Patent
US 9,709,348HEAT-DISSIPATING COPPER FOIL AND GRAPHENE COMPOSITE
Kuei-Sen Cheng
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,709,348Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cut the copper foil specimen by the size of 100 mm x 100 mm.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the drum-side is in the range of 1.1 to 2.5 km.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the deposited-side is in the range of 0.3 to 1.0 m.
The heat dissipating copper foil of claim 1, wherein a lightness value L* of the deposited-side based on the L*a*b* color system, is in the range of 20 to 40.
The heat dissipatin g copper foil of claim 1, wherein the copper foil having a grain size larger than 30 nm.
A composite heat dissipating structure comprising the copper foil according to claim 1 further comprising a layer of adhesive, and a pressure consolidated graphene layer, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
The composite heat dissipating structure comprising the copper foil according to claim 1, further comprising a pressure consolidated graphene layer in contact with both the drum- and deposited-sides of the copper foil.
An electronic device comprising the composite heat dissipating structure of claim 1.
(Withdrawn and Currently Amended) A method of forming a composite heat dissipating structure, the method comprising: providing an electrodeposited copper foil according to claim 1 having a drum-side and a deposited- side; the deposited side of the copper foil exhibiting a surface roughness (Rz) in the range of 0. 3 to 1. 0 pm; coating a slurry of graphene powder on the deposited-side of the copper foil; drying the slurry to form a layer of graphene in contact with the deposited-side of the copper foil; the layer of graphene having a first thickness; Attorney Docket No.: 085114-519144 reducing the thickness of the layer of graphene layer by consolidating the graphene layer in combination with the copper foil under pressure to form a reduced thickness of graphene in contact with the copper foil; and, recovering the composite heat dissipating structure.
Use an electronic balance to measure the weight of the copper foil specimen. Electronic balance must be capable of weighing accuracy to + 0.1 mg.
Transfer to area weight by g/m 2 unit. (2) Thickness
canceled
A composite heat dissipating structure, said structure comprising: an electrodeposited copper foil, said copper foil having an area weight in the range of 280 to 900 g/m 2 [[(g/m 2)]]; the electrodeposited copper foil comprising two surfaces, said surface comprising a drum-side and a deposited-side; the deposited-side of the copper foil having a surface roughness (Rz) in the range of 0.3 to 1.0 m; the copper foil exhibits a surface tension in the range of 44 to 68 dyne/cm; and, a graphene layer in combination said copper foil, the graphene layer being in contact with at least the one side of drum-side and deposited-side of the copper foil; [[and,]] wherein the graphene layer comprises a surface opposite the copper foil, said graphene layer surface having a lightness value L* in the range of 20 to 60, based on the L*a*b* color system.
The composite heat dissipating structure of claim 15, further comprising a graphene layer in contact with both the drum- and deposited-sides of the copper foil.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits the surface roughness (Rz) in the range of 1.1 to 2.5 pm.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits an MD gloss lower than 1 80 at a light incident angle of 60 0.
The composite heat dissipating structure of claim 15, further comprising a layer of adhesive, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
canceled
Layer stacks claimed or described, ordered top of device to substrate.
single-side graphene/copper foil composite heat dissipating structure
double-side graphene/copper foil composite heat dissipating structure
Materials described outside the worked examples.
electrodeposited copper foil
Cu
graphene layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
copper foil area weight (claimed range) | 280–900 g/m2 | Cu |
deposited-side surface roughness Rz (claimed range) | 0.3–1 µm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,709,348Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cut the copper foil specimen by the size of 100 mm x 100 mm.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the drum-side is in the range of 1.1 to 2.5 km.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the deposited-side is in the range of 0.3 to 1.0 m.
The heat dissipating copper foil of claim 1, wherein a lightness value L* of the deposited-side based on the L*a*b* color system, is in the range of 20 to 40.
The heat dissipatin g copper foil of claim 1, wherein the copper foil having a grain size larger than 30 nm.
A composite heat dissipating structure comprising the copper foil according to claim 1 further comprising a layer of adhesive, and a pressure consolidated graphene layer, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
The composite heat dissipating structure comprising the copper foil according to claim 1, further comprising a pressure consolidated graphene layer in contact with both the drum- and deposited-sides of the copper foil.
An electronic device comprising the composite heat dissipating structure of claim 1.
