Patent
US 10,903,319Title: PATTERNING GRAPHENE WITH A HARD MASK COATING
DENG PAN, BRETT GOLDSMITH
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 10,903,319Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH 4 831 17224.3 -- 5 -- 39 PS-228119 P A T E N T Docket 39PS-2281 19
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for patterning a graphene-based device in graphene, the method comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposingthe photoresist layer to a radiation source in accordance with a pattern, the pattern comprising etching areas and mask areas, wherein the mask areas are configured to protect masked portions of the graphene sheet from contamination during packaging process of the graphene-based device, and wherein the etching areas are configured to expose portions of the temporary protective metal layer, and the graphene sheet; etching away the etching areas of the temporary protective metal layer, and the graphene sheet; packaging the graphene-based device, wherein the packaging comprises epoxy curing, or encapsulating the graphene-based device; and after the packaging, removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. Previously presented
The method of claim 1, further comprising removing a masked portion of the photoresist layer as a process step that directly precedes a next process step, the next process step being the removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. SVG 15623279.09-01-2020.KEKNE₈HIRXEAPX4.CLM.1.svg 0.16 6.37 Black and white masked portions of the temporary protective metal layer comprises washing the masked portions of the temporary protective metal layer with a potassium iodide solution. Previously presented
The method of claim 1, wherein the removing the masked portions of the temporary protective metal layer comprises washing the temporary protective metal layer with a potassium iodide solution. Previously presented
2-5. Canceled
Canceled
The method of claim 7, further comprising removing a portion of the graphene sheet previously covered by the portion of the temporary protective metal layer. Previously presented
The method of claim 8, wherein the removing the portion of the graphene sheet comprises applying a plasma etching process to the portion of the graphene sheet. Original
Canceled
Canceled
13-20. Canceled
Canceled
A method for patterning graphene comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet, wherein the temporary protective metal layer protects a patterned graphene portion of the graphene sheet from contamination or harm during packaging and assembly of a graphene-based device comprising the patterned graphene portion; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheets at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain during the packaging and assembly to protect the patterned graphene portion of the graphene- based device; after the packaging and assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in a biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises [[:]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises protecting the patterned graphene portion from exposure to air or photoresist residue. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises using the temporary protective metal layer to provide thermal protection that protects the patterned graphene portion from exposure to high temperature treatments during one or more packaging and assembly processes,,. Currently amended
The method of claim 21, wherein the temporary protective metal layer is selected from gold, ruthenium, rhodium, palladium, silver, osmium, iridium, and platinum. Previously presented
The method of claim 21, wherein depositing the temporary protective metal layer is performed using one or more depositing techniques selected from coating techniques, focused ion beam, filament evaporation, sputter deposition, and electrolysis. Currently amended
The method of claim 21, wherein a process step of removing the portions of the photoresist layer within the mask areas directly precedes a next process step, the next process step being the removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
The method of claim 21, further comprising washing an exposed surface of the patterned graphene portion with deionized water after the packaging and the assembly of the graphene-based device to remove any materials left on the exposed surface of the patterned graphene portion. Previously presented
An apparatus comprising: a graphene-based device for a biosensor application comprising a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device, wherein the graphene-based device is manufactured according to the following process steps: placing a graphene sheet on a wafer; depositing the temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas of the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheet at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain to protect the patterned graphene portion of the graphene-based device; after the packaging and the assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in the biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises[[.]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, further comprising one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion, the one or more bottom electrodes comprising a platinum coating on the wafer. Previously presented
The apparatus of claim 30, wherein the graphene-based device is manufactured according to a further process step of removing the portions of the photoresist layer within the mask areas wherein the further process step directly precedes a next process step, the next process step being the process step of removing the portions of the temporary protective metal layer within mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based biosensor device
Materials described outside the worked examples.
