board assembly comprising: a heat sink; a circuit board having a first side and a second side, wherein one of the first side or the second side opposes and is in thermal contact with the heat sink and wherein the circuit board includes a plurality of apertures; a surface mounted integrated circuit attached to an other of the first side or the second side of the circuit board, the surface mounted integrated circuit including a plu-rality of electrical conductors on one of a first surface or a second surface of the surface mounted integrated circuit and the one of the first surface or the second B₂ surface of the surface mounted integrated circuit opposes the other of the first side or the second side of the circuit board to enable electrical contact between the surface mounted integrated circuit and the circuit board; a clamp frame including a first frame support passing through a first aperture of the plurality of apertures of the circuit board and fastened to the heat sink, a second frame support passing through a second aperture of the plurality of apertures of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener, the piston arranged to be displaced relative to the top plate, the piston including a tubular section having a bias seat; a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting the surface mounted integrated circuit; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
6
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein the bias member is one of a coil spring or a Belleville washer.
7
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the clamp frame to the heat sink.
8
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 further compris-ing a cylinder supported by the top plate, where in the piston translates within the cylinder. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
50–120 µm
—
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 8
US 3,226,466 A3,226,466 A * 12/1965 Martin.................. H01L 25/117examiner
US 3,571,663 A3,571,663 A * 3/1971 Hungate............. H01L 23/4006examiner
US 3,688,159 A3,688,159 A * 8/1972 Robbins.............. H01L 23/4006examiner
US 4,159,483 A4,159,483 A * 6/1979 Bettin..................... H01L 23/32examiner
Patent
Atlas literature
Patent
US 12,397,362 B2
GaN CLAMP WITH UNIFORM PRESSURE
Stephan R. Fatschel
MKS Inc., Andover, MA (US)·Aug. 26, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the 55 present disclosure;
FIG. 2
apparatus side view
FIG. 2 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the present disclosure;
FIG. 3
apparatus side view
FIG. 3 is a partial, cross-sectional side view of a circuit 60 board and multiple clamp assembly arranged in accordance with the present disclosure;
FIG. 4
process tool top view
FIG. 4 is a top view of the circuit board and multiple clamp assembly of
FIG. 5
apparatus side view
FIG. 5 is a side view of a circuit board and clamp 65 assembly arranged in accordance with the present disclo- sure. B₂ In the drawings, reference numbers may …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 6 dependent
1
Independentcircuit board clamp
A circuit board clamp comprising: a clamp frame including a first frame support passing through a first aperture of a circuit board and fastened to a heat sink, a second frame support passing through a second aperture of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener engaging the top plate aperture, the piston arranged to be displaced relative to the top plate in accordance with adjustment of the threaded fastener, the piston includ-ing a tubular section having a bias seat; 5 a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting a surface mounted integrated circuit between the circuit board and the pressure plate; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
2
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein the bias member is one of a coil spring or a Belleville washer.
3
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the circuit board clamp to the heat sink.
4
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 further comprising a cylinder supported by the top plate, where in the piston translates within the cylinder.
5
Independentcircuit board assembly
A circuit board assembly comprising: a heat sink; a circuit board having a first side and a second side, wherein one of the first side or the second side opposes and is in thermal contact with the heat sink and wherein the circuit board includes a plurality of apertures; a surface mounted integrated circuit attached to an other of the first side or the second side of the circuit board, the surface mounted integrated circuit including a plu-rality of electrical conductors on one of a first surface or a second surface of the surface mounted integrated circuit and the one of the first surface or the second B₂ surface of the surface mounted integrated circuit opposes the other of the first side or the second side of the circuit board to enable electrical contact between the surface mounted integrated circuit and the circuit board; a clamp frame including a first frame support passing through a first aperture of the plurality of apertures of the circuit board and fastened to the heat sink, a second frame support passing through a second aperture of the plurality of apertures of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener, the piston arranged to be displaced relative to the top plate, the piston including a tubular section having a bias seat; a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting the surface mounted integrated circuit; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
6
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein the bias member is one of a coil spring or a Belleville washer.
