Patent
US 9,605,193Three-Dimensional Interconnected Porous Graphene-Based Thermal Interface Materials
Matthew Ming Fai YUEN
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,605,193Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface b etw een_ a heat sou r ce andaheatsink, the thermal interface material comprising: an interfac e with a with the heat source, the heat source transmitting heat to the thermal interface material; an interfac e with a with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D-I PG) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers betweentheinterface with the heatsource and the interface with the heat sink, comprising plural monolayers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a p ressr inensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance_ and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layer, and by capping small features up to nanoscale roughened surfaces. and wherein the high interfacial thermal conductance and high interface contact area establish a pressure insensitive thermal interfacial resistance.
The composite strctur eeml jntrtf nmtral of claim 1, further comprising: the interconnected graphene sheets produced by constructing the 3D- I PG films with graphene sheets having a thickness range of approximately 1 nm to approximately 10 nm.
The composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition (CVD) based templating formed from a sacrificial template.
Th e composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition onto porous Ni foam to produce graphene-supported Ni foam, with the Ni foam acting as a sacrificial template for graphene deposition, and the graphene-supported Ni foam treated with etchant to remove the Ni and leave free-standing porous graphene film, followed by transferring the graphene film onto a substrate acting as heat source or heat sink.
(withdrawn; currently amended) The composite structure _ thermainerface material of claim 1, further comprising: the graphene sheets produced from solution-grown 3D porous graphene oxide or reduced graphene oxides.
Th e ccmposit- structurc thermal interface material of claim 1, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e composite structure thermal interface material of claim 1, further comprising the 3D- I PG modified or filled by at least one of the group consisting of an additive or filler, said additive or filler enhancing at least one of thermal conductivity and mechanical strength.
(withdrawn; currently amended) A method of producing the composite structure thermal interface material of claim 1, the method comprising: providing a three-dimensional interconnected porous graphene (3D- I PG) foam structure constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers by chemical vapor deposition (CVD) from a sacrificial template, the graphene sheets having an interconnection architecture; and 4 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed placing the 3D- I PG porous foam structure at an interface between a heat source and a heat sink and applying pressure across the interface, wherein the 3D-I PG foam structure provides a flexible interconnection architectures, allowing the 3D- I PG to maintain a high interfacial thermal conductance by the 3D- I PG filling a gap between a heat source and a heat sink across the interface, thereby reducing thermal resistance between the mating surfaces and providing high thermal conductivity and a high surface interface contact area to 3D- I PG function as an effective heat dissipater, heat sink or heat convector.
App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface beweea1_ ha-s-----------tsink, the thermal interface material comprising: an interface with the heat source, the heat source transmitting heat to the thermal interface material; an interface with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D- IP G) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers.between ihe interface with the_ hetsource a1 the interface with the heat sink, comprising plural monola y ers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as 6 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a pressure insensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layet, and by capping small features up to nanoscale roughened surfaces; and wherein tihe hig interfacial thermal conductance and high tierfce contact area establish a pressure insensitive thermal interfacial resistance.
Th e composite structure thermal interface material of claim 17, wherein the reducing ther-a r e sistance between the matin g surfaces p rovides the hi g h-PInte; a l x + thema conduca-nd-A h 1 ac u.a, creating a pressure insensitive thermal interfacial resistance, in turn resulting results in the 3D- I PG functioning as an effective heat dissipater, heat sink or heat convector.
Th e composite structure thermal interface material of claim 17, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e c c m p osit c structur c thermal interface material of claim 17, further comprising the 3D- I PG modified or filled by at least one of the additive or filler enhancing at least one of thermal group consisting of an additive or filler, said conductivity and mechanical strength. 7
Layer stacks claimed or described, ordered top of device to substrate.