graphene sheet
temporary protective metal layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 10–1000 nm | — |
Duration | 30–300 s |
Patent
Atlas literature
Patent
US 10,903,319Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH 4 831 17224.3 -- 5 -- 39 PS-228119 P A T E N T Docket 39PS-2281 19
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for patterning a graphene-based device in graphene, the method comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposingthe photoresist layer to a radiation source in accordance with a pattern, the pattern comprising etching areas and mask areas, wherein the mask areas are configured to protect masked portions of the graphene sheet from contamination during packaging process of the graphene-based device, and wherein the etching areas are configured to expose portions of the temporary protective metal layer, and the graphene sheet; etching away the etching areas of the temporary protective metal layer, and the graphene sheet; packaging the graphene-based device, wherein the packaging comprises epoxy curing, or encapsulating the graphene-based device; and after the packaging, removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. Previously presented
The method of claim 1, further comprising removing a masked portion of the photoresist layer as a process step that directly precedes a next process step, the next process step being the removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. SVG 15623279.09-01-2020.KEKNE₈HIRXEAPX4.CLM.1.svg 0.16 6.37 Black and white masked portions of the temporary protective metal layer comprises washing the masked portions of the temporary protective metal layer with a potassium iodide solution. Previously presented
The method of claim 1, wherein the removing the masked portions of the temporary protective metal layer comprises washing the temporary protective metal layer with a potassium iodide solution. Previously presented
2-5. Canceled
Canceled
The method of claim 7, further comprising removing a portion of the graphene sheet previously covered by the portion of the temporary protective metal layer. Previously presented
The method of claim 8, wherein the removing the portion of the graphene sheet comprises applying a plasma etching process to the portion of the graphene sheet. Original
Canceled
Canceled
13-20. Canceled
Canceled
A method for patterning graphene comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet, wherein the temporary protective metal layer protects a patterned graphene portion of the graphene sheet from contamination or harm during packaging and assembly of a graphene-based device comprising the patterned graphene portion; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheets at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain during the packaging and assembly to protect the patterned graphene portion of the graphene- based device; after the packaging and assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in a biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises [[:]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises protecting the patterned graphene portion from exposure to air or photoresist residue. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises using the temporary protective metal layer to provide thermal protection that protects the patterned graphene portion from exposure to high temperature treatments during one or more packaging and assembly processes,,. Currently amended
The method of claim 21, wherein the temporary protective metal layer is selected from gold, ruthenium, rhodium, palladium, silver, osmium, iridium, and platinum. Previously presented
The method of claim 21, wherein depositing the temporary protective metal layer is performed using one or more depositing techniques selected from coating techniques, focused ion beam, filament evaporation, sputter deposition, and electrolysis. Currently amended
The method of claim 21, wherein a process step of removing the portions of the photoresist layer within the mask areas directly precedes a next process step, the next process step being the removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
The method of claim 21, further comprising washing an exposed surface of the patterned graphene portion with deionized water after the packaging and the assembly of the graphene-based device to remove any materials left on the exposed surface of the patterned graphene portion. Previously presented
An apparatus comprising: a graphene-based device for a biosensor application comprising a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device, wherein the graphene-based device is manufactured according to the following process steps: placing a graphene sheet on a wafer; depositing the temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas of the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheet at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain to protect the patterned graphene portion of the graphene-based device; after the packaging and the assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in the biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises[[.]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, further comprising one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion, the one or more bottom electrodes comprising a platinum coating on the wafer. Previously presented
The apparatus of claim 30, wherein the graphene-based device is manufactured according to a further process step of removing the portions of the photoresist layer within the mask areas wherein the further process step directly precedes a next process step, the next process step being the process step of removing the portions of the temporary protective metal layer within mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based biosensor device
Materials described outside the worked examples.
graphene sheet
temporary protective metal layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 10–1000 nm | — |
Duration | 30–300 s |
Patent
Atlas literature
Patent
US 10,903,319Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH 4 831 17224.3 -- 5 -- 39 PS-228119 P A T E N T Docket 39PS-2281 19
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for patterning a graphene-based device in graphene, the method comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposingthe photoresist layer to a radiation source in accordance with a pattern, the pattern comprising etching areas and mask areas, wherein the mask areas are configured to protect masked portions of the graphene sheet from contamination during packaging process of the graphene-based device, and wherein the etching areas are configured to expose portions of the temporary protective metal layer, and the graphene sheet; etching away the etching areas of the temporary protective metal layer, and the graphene sheet; packaging the graphene-based device, wherein the packaging comprises epoxy curing, or encapsulating the graphene-based device; and after the packaging, removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. Previously presented