7
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the clamp frame to the heat sink.
8
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 further compris-ing a cylinder supported by the top plate, where in the piston translates within the cylinder. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
50–120 µm
—
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 8
US 3,226,466 A3,226,466 A * 12/1965 Martin.................. H01L 25/117examiner
US 3,571,663 A3,571,663 A * 3/1971 Hungate............. H01L 23/4006examiner
US 3,688,159 A3,688,159 A * 8/1972 Robbins.............. H01L 23/4006examiner
US 4,159,483 A4,159,483 A * 6/1979 Bettin..................... H01L 23/32examiner
Patent
Atlas literature
Patent
US 12,397,362 B2
GaN CLAMP WITH UNIFORM PRESSURE
Stephan R. Fatschel
MKS Inc., Andover, MA (US)·Aug. 26, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the 55 present disclosure;
FIG. 2
apparatus side view
FIG. 2 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the present disclosure;
FIG. 3
apparatus side view
FIG. 3 is a partial, cross-sectional side view of a circuit 60 board and multiple clamp assembly arranged in accordance with the present disclosure;
FIG. 4
process tool top view
FIG. 4 is a top view of the circuit board and multiple clamp assembly of
FIG. 5
apparatus side view
FIG. 5 is a side view of a circuit board and clamp 65 assembly arranged in accordance with the present disclo- sure. B₂ In the drawings, reference numbers may …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 6 dependent
1
Independentcircuit board clamp
A circuit board clamp comprising: a clamp frame including a first frame support passing through a first aperture of a circuit board and fastened to a heat sink, a second frame support passing through a second aperture of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener engaging the top plate aperture, the piston arranged to be displaced relative to the top plate in accordance with adjustment of the threaded fastener, the piston includ-ing a tubular section having a bias seat; 5 a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting a surface mounted integrated circuit between the circuit board and the pressure plate; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
2
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein the bias member is one of a coil spring or a Belleville washer.
3
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the circuit board clamp to the heat sink.
4
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 further comprising a cylinder supported by the top plate, where in the piston translates within the cylinder.
5
Independentcircuit board assembly
A circuit board assembly comprising: a heat sink; a circuit board having a first side and a second side, wherein one of the first side or the second side opposes and is in thermal contact with the heat sink and wherein the circuit board includes a plurality of apertures; a surface mounted integrated circuit attached to an other of the first side or the second side of the circuit board, the surface mounted integrated circuit including a plu-rality of electrical conductors on one of a first surface or a second surface of the surface mounted integrated circuit and the one of the first surface or the second B₂ surface of the surface mounted integrated circuit opposes the other of the first side or the second side of the circuit board to enable electrical contact between the surface mounted integrated circuit and the circuit board; a clamp frame including a first frame support passing through a first aperture of the plurality of apertures of the circuit board and fastened to the heat sink, a second frame support passing through a second aperture of the plurality of apertures of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener, the piston arranged to be displaced relative to the top plate, the piston including a tubular section having a bias seat; a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting the surface mounted integrated circuit; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
6
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein the bias member is one of a coil spring or a Belleville washer.
7
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the clamp frame to the heat sink.
8
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 further compris-ing a cylinder supported by the top plate, where in the piston translates within the cylinder. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
50–120 µm
—
Cited prior art
Patents and literature cited by this patent (applicant and examiner references).