3D-IPG thermal interface material assembly
Materials described outside the worked examples.
three-dimensional interconnected porous graphene (3D-IPG) foam
porous Ni foam
Ni
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal interfacial resistance of 3D-IPG at Si-Al interface | ≤ 0.05 cm2 K W-1 | three-dimensional interconnected porous graphene (3D-IPG) foam |
nominal thermal conductivity of benchmark commercial thermal grease |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,605,193Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface b etw een_ a heat sou r ce andaheatsink, the thermal interface material comprising: an interfac e with a with the heat source, the heat source transmitting heat to the thermal interface material; an interfac e with a with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D-I PG) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers betweentheinterface with the heatsource and the interface with the heat sink, comprising plural monolayers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a p ressr inensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance_ and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layer, and by capping small features up to nanoscale roughened surfaces. and wherein the high interfacial thermal conductance and high interface contact area establish a pressure insensitive thermal interfacial resistance.
The composite strctur eeml jntrtf nmtral of claim 1, further comprising: the interconnected graphene sheets produced by constructing the 3D- I PG films with graphene sheets having a thickness range of approximately 1 nm to approximately 10 nm.
The composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition (CVD) based templating formed from a sacrificial template.
Th e composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition onto porous Ni foam to produce graphene-supported Ni foam, with the Ni foam acting as a sacrificial template for graphene deposition, and the graphene-supported Ni foam treated with etchant to remove the Ni and leave free-standing porous graphene film, followed by transferring the graphene film onto a substrate acting as heat source or heat sink.
(withdrawn; currently amended) The composite structure _ thermainerface material of claim 1, further comprising: the graphene sheets produced from solution-grown 3D porous graphene oxide or reduced graphene oxides.
Th e ccmposit- structurc thermal interface material of claim 1, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e composite structure thermal interface material of claim 1, further comprising the 3D- I PG modified or filled by at least one of the group consisting of an additive or filler, said additive or filler enhancing at least one of thermal conductivity and mechanical strength.
(withdrawn; currently amended) A method of producing the composite structure thermal interface material of claim 1, the method comprising: providing a three-dimensional interconnected porous graphene (3D- I PG) foam structure constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers by chemical vapor deposition (CVD) from a sacrificial template, the graphene sheets having an interconnection architecture; and 4 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed placing the 3D- I PG porous foam structure at an interface between a heat source and a heat sink and applying pressure across the interface, wherein the 3D-I PG foam structure provides a flexible interconnection architectures, allowing the 3D- I PG to maintain a high interfacial thermal conductance by the 3D- I PG filling a gap between a heat source and a heat sink across the interface, thereby reducing thermal resistance between the mating surfaces and providing high thermal conductivity and a high surface interface contact area to 3D- I PG function as an effective heat dissipater, heat sink or heat convector.
App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface beweea1_ ha-s-----------tsink, the thermal interface material comprising: an interface with the heat source, the heat source transmitting heat to the thermal interface material; an interface with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D- IP G) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers.between ihe interface with the_ hetsource a1 the interface with the heat sink, comprising plural monola y ers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as 6 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a pressure insensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layet, and by capping small features up to nanoscale roughened surfaces; and wherein tihe hig interfacial thermal conductance and high tierfce contact area establish a pressure insensitive thermal interfacial resistance.
Th e composite structure thermal interface material of claim 17, wherein the reducing ther-a r e sistance between the matin g surfaces p rovides the hi g h-PInte; a l x + thema conduca-nd-A h 1 ac u.a, creating a pressure insensitive thermal interfacial resistance, in turn resulting results in the 3D- I PG functioning as an effective heat dissipater, heat sink or heat convector.
Th e composite structure thermal interface material of claim 17, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e c c m p osit c structur c thermal interface material of claim 17, further comprising the 3D- I PG modified or filled by at least one of the additive or filler enhancing at least one of thermal group consisting of an additive or filler, said conductivity and mechanical strength. 7
Layer stacks claimed or described, ordered top of device to substrate.