The method of claim 1, further comprising removing a masked portion of the photoresist layer as a process step that directly precedes a next process step, the next process step being the removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. SVG 15623279.09-01-2020.KEKNE₈HIRXEAPX4.CLM.1.svg 0.16 6.37 Black and white masked portions of the temporary protective metal layer comprises washing the masked portions of the temporary protective metal layer with a potassium iodide solution. Previously presented
The method of claim 1, wherein the removing the masked portions of the temporary protective metal layer comprises washing the temporary protective metal layer with a potassium iodide solution. Previously presented
2-5. Canceled
Canceled
The method of claim 7, further comprising removing a portion of the graphene sheet previously covered by the portion of the temporary protective metal layer. Previously presented
The method of claim 8, wherein the removing the portion of the graphene sheet comprises applying a plasma etching process to the portion of the graphene sheet. Original
Canceled
Canceled
13-20. Canceled
Canceled
A method for patterning graphene comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet, wherein the temporary protective metal layer protects a patterned graphene portion of the graphene sheet from contamination or harm during packaging and assembly of a graphene-based device comprising the patterned graphene portion; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheets at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain during the packaging and assembly to protect the patterned graphene portion of the graphene- based device; after the packaging and assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in a biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises [[:]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises protecting the patterned graphene portion from exposure to air or photoresist residue. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises using the temporary protective metal layer to provide thermal protection that protects the patterned graphene portion from exposure to high temperature treatments during one or more packaging and assembly processes,,. Currently amended
The method of claim 21, wherein the temporary protective metal layer is selected from gold, ruthenium, rhodium, palladium, silver, osmium, iridium, and platinum. Previously presented
The method of claim 21, wherein depositing the temporary protective metal layer is performed using one or more depositing techniques selected from coating techniques, focused ion beam, filament evaporation, sputter deposition, and electrolysis. Currently amended
The method of claim 21, wherein a process step of removing the portions of the photoresist layer within the mask areas directly precedes a next process step, the next process step being the removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
The method of claim 21, further comprising washing an exposed surface of the patterned graphene portion with deionized water after the packaging and the assembly of the graphene-based device to remove any materials left on the exposed surface of the patterned graphene portion. Previously presented
An apparatus comprising: a graphene-based device for a biosensor application comprising a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device, wherein the graphene-based device is manufactured according to the following process steps: placing a graphene sheet on a wafer; depositing the temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas of the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheet at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain to protect the patterned graphene portion of the graphene-based device; after the packaging and the assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in the biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises[[.]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, further comprising one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion, the one or more bottom electrodes comprising a platinum coating on the wafer. Previously presented
The apparatus of claim 30, wherein the graphene-based device is manufactured according to a further process step of removing the portions of the photoresist layer within the mask areas wherein the further process step directly precedes a next process step, the next process step being the process step of removing the portions of the temporary protective metal layer within mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based biosensor device
Materials described outside the worked examples.
graphene sheet
temporary protective metal layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 10–1000 nm | — |
Duration | 30–300 s |
Patent
Atlas literature
Patent
US 10,903,319Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 illustrates the different progressions of depositing a temporary protective layer onto a surface of a graphene sheet according to one embodiment.
Figure 1 A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 1 B illustrates a graphene sheet with a temporary metal layer according to one embodiment.
Figure 1 C illustrates a graphene sheet with a temporary metal layer removed from a surface of the graphene sheet according to one embodiment.
Figure 2 illustrates the different progressions of patterning a graphene sheet with a hard mask layer according to one embodiment.
Figure 2A illustrates a graphene sheet transferred onto a substrate according to one embodiment.
Figure 2B illustrates a graphene sheet with a metal layer according to one embodiment.
Figure 2C illustrates a graphene sheet with a metal layer and a photoresist layer for lithographic patterning according to one embodiment. SMRH 4 831 17224.3 -- 5 -- 39 PS-228119 P A T E N T Docket 39PS-2281 19
Figure 2D illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a radiation source to create a pattern template according to one embodiment.
Figure 2E illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a metal etchant solution to pattern the metal layer according to one embodiment.
Figure 2F illustrates a graphene sheet with a metal layer and a photoresist layer exposed to a plasma etchant solution to pattern the graphene sheet according to one embodiment.
Figure 2G illustrates a patterned graphene sheet with a metal layer according to one embodiment.