(Withdrawn and Currently Amended) A method of forming a composite heat dissipating structure, the method comprising: providing an electrodeposited copper foil according to claim 1 having a drum-side and a deposited- side; the deposited side of the copper foil exhibiting a surface roughness (Rz) in the range of 0. 3 to 1. 0 pm; coating a slurry of graphene powder on the deposited-side of the copper foil; drying the slurry to form a layer of graphene in contact with the deposited-side of the copper foil; the layer of graphene having a first thickness; Attorney Docket No.: 085114-519144 reducing the thickness of the layer of graphene layer by consolidating the graphene layer in combination with the copper foil under pressure to form a reduced thickness of graphene in contact with the copper foil; and, recovering the composite heat dissipating structure.
Use an electronic balance to measure the weight of the copper foil specimen. Electronic balance must be capable of weighing accuracy to + 0.1 mg.
Transfer to area weight by g/m 2 unit. (2) Thickness
canceled
A composite heat dissipating structure, said structure comprising: an electrodeposited copper foil, said copper foil having an area weight in the range of 280 to 900 g/m 2 [[(g/m 2)]]; the electrodeposited copper foil comprising two surfaces, said surface comprising a drum-side and a deposited-side; the deposited-side of the copper foil having a surface roughness (Rz) in the range of 0.3 to 1.0 m; the copper foil exhibits a surface tension in the range of 44 to 68 dyne/cm; and, a graphene layer in combination said copper foil, the graphene layer being in contact with at least the one side of drum-side and deposited-side of the copper foil; [[and,]] wherein the graphene layer comprises a surface opposite the copper foil, said graphene layer surface having a lightness value L* in the range of 20 to 60, based on the L*a*b* color system.
The composite heat dissipating structure of claim 15, further comprising a graphene layer in contact with both the drum- and deposited-sides of the copper foil.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits the surface roughness (Rz) in the range of 1.1 to 2.5 pm.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits an MD gloss lower than 1 80 at a light incident angle of 60 0.
The composite heat dissipating structure of claim 15, further comprising a layer of adhesive, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
canceled
Layer stacks claimed or described, ordered top of device to substrate.
single-side graphene/copper foil composite heat dissipating structure
double-side graphene/copper foil composite heat dissipating structure
Materials described outside the worked examples.
electrodeposited copper foil
Cu
graphene layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
copper foil area weight (claimed range) | 280–900 g/m2 | Cu |
deposited-side surface roughness Rz (claimed range) | 0.3–1 µm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,709,348Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cut the copper foil specimen by the size of 100 mm x 100 mm.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the drum-side is in the range of 1.1 to 2.5 km.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the deposited-side is in the range of 0.3 to 1.0 m.
The heat dissipating copper foil of claim 1, wherein a lightness value L* of the deposited-side based on the L*a*b* color system, is in the range of 20 to 40.
The heat dissipatin g copper foil of claim 1, wherein the copper foil having a grain size larger than 30 nm.
A composite heat dissipating structure comprising the copper foil according to claim 1 further comprising a layer of adhesive, and a pressure consolidated graphene layer, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
The composite heat dissipating structure comprising the copper foil according to claim 1, further comprising a pressure consolidated graphene layer in contact with both the drum- and deposited-sides of the copper foil.
An electronic device comprising the composite heat dissipating structure of claim 1.
(Withdrawn and Currently Amended) A method of forming a composite heat dissipating structure, the method comprising: providing an electrodeposited copper foil according to claim 1 having a drum-side and a deposited- side; the deposited side of the copper foil exhibiting a surface roughness (Rz) in the range of 0. 3 to 1. 0 pm; coating a slurry of graphene powder on the deposited-side of the copper foil; drying the slurry to form a layer of graphene in contact with the deposited-side of the copper foil; the layer of graphene having a first thickness; Attorney Docket No.: 085114-519144 reducing the thickness of the layer of graphene layer by consolidating the graphene layer in combination with the copper foil under pressure to form a reduced thickness of graphene in contact with the copper foil; and, recovering the composite heat dissipating structure.
Use an electronic balance to measure the weight of the copper foil specimen. Electronic balance must be capable of weighing accuracy to + 0.1 mg.
Transfer to area weight by g/m 2 unit. (2) Thickness
canceled
A composite heat dissipating structure, said structure comprising: an electrodeposited copper foil, said copper foil having an area weight in the range of 280 to 900 g/m 2 [[(g/m 2)]]; the electrodeposited copper foil comprising two surfaces, said surface comprising a drum-side and a deposited-side; the deposited-side of the copper foil having a surface roughness (Rz) in the range of 0.3 to 1.0 m; the copper foil exhibits a surface tension in the range of 44 to 68 dyne/cm; and, a graphene layer in combination said copper foil, the graphene layer being in contact with at least the one side of drum-side and deposited-side of the copper foil; [[and,]] wherein the graphene layer comprises a surface opposite the copper foil, said graphene layer surface having a lightness value L* in the range of 20 to 60, based on the L*a*b* color system.