3D-IPG thermal interface material assembly
Materials described outside the worked examples.
three-dimensional interconnected porous graphene (3D-IPG) foam
porous Ni foam
Ni
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal interfacial resistance of 3D-IPG at Si-Al interface | ≤ 0.05 cm2 K W-1 | three-dimensional interconnected porous graphene (3D-IPG) foam |
nominal thermal conductivity of benchmark commercial thermal grease |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,605,193Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface b etw een_ a heat sou r ce andaheatsink, the thermal interface material comprising: an interfac e with a with the heat source, the heat source transmitting heat to the thermal interface material; an interfac e with a with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D-I PG) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers betweentheinterface with the heatsource and the interface with the heat sink, comprising plural monolayers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a p ressr inensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance_ and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layer, and by capping small features up to nanoscale roughened surfaces. and wherein the high interfacial thermal conductance and high interface contact area establish a pressure insensitive thermal interfacial resistance.
The composite strctur eeml jntrtf nmtral of claim 1, further comprising: the interconnected graphene sheets produced by constructing the 3D- I PG films with graphene sheets having a thickness range of approximately 1 nm to approximately 10 nm.
The composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition (CVD) based templating formed from a sacrificial template.
Th e composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition onto porous Ni foam to produce graphene-supported Ni foam, with the Ni foam acting as a sacrificial template for graphene deposition, and the graphene-supported Ni foam treated with etchant to remove the Ni and leave free-standing porous graphene film, followed by transferring the graphene film onto a substrate acting as heat source or heat sink.
(withdrawn; currently amended) The composite structure _ thermainerface material of claim 1, further comprising: the graphene sheets produced from solution-grown 3D porous graphene oxide or reduced graphene oxides.
Th e ccmposit- structurc thermal interface material of claim 1, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e composite structure thermal interface material of claim 1, further comprising the 3D- I PG modified or filled by at least one of the group consisting of an additive or filler, said additive or filler enhancing at least one of thermal conductivity and mechanical strength.
(withdrawn; currently amended) A method of producing the composite structure thermal interface material of claim 1, the method comprising: providing a three-dimensional interconnected porous graphene (3D- I PG) foam structure constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers by chemical vapor deposition (CVD) from a sacrificial template, the graphene sheets having an interconnection architecture; and 4 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed placing the 3D- I PG porous foam structure at an interface between a heat source and a heat sink and applying pressure across the interface, wherein the 3D-I PG foam structure provides a flexible interconnection architectures, allowing the 3D- I PG to maintain a high interfacial thermal conductance by the 3D- I PG filling a gap between a heat source and a heat sink across the interface, thereby reducing thermal resistance between the mating surfaces and providing high thermal conductivity and a high surface interface contact area to 3D- I PG function as an effective heat dissipater, heat sink or heat convector.
App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface beweea1_ ha-s-----------tsink, the thermal interface material comprising: an interface with the heat source, the heat source transmitting heat to the thermal interface material; an interface with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D- IP G) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers.between ihe interface with the_ hetsource a1 the interface with the heat sink, comprising plural monola y ers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as 6 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a pressure insensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layet, and by capping small features up to nanoscale roughened surfaces; and wherein tihe hig interfacial thermal conductance and high tierfce contact area establish a pressure insensitive thermal interfacial resistance.
Th e composite structure thermal interface material of claim 17, wherein the reducing ther-a r e sistance between the matin g surfaces p rovides the hi g h-PInte; a l x + thema conduca-nd-A h 1 ac u.a, creating a pressure insensitive thermal interfacial resistance, in turn resulting results in the 3D- I PG functioning as an effective heat dissipater, heat sink or heat convector.
Th e composite structure thermal interface material of claim 17, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e c c m p osit c structur c thermal interface material of claim 17, further comprising the 3D- I PG modified or filled by at least one of the additive or filler enhancing at least one of thermal group consisting of an additive or filler, said conductivity and mechanical strength. 7
Layer stacks claimed or described, ordered top of device to substrate.