Figure 2H illustrates a patterned graphene sheet according to one embodiment [0022] The figures are not intended to be exhaustive or to limit the invention to the precise form disclosed. It should be understood that the invention can be practiced with modification and alteration, and that the …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for patterning a graphene-based device in graphene, the method comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposingthe photoresist layer to a radiation source in accordance with a pattern, the pattern comprising etching areas and mask areas, wherein the mask areas are configured to protect masked portions of the graphene sheet from contamination during packaging process of the graphene-based device, and wherein the etching areas are configured to expose portions of the temporary protective metal layer, and the graphene sheet; etching away the etching areas of the temporary protective metal layer, and the graphene sheet; packaging the graphene-based device, wherein the packaging comprises epoxy curing, or encapsulating the graphene-based device; and after the packaging, removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. Previously presented
The method of claim 1, further comprising removing a masked portion of the photoresist layer as a process step that directly precedes a next process step, the next process step being the removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. SVG 15623279.09-01-2020.KEKNE₈HIRXEAPX4.CLM.1.svg 0.16 6.37 Black and white masked portions of the temporary protective metal layer comprises washing the masked portions of the temporary protective metal layer with a potassium iodide solution. Previously presented
The method of claim 1, wherein the removing the masked portions of the temporary protective metal layer comprises washing the temporary protective metal layer with a potassium iodide solution. Previously presented
2-5. Canceled
Canceled
The method of claim 7, further comprising removing a portion of the graphene sheet previously covered by the portion of the temporary protective metal layer. Previously presented
The method of claim 8, wherein the removing the portion of the graphene sheet comprises applying a plasma etching process to the portion of the graphene sheet. Original
Canceled
Canceled
13-20. Canceled
Canceled
A method for patterning graphene comprising: placing a graphene sheet on a wafer; depositing a temporary protective metal layer on the graphene sheet, wherein the temporary protective metal layer protects a patterned graphene portion of the graphene sheet from contamination or harm during packaging and assembly of a graphene-based device comprising the patterned graphene portion; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheets at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain during the packaging and assembly to protect the patterned graphene portion of the graphene- based device; after the packaging and assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in a biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises [[:]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises protecting the patterned graphene portion from exposure to air or photoresist residue. Currently amended
The method of claim 21, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises using the temporary protective metal layer to provide thermal protection that protects the patterned graphene portion from exposure to high temperature treatments during one or more packaging and assembly processes,,. Currently amended
The method of claim 21, wherein the temporary protective metal layer is selected from gold, ruthenium, rhodium, palladium, silver, osmium, iridium, and platinum. Previously presented
The method of claim 21, wherein depositing the temporary protective metal layer is performed using one or more depositing techniques selected from coating techniques, focused ion beam, filament evaporation, sputter deposition, and electrolysis. Currently amended
The method of claim 21, wherein a process step of removing the portions of the photoresist layer within the mask areas directly precedes a next process step, the next process step being the removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The method of claim 21, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
The method of claim 21, further comprising washing an exposed surface of the patterned graphene portion with deionized water after the packaging and the assembly of the graphene-based device to remove any materials left on the exposed surface of the patterned graphene portion. Previously presented
An apparatus comprising: a graphene-based device for a biosensor application comprising a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device, wherein the graphene-based device is manufactured according to the following process steps: placing a graphene sheet on a wafer; depositing the temporary protective metal layer on the graphene sheet; depositing a photoresist layer on the temporary protective metal layer; exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas; etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas of the pattern; etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern; patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheet at areas within the etching areas of the pattern; packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain to protect the patterned graphene portion of the graphene-based device; after the packaging and the assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in the biosensor application, wherein exposing the mask areas of the patterned graphene portion comprises[[.]] removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, further comprising one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion, the one or more bottom electrodes comprising a platinum coating on the wafer. Previously presented
The apparatus of claim 30, wherein the graphene-based device is manufactured according to a further process step of removing the portions of the photoresist layer within the mask areas wherein the further process step directly precedes a next process step, the next process step being the process step of removing the portions of the temporary protective metal layer within mask areas that protected the patterned graphene portion during the packaging and assembly. Currently amended
The apparatus of claim 30, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. Previously presented
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based biosensor device
Materials described outside the worked examples.
graphene sheet
temporary protective metal layer
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 10–1000 nm | — |
Duration | 30–300 s |
potassium iodide solution
KI
gold
Au
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
platinum
Pt
acetone
C₃H₆O
isopropanol alcohol
C₃H₈O
methyl isopropyl ketone
silicon substrate or silicon dioxide substrate (wafer)
deionized water
| — |
Duration | 1–5 minutes | — |
potassium iodide solution
KI
gold
Au
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
platinum
Pt
acetone
C₃H₆O
isopropanol alcohol
C₃H₈O
methyl isopropyl ketone
silicon substrate or silicon dioxide substrate (wafer)
deionized water
| — |
Duration | 1–5 minutes | — |
potassium iodide solution
KI
gold
Au
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
platinum
Pt
acetone
C₃H₆O
isopropanol alcohol
C₃H₈O
methyl isopropyl ketone
silicon substrate or silicon dioxide substrate (wafer)
deionized water
| — |
Duration | 1–5 minutes | — |
potassium iodide solution
KI
gold
Au
ruthenium
Ru
rhodium
Rh
palladium
Pd
silver
Ag
osmium
Os
iridium
Ir
platinum
Pt
acetone
C₃H₆O
isopropanol alcohol
C₃H₈O
methyl isopropyl ketone
silicon substrate or silicon dioxide substrate (wafer)
deionized water
| — |
Duration | 1–5 minutes | — |