Patent
US 10,761,043multi-layer graphene/insulator sandwich nanopore device
silicon oxide
boron nitride
BN
aluminum oxide
Al₂O₃
hafnium oxide
HfO₂
titanium oxide
TiO₂
hydrogen silsesquioxane
HSQ
silicon
Si
| — |
Thickness | 0.1–30 nm | — |
Thickness | 0.1–5000000 nm | — |
Thickness | 0.1–1000 nm | — |
Thickness | 10–50 nm | — |
Duration | 0.1–43200 s | — |
Duration | 5–43200 s | — |
Thickness | 5–50 nm | — |
Thickness | 10–20 nm | — |
Thickness | 18–22 nm | — |
Thickness | 1.1–5 nm | — |
Thickness | 0.1–100 nm | — |
Thickness | 2–8 nm | — |
Thickness | 1–500 nm | — |
Thickness | 49–251 nm | — |
Thickness | 97–187 nm | — |
Thickness | 100–500000 nm | — |
Thickness | 1–1000 nm | — |
Thickness | 0.1–500 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 mm | — |
Thickness | 5.5–8 nm | — |
Thickness | 1.1–1.5 nm | — |
Thickness | 1.1–4 nm | — |
Thickness | 1.1–2 nm | — |
Thickness | 0.3–5 nm | — |
Temperature | 300–400 °C | — |
Duration | 1–60 seconds | — |
Thickness | 10–15 nm | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 314 nm | — |
Duration | ≥ 60 minutes | — |
Thickness | 10–30 nm | — |
Thickness | 1–10 nm | — |
Thickness | ≤ 5 nm | — |
Thickness | ≤ 20 nm | — |
multi-layer graphene/insulator sandwich nanopore device
silicon oxide
boron nitride
BN
aluminum oxide
Al₂O₃
hafnium oxide
HfO₂
titanium oxide
TiO₂
hydrogen silsesquioxane
HSQ
silicon
Si
| — |
Thickness | 0.1–30 nm | — |
Thickness | 0.1–5000000 nm | — |
Thickness | 0.1–1000 nm | — |
Thickness | 10–50 nm | — |
Duration | 0.1–43200 s | — |
Duration | 5–43200 s | — |
Thickness | 5–50 nm | — |
Thickness | 10–20 nm | — |
Thickness | 18–22 nm | — |
Thickness | 1.1–5 nm | — |
Thickness | 0.1–100 nm | — |
Thickness | 2–8 nm | — |
Thickness | 1–500 nm | — |
Thickness | 49–251 nm | — |
Thickness | 97–187 nm | — |
Thickness | 100–500000 nm | — |
Thickness | 1–1000 nm | — |
Thickness | 0.1–500 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 mm | — |
Thickness | 5.5–8 nm | — |
Thickness | 1.1–1.5 nm | — |
Thickness | 1.1–4 nm | — |
Thickness | 1.1–2 nm | — |
Thickness | 0.3–5 nm | — |
Temperature | 300–400 °C | — |
Duration | 1–60 seconds | — |
Thickness | 10–15 nm | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 314 nm | — |
Duration | ≥ 60 minutes | — |
Thickness | 10–30 nm | — |
Thickness | 1–10 nm | — |
Thickness | ≤ 5 nm | — |
Thickness | ≤ 20 nm | — |
multi-layer graphene/insulator sandwich nanopore device
silicon oxide
boron nitride
BN
aluminum oxide
Al₂O₃
hafnium oxide
HfO₂
titanium oxide
TiO₂
hydrogen silsesquioxane
HSQ
silicon
Si
| — |
Thickness | 0.1–30 nm | — |
Thickness | 0.1–5000000 nm | — |
Thickness | 0.1–1000 nm | — |
Thickness | 10–50 nm | — |
Duration | 0.1–43200 s | — |
Duration | 5–43200 s | — |
Thickness | 5–50 nm | — |
Thickness | 10–20 nm | — |
Thickness | 18–22 nm | — |
Thickness | 1.1–5 nm | — |
Thickness | 0.1–100 nm | — |
Thickness | 2–8 nm | — |
Thickness | 1–500 nm | — |
Thickness | 49–251 nm | — |
Thickness | 97–187 nm | — |
Thickness | 100–500000 nm | — |
Thickness | 1–1000 nm | — |
Thickness | 0.1–500 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 mm | — |
Thickness | 5.5–8 nm | — |
Thickness | 1.1–1.5 nm | — |
Thickness | 1.1–4 nm | — |
Thickness | 1.1–2 nm | — |
Thickness | 0.3–5 nm | — |
Temperature | 300–400 °C | — |
Duration | 1–60 seconds | — |
Thickness | 10–15 nm | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 314 nm | — |
Duration | ≥ 60 minutes | — |
Thickness | 10–30 nm | — |
Thickness | 1–10 nm | — |
Thickness | ≤ 5 nm | — |
Thickness | ≤ 20 nm | — |
multi-layer graphene/insulator sandwich nanopore device
silicon oxide
boron nitride
BN
aluminum oxide
Al₂O₃
hafnium oxide
HfO₂
titanium oxide
TiO₂
hydrogen silsesquioxane
HSQ
silicon
Si
| — |
Thickness | 0.1–30 nm | — |
Thickness | 0.1–5000000 nm | — |
Thickness | 0.1–1000 nm | — |
Thickness | 10–50 nm | — |
Duration | 0.1–43200 s | — |
Duration | 5–43200 s | — |
Thickness | 5–50 nm | — |
Thickness | 10–20 nm | — |
Thickness | 18–22 nm | — |
Thickness | 1.1–5 nm | — |
Thickness | 0.1–100 nm | — |
Thickness | 2–8 nm | — |
Thickness | 1–500 nm | — |
Thickness | 49–251 nm | — |
Thickness | 97–187 nm | — |
Thickness | 100–500000 nm | — |
Thickness | 1–1000 nm | — |
Thickness | 0.1–500 nm | — |
Thickness | 5–15 nm | — |
Thickness | 5–10 mm | — |
Thickness | 5.5–8 nm | — |
Thickness | 1.1–1.5 nm | — |
Thickness | 1.1–4 nm | — |
Thickness | 1.1–2 nm | — |
Thickness | 0.3–5 nm | — |
Temperature | 300–400 °C | — |
Duration | 1–60 seconds | — |
Thickness | 10–15 nm | — |
Thickness | ≤ 10 nm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 314 nm | — |
Duration | ≥ 60 minutes | — |
Thickness | 10–30 nm | — |
Thickness | 1–10 nm | — |
Thickness | ≤ 5 nm | — |
Thickness | ≤ 20 nm | — |