3D-IPG thermal interface material assembly
Materials described outside the worked examples.
three-dimensional interconnected porous graphene (3D-IPG) foam
porous Ni foam
Ni
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal interfacial resistance of 3D-IPG at Si-Al interface | ≤ 0.05 cm2 K W-1 | three-dimensional interconnected porous graphene (3D-IPG) foam |
nominal thermal conductivity of benchmark commercial thermal grease |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,605,193Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface b etw een_ a heat sou r ce andaheatsink, the thermal interface material comprising: an interfac e with a with the heat source, the heat source transmitting heat to the thermal interface material; an interfac e with a with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D-I PG) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers betweentheinterface with the heatsource and the interface with the heat sink, comprising plural monolayers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a p ressr inensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance_ and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layer, and by capping small features up to nanoscale roughened surfaces. and wherein the high interfacial thermal conductance and high interface contact area establish a pressure insensitive thermal interfacial resistance.
The composite strctur eeml jntrtf nmtral of claim 1, further comprising: the interconnected graphene sheets produced by constructing the 3D- I PG films with graphene sheets having a thickness range of approximately 1 nm to approximately 10 nm.
The composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition (CVD) based templating formed from a sacrificial template.
Th e composite structure thermal interface material of claim 1, further comprising: the graphene sheets produced from high-temperature chemical vapor deposition onto porous Ni foam to produce graphene-supported Ni foam, with the Ni foam acting as a sacrificial template for graphene deposition, and the graphene-supported Ni foam treated with etchant to remove the Ni and leave free-standing porous graphene film, followed by transferring the graphene film onto a substrate acting as heat source or heat sink.
(withdrawn; currently amended) The composite structure _ thermainerface material of claim 1, further comprising: the graphene sheets produced from solution-grown 3D porous graphene oxide or reduced graphene oxides.
Th e ccmposit- structurc thermal interface material of claim 1, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e composite structure thermal interface material of claim 1, further comprising the 3D- I PG modified or filled by at least one of the group consisting of an additive or filler, said additive or filler enhancing at least one of thermal conductivity and mechanical strength.
(withdrawn; currently amended) A method of producing the composite structure thermal interface material of claim 1, the method comprising: providing a three-dimensional interconnected porous graphene (3D- I PG) foam structure constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers by chemical vapor deposition (CVD) from a sacrificial template, the graphene sheets having an interconnection architecture; and 4 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed placing the 3D- I PG porous foam structure at an interface between a heat source and a heat sink and applying pressure across the interface, wherein the 3D-I PG foam structure provides a flexible interconnection architectures, allowing the 3D- I PG to maintain a high interfacial thermal conductance by the 3D- I PG filling a gap between a heat source and a heat sink across the interface, thereby reducing thermal resistance between the mating surfaces and providing high thermal conductivity and a high surface interface contact area to 3D- I PG function as an effective heat dissipater, heat sink or heat convector.
App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed
A composite structure comprising: a thermal interface material for increasing thermal conduction or thermal dissipation across an interface beweea1_ ha-s-----------tsink, the thermal interface material comprising: an interface with the heat source, the heat source transmitting heat to the thermal interface material; an interface with the heat sink, the heat sink accepting heat across the thermal interface material for dissipation from the thermal interface material to the heat sink; and a three-dimensional interconnected porous graphene (3D- IP G) foam structure constructed of three-dimensional interconnected porous graphene sheets formed as a plurality of layers.between ihe interface with the_ hetsource a1 the interface with the heat sink, comprising plural monola y ers or few layers, the graphene sheets having an flexible interconnection architecture, and arranged as 6 App l. No. 14/057,233 Attorney Docket No. 32828U Response, pursuant to and RCE, to Final Office Action mailed an interface layer to reduce thermal resistance between mating surfaces, under compressive pressure, as a pressure insensitive resistance interface when maintained under said compressive pressure, thereby providing high interfacial thermal conductance and a high interface contact area, wherein the flexible interconnection architectures allow the 3D- I PG to maintain a high interfacial thermal conductance or thermal dissipation by the 3D- I PG filling a gap between the heat source and the heat sink across the interface layet, and by capping small features up to nanoscale roughened surfaces; and wherein tihe hig interfacial thermal conductance and high tierfce contact area establish a pressure insensitive thermal interfacial resistance.