Cited patents · 8
US 3,226,466 A3,226,466 A * 12/1965 Martin.................. H01L 25/117examiner
US 3,571,663 A3,571,663 A * 3/1971 Hungate............. H01L 23/4006examiner
US 3,688,159 A3,688,159 A * 8/1972 Robbins.............. H01L 23/4006examiner
US 4,159,483 A4,159,483 A * 6/1979 Bettin..................... H01L 23/32examiner
Patent
Atlas literature
Patent
US 12,397,362 B2
GaN CLAMP WITH UNIFORM PRESSURE
Stephan R. Fatschel
MKS Inc., Andover, MA (US)·Aug. 26, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the 55 present disclosure;
FIG. 2
apparatus side view
FIG. 2 is a partial, cross-sectional side view of a circuit board and clamp assembly arranged in accordance with the present disclosure;
FIG. 3
apparatus side view
FIG. 3 is a partial, cross-sectional side view of a circuit 60 board and multiple clamp assembly arranged in accordance with the present disclosure;
FIG. 4
process tool top view
FIG. 4 is a top view of the circuit board and multiple clamp assembly of
FIG. 5
apparatus side view
FIG. 5 is a side view of a circuit board and clamp 65 assembly arranged in accordance with the present disclo- sure. B₂ In the drawings, reference numbers may …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
2 independent · 6 dependent
1
Independentcircuit board clamp
A circuit board clamp comprising: a clamp frame including a first frame support passing through a first aperture of a circuit board and fastened to a heat sink, a second frame support passing through a second aperture of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener engaging the top plate aperture, the piston arranged to be displaced relative to the top plate in accordance with adjustment of the threaded fastener, the piston includ-ing a tubular section having a bias seat; 5 a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting a surface mounted integrated circuit between the circuit board and the pressure plate; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
2
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein the bias member is one of a coil spring or a Belleville washer.
3
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the circuit board clamp to the heat sink.
4
Dependent← claim 1circuit board clamp
The circuit board clamp of claim 1 further comprising a cylinder supported by the top plate, where in the piston translates within the cylinder.
5
Independentcircuit board assembly
A circuit board assembly comprising: a heat sink; a circuit board having a first side and a second side, wherein one of the first side or the second side opposes and is in thermal contact with the heat sink and wherein the circuit board includes a plurality of apertures; a surface mounted integrated circuit attached to an other of the first side or the second side of the circuit board, the surface mounted integrated circuit including a plu-rality of electrical conductors on one of a first surface or a second surface of the surface mounted integrated circuit and the one of the first surface or the second B₂ surface of the surface mounted integrated circuit opposes the other of the first side or the second side of the circuit board to enable electrical contact between the surface mounted integrated circuit and the circuit board; a clamp frame including a first frame support passing through a first aperture of the plurality of apertures of the circuit board and fastened to the heat sink, a second frame support passing through a second aperture of the plurality of apertures of the circuit board and fastened to the heat sink, and a top plate arranged between the first frame support and the second frame support, the top plate including a top plate aperture; a piston supported by the top plate via a threaded fastener, the piston arranged to be displaced relative to the top plate, the piston including a tubular section having a bias seat; a pressure plate assembly including a pressure plate and a stem attached to the pressure plate, the stem posi-tioned within the tubular section for translation therein, the pressure plate positioned opposite the circuit board from the heat sink, the pressure plate contacting the surface mounted integrated circuit; and a bias member seated on the bias seat and applying a biasing force on the pressure plate to urge the surface mounted integrated circuit into contact with the circuit board.
6
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein the bias member is one of a coil spring or a Belleville washer.
7
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 wherein one of the first frame support or the second frame support includes a threaded portion for receiving a fastener to mount the clamp frame to the heat sink.
8
Dependent← claim 5circuit board assembly
The circuit board assembly of claim 5 further compris-ing a cylinder supported by the top plate, where in the piston translates within the cylinder. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
US 4,636,917 A4,636,917 A * 1/1987 Jouanny................ H01L 25/117examiner
US 6,549,410 B16,549,410 B1 * 4/2003 Cohen................. H01L 23/4006examiner
US 8,134,835 B28,134,835 B2 * 3/2012 Fishman................. H01L 24/72examiner
US 2012/0229999 A12012/0229999 A1 * 9/2012 Hussain............. G01R 31/2886examiner
Cited non-patent literature · 4
Panasonic Product Standards, Panasonic PGA26E19BA E Data
Sheet, Dated: Mar. 7, 2019, 14 Pages, Revision 008.