The composite heat dissipating structure of claim 15, further comprising a graphene layer in contact with both the drum- and deposited-sides of the copper foil.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits the surface roughness (Rz) in the range of 1.1 to 2.5 pm.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits an MD gloss lower than 1 80 at a light incident angle of 60 0.
The composite heat dissipating structure of claim 15, further comprising a layer of adhesive, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
canceled
Layer stacks claimed or described, ordered top of device to substrate.
single-side graphene/copper foil composite heat dissipating structure
double-side graphene/copper foil composite heat dissipating structure
Materials described outside the worked examples.
electrodeposited copper foil
Cu
graphene layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
copper foil area weight (claimed range) | 280–900 g/m2 | Cu |
deposited-side surface roughness Rz (claimed range) | 0.3–1 µm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,709,348Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
Cut the copper foil specimen by the size of 100 mm x 100 mm.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the drum-side is in the range of 1.1 to 2.5 km.
The heat dissipating copper foil of claim 1, wherein the surface roughness (Rz) of the deposited-side is in the range of 0.3 to 1.0 m.
The heat dissipating copper foil of claim 1, wherein a lightness value L* of the deposited-side based on the L*a*b* color system, is in the range of 20 to 40.
The heat dissipatin g copper foil of claim 1, wherein the copper foil having a grain size larger than 30 nm.
A composite heat dissipating structure comprising the copper foil according to claim 1 further comprising a layer of adhesive, and a pressure consolidated graphene layer, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
The composite heat dissipating structure comprising the copper foil according to claim 1, further comprising a pressure consolidated graphene layer in contact with both the drum- and deposited-sides of the copper foil.
An electronic device comprising the composite heat dissipating structure of claim 1.
(Withdrawn and Currently Amended) A method of forming a composite heat dissipating structure, the method comprising: providing an electrodeposited copper foil according to claim 1 having a drum-side and a deposited- side; the deposited side of the copper foil exhibiting a surface roughness (Rz) in the range of 0. 3 to 1. 0 pm; coating a slurry of graphene powder on the deposited-side of the copper foil; drying the slurry to form a layer of graphene in contact with the deposited-side of the copper foil; the layer of graphene having a first thickness; Attorney Docket No.: 085114-519144 reducing the thickness of the layer of graphene layer by consolidating the graphene layer in combination with the copper foil under pressure to form a reduced thickness of graphene in contact with the copper foil; and, recovering the composite heat dissipating structure.
Use an electronic balance to measure the weight of the copper foil specimen. Electronic balance must be capable of weighing accuracy to + 0.1 mg.
Transfer to area weight by g/m 2 unit. (2) Thickness
canceled
A composite heat dissipating structure, said structure comprising: an electrodeposited copper foil, said copper foil having an area weight in the range of 280 to 900 g/m 2 [[(g/m 2)]]; the electrodeposited copper foil comprising two surfaces, said surface comprising a drum-side and a deposited-side; the deposited-side of the copper foil having a surface roughness (Rz) in the range of 0.3 to 1.0 m; the copper foil exhibits a surface tension in the range of 44 to 68 dyne/cm; and, a graphene layer in combination said copper foil, the graphene layer being in contact with at least the one side of drum-side and deposited-side of the copper foil; [[and,]] wherein the graphene layer comprises a surface opposite the copper foil, said graphene layer surface having a lightness value L* in the range of 20 to 60, based on the L*a*b* color system.
The composite heat dissipating structure of claim 15, further comprising a graphene layer in contact with both the drum- and deposited-sides of the copper foil.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits the surface roughness (Rz) in the range of 1.1 to 2.5 pm.
The composite heat dissipating structure of claim 15, wherein the drum-side of the copper foil exhibits an MD gloss lower than 1 80 at a light incident angle of 60 0.
