Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Dual-gated hBN/BLG superlattice device with hBN-encapsulated bilayer graphene, graphite back gate, and Au/Ti top-gate/contact metallization fabricated by dry transfer and subsequent lithography/etching.
3 preparations1 characterization3 figures
ExperimentalCStudied MaterialBNSubstrate / DielectricCReference MaterialSiO₂Substrate / DielectricSiSubstrate / DielectricAuCapping Or ContactTiCapping Or Contact
Why these are connected
Related documents with shared materials, methods, properties, or citations.
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Dual-gated hBN/BLG superlattice device with hBN-encapsulated bilayer graphene, graphite back gate, and Au/Ti top-gate/contact metallization fabricated by dry transfer and subsequent lithography/etching.
3 preparations1 characterization3 figures
ExperimentalCStudied MaterialBNSubstrate / DielectricCReference MaterialSiO₂Substrate / DielectricSiSubstrate / DielectricAuCapping Or ContactTiCapping Or Contact
Why these are connected
Related documents with shared materials, methods, properties, or citations.
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Dual-gated hBN/BLG superlattice device with hBN-encapsulated bilayer graphene, graphite back gate, and Au/Ti top-gate/contact metallization fabricated by dry transfer and subsequent lithography/etching.
3 preparations1 characterization3 figures
ExperimentalCStudied MaterialBNSubstrate / DielectricCReference MaterialSiO₂Substrate / DielectricSiSubstrate / DielectricAuCapping Or ContactTiCapping Or Contact
Why these are connected
Related documents with shared materials, methods, properties, or citations.
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Dual-gated hBN/BLG superlattice device with hBN-encapsulated bilayer graphene, graphite back gate, and Au/Ti top-gate/contact metallization fabricated by dry transfer and subsequent lithography/etching.
3 preparations1 characterization3 figures
ExperimentalCStudied MaterialBNSubstrate / DielectricCReference MaterialSiO₂Substrate / DielectricSiSubstrate / DielectricAuCapping Or ContactTiCapping Or Contact
Why these are connected
Related documents with shared materials, methods, properties, or citations.