MKS Instruments Inc., Fet Clamp Design Information, Dated: Jun. 30, 2020, 1 Page. Da Yu, Hohyung Lee, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling; Article, Dated: Dec. 2012, 6 Pages, vol. 134. Nicholas Graziano, Harry Schoeller, PhD, Lars Bruno, Effect of TIM Compression Loads on BGA Reliability, Dated: Oct. 14-18, 2018, 11
Pages, Published in Proceedings of SMTA International. Nick Padfield, Mounting Guidelines for Semelab RF MOSFETs, Dated: Nov. 30, 2020, 1 Page, Published in Semelab PLC UK.
US 4,636,917 A4,636,917 A * 1/1987 Jouanny................ H01L 25/117examiner
US 6,549,410 B16,549,410 B1 * 4/2003 Cohen................. H01L 23/4006examiner
US 8,134,835 B28,134,835 B2 * 3/2012 Fishman................. H01L 24/72examiner
US 2012/0229999 A12012/0229999 A1 * 9/2012 Hussain............. G01R 31/2886examiner
Cited non-patent literature · 4
Panasonic Product Standards, Panasonic PGA26E19BA E Data
Sheet, Dated: Mar. 7, 2019, 14 Pages, Revision 008.
MKS Instruments Inc., Fet Clamp Design Information, Dated: Jun. 30, 2020, 1 Page. Da Yu, Hohyung Lee, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling; Article, Dated: Dec. 2012, 6 Pages, vol. 134. Nicholas Graziano, Harry Schoeller, PhD, Lars Bruno, Effect of TIM Compression Loads on BGA Reliability, Dated: Oct. 14-18, 2018, 11
Pages, Published in Proceedings of SMTA International. Nick Padfield, Mounting Guidelines for Semelab RF MOSFETs, Dated: Nov. 30, 2020, 1 Page, Published in Semelab PLC UK.
US 4,636,917 A4,636,917 A * 1/1987 Jouanny................ H01L 25/117examiner
US 6,549,410 B16,549,410 B1 * 4/2003 Cohen................. H01L 23/4006examiner
US 8,134,835 B28,134,835 B2 * 3/2012 Fishman................. H01L 24/72examiner
US 2012/0229999 A12012/0229999 A1 * 9/2012 Hussain............. G01R 31/2886examiner
Cited non-patent literature · 4
Panasonic Product Standards, Panasonic PGA26E19BA E Data
Sheet, Dated: Mar. 7, 2019, 14 Pages, Revision 008.
MKS Instruments Inc., Fet Clamp Design Information, Dated: Jun. 30, 2020, 1 Page. Da Yu, Hohyung Lee, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling; Article, Dated: Dec. 2012, 6 Pages, vol. 134. Nicholas Graziano, Harry Schoeller, PhD, Lars Bruno, Effect of TIM Compression Loads on BGA Reliability, Dated: Oct. 14-18, 2018, 11
Pages, Published in Proceedings of SMTA International. Nick Padfield, Mounting Guidelines for Semelab RF MOSFETs, Dated: Nov. 30, 2020, 1 Page, Published in Semelab PLC UK.
US 4,636,917 A4,636,917 A * 1/1987 Jouanny................ H01L 25/117examiner
US 6,549,410 B16,549,410 B1 * 4/2003 Cohen................. H01L 23/4006examiner
US 8,134,835 B28,134,835 B2 * 3/2012 Fishman................. H01L 24/72examiner
US 2012/0229999 A12012/0229999 A1 * 9/2012 Hussain............. G01R 31/2886examiner
Cited non-patent literature · 4
Panasonic Product Standards, Panasonic PGA26E19BA E Data
Sheet, Dated: Mar. 7, 2019, 14 Pages, Revision 008.
MKS Instruments Inc., Fet Clamp Design Information, Dated: Jun. 30, 2020, 1 Page. Da Yu, Hohyung Lee, Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling; Article, Dated: Dec. 2012, 6 Pages, vol. 134. Nicholas Graziano, Harry Schoeller, PhD, Lars Bruno, Effect of TIM Compression Loads on BGA Reliability, Dated: Oct. 14-18, 2018, 11
Pages, Published in Proceedings of SMTA International. Nick Padfield, Mounting Guidelines for Semelab RF MOSFETs, Dated: Nov. 30, 2020, 1 Page, Published in Semelab PLC UK.