Patent
US 9,863,039dimethyl disulfide
CH₃SSCH₃
ALD temperature window for MoS2 deposition using Mo(CO)6 and dimethyl disulfide | 100–120 °C | MoS₂ |
Thickness | 375–385 cm | — |
Thickness | 400–410 cm | — |
Pressure | 0.1–10 Torr | — |
Temperature | 400–1000 °C | — |
dimethyl disulfide
CH₃SSCH₃
ALD temperature window for MoS2 deposition using Mo(CO)6 and dimethyl disulfide | 100–120 °C | MoS₂ |
Thickness | 375–385 cm | — |
Thickness | 400–410 cm | — |
Pressure | 0.1–10 Torr | — |
Temperature | 400–1000 °C | — |
dimethyl disulfide
CH₃SSCH₃
ALD temperature window for MoS2 deposition using Mo(CO)6 and dimethyl disulfide | 100–120 °C | MoS₂ |
Thickness | 375–385 cm | — |
Thickness | 400–410 cm | — |
Pressure | 0.1–10 Torr | — |
Temperature | 400–1000 °C | — |
dimethyl disulfide
CH₃SSCH₃
ALD temperature window for MoS2 deposition using Mo(CO)6 and dimethyl disulfide | 100–120 °C | MoS₂ |
Thickness | 375–385 cm | — |
Thickness | 400–410 cm | — |
Pressure | 0.1–10 Torr | — |
Temperature | 400–1000 °C | — |