The composite heat dissipating structure of claim 15, further comprising a layer of adhesive, the layer of adhesive being on a surface of the graphene layer opposite the contact of the graphene layer with the copper foil or on a surface of the copper foil opposite the contact of the graphene layer with the copper foil.
canceled
Layer stacks claimed or described, ordered top of device to substrate.
single-side graphene/copper foil composite heat dissipating structure
double-side graphene/copper foil composite heat dissipating structure
Materials described outside the worked examples.
electrodeposited copper foil
Cu
graphene layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
copper foil area weight (claimed range) | 280–900 g/m2 | Cu |
deposited-side surface roughness Rz (claimed range) | 0.3–1 µm |
Related documents with shared materials, methods, properties, or citations.
composite heat dissipating structure with electrodeposited copper foil and graphene
adhesive layer
water-based adhesive binder
carbon black
C
drum-side surface roughness Rz (claimed range) | 1.1–2.5 µm | Cu |
copper foil surface tension (claimed range) | 44–68 dyne/cm | Cu |
deposited-side lightness L* (claimed range) | 20–40 | Cu |
deposited-side a* color value (claimed range) | 6–11 | Cu |
deposited-side b* color value (claimed range) | 3–8 | Cu |
copper foil grain size (claimed minimum) | ≥ 30 nm | Cu |
pressure consolidated graphene layer thickness (claimed range) | 3–50 µm | graphene layer |
graphene layer surface lightness L* opposite copper foil (claimed range) | 20–60 | graphene layer |
ED copper foil grain size range for good equilibration temperature (description) | 30–45 nm | Cu |
drum-side surface roughness Rz broadest range (description) | 0.5–2.5 µm | Cu |
copper content of foil (description) | ≥ 90 % | Cu |
composite heat dissipating structure with electrodeposited copper foil and graphene
adhesive layer
water-based adhesive binder
carbon black
C
drum-side surface roughness Rz (claimed range) | 1.1–2.5 µm | Cu |
copper foil surface tension (claimed range) | 44–68 dyne/cm | Cu |
deposited-side lightness L* (claimed range) | 20–40 | Cu |
deposited-side a* color value (claimed range) | 6–11 | Cu |
deposited-side b* color value (claimed range) | 3–8 | Cu |
copper foil grain size (claimed minimum) | ≥ 30 nm | Cu |
pressure consolidated graphene layer thickness (claimed range) | 3–50 µm | graphene layer |
graphene layer surface lightness L* opposite copper foil (claimed range) | 20–60 | graphene layer |
ED copper foil grain size range for good equilibration temperature (description) | 30–45 nm | Cu |
drum-side surface roughness Rz broadest range (description) | 0.5–2.5 µm | Cu |
copper content of foil (description) | ≥ 90 % | Cu |
composite heat dissipating structure with electrodeposited copper foil and graphene
adhesive layer
water-based adhesive binder
carbon black
C
drum-side surface roughness Rz (claimed range) | 1.1–2.5 µm | Cu |
copper foil surface tension (claimed range) | 44–68 dyne/cm | Cu |
deposited-side lightness L* (claimed range) | 20–40 | Cu |
deposited-side a* color value (claimed range) | 6–11 | Cu |
deposited-side b* color value (claimed range) | 3–8 | Cu |
copper foil grain size (claimed minimum) | ≥ 30 nm | Cu |
pressure consolidated graphene layer thickness (claimed range) | 3–50 µm | graphene layer |
graphene layer surface lightness L* opposite copper foil (claimed range) | 20–60 | graphene layer |
ED copper foil grain size range for good equilibration temperature (description) | 30–45 nm | Cu |
drum-side surface roughness Rz broadest range (description) | 0.5–2.5 µm | Cu |
copper content of foil (description) | ≥ 90 % | Cu |
composite heat dissipating structure with electrodeposited copper foil and graphene
adhesive layer
water-based adhesive binder
carbon black
C
drum-side surface roughness Rz (claimed range) | 1.1–2.5 µm | Cu |
copper foil surface tension (claimed range) | 44–68 dyne/cm | Cu |
deposited-side lightness L* (claimed range) | 20–40 | Cu |
deposited-side a* color value (claimed range) | 6–11 | Cu |
deposited-side b* color value (claimed range) | 3–8 | Cu |
copper foil grain size (claimed minimum) | ≥ 30 nm | Cu |
pressure consolidated graphene layer thickness (claimed range) | 3–50 µm | graphene layer |
graphene layer surface lightness L* opposite copper foil (claimed range) | 20–60 | graphene layer |
ED copper foil grain size range for good equilibration temperature (description) | 30–45 nm | Cu |
drum-side surface roughness Rz broadest range (description) | 0.5–2.5 µm | Cu |
copper content of foil (description) | ≥ 90 % | Cu |