Th e composite structure thermal interface material of claim 17, wherein the reducing ther-a r e sistance between the matin g surfaces p rovides the hi g h-PInte; a l x + thema conduca-nd-A h 1 ac u.a, creating a pressure insensitive thermal interfacial resistance, in turn resulting results in the 3D- I PG functioning as an effective heat dissipater, heat sink or heat convector.
Th e composite structure thermal interface material of claim 17, further comprising: an encapsulant material applied to the 3D- I PG as a sealing material.
Th e c c m p osit c structur c thermal interface material of claim 17, further comprising the 3D- I PG modified or filled by at least one of the additive or filler enhancing at least one of thermal group consisting of an additive or filler, said conductivity and mechanical strength. 7
Layer stacks claimed or described, ordered top of device to substrate.
3D-IPG thermal interface material assembly
Materials described outside the worked examples.
three-dimensional interconnected porous graphene (3D-IPG) foam
porous Ni foam
Ni
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal interfacial resistance of 3D-IPG at Si-Al interface | ≤ 0.05 cm2 K W-1 | three-dimensional interconnected porous graphene (3D-IPG) foam |
nominal thermal conductivity of benchmark commercial thermal grease |
Related documents with shared materials, methods, properties, or citations.
3D porous graphene oxide
reduced graphene oxide
encapsulant/sealant material
commercial thermal grease
Ag-silicone paste
| 0.6 W m-1 K⁻¹ |
commercial thermal grease |
nominal thermal conductivity of benchmark Ag-silicone paste | 6.4 W m-1 K⁻¹ | Ag-silicone paste |
reported ultra-high thermal conductivity of graphene (literature value cited in background) | 4000 W m-1 K⁻¹ | — |
3D-IPG film graphene sheet thickness range (claimed) | 1–10 nm | three-dimensional interconnected porous graphene (3D-IPG) foam |
3D porous graphene oxide
reduced graphene oxide
encapsulant/sealant material
commercial thermal grease
Ag-silicone paste
| 0.6 W m-1 K⁻¹ |
commercial thermal grease |
nominal thermal conductivity of benchmark Ag-silicone paste | 6.4 W m-1 K⁻¹ | Ag-silicone paste |
reported ultra-high thermal conductivity of graphene (literature value cited in background) | 4000 W m-1 K⁻¹ | — |
3D-IPG film graphene sheet thickness range (claimed) | 1–10 nm | three-dimensional interconnected porous graphene (3D-IPG) foam |
3D porous graphene oxide
reduced graphene oxide
encapsulant/sealant material
commercial thermal grease
Ag-silicone paste
| 0.6 W m-1 K⁻¹ |
commercial thermal grease |
nominal thermal conductivity of benchmark Ag-silicone paste | 6.4 W m-1 K⁻¹ | Ag-silicone paste |
reported ultra-high thermal conductivity of graphene (literature value cited in background) | 4000 W m-1 K⁻¹ | — |
3D-IPG film graphene sheet thickness range (claimed) | 1–10 nm | three-dimensional interconnected porous graphene (3D-IPG) foam |
3D porous graphene oxide
reduced graphene oxide
encapsulant/sealant material
commercial thermal grease
Ag-silicone paste
| 0.6 W m-1 K⁻¹ |
commercial thermal grease |
nominal thermal conductivity of benchmark Ag-silicone paste | 6.4 W m-1 K⁻¹ | Ag-silicone paste |
reported ultra-high thermal conductivity of graphene (literature value cited in background) | 4000 W m-1 K⁻¹ | — |
3D-IPG film graphene sheet thickness range (claimed) | 1–10 nm | three-dimensional interconnected porous graphene (3D-IPG) foam |