Abstract

The focal plane assembly of wavefront camera is the key imaging device of wavefront detection camera and the key load of the exoplanet imaging coronagraph module. In order to ensure the imaging quality and reduce the dark current and thermal noise, it is necessary to effectively dissipate the heat of the focal plane CCD and other high-power electronic devices to ensure the working performance and reliability of the focal plane assembly. Based on the limited space and cooling resources, this paper adopts the flexible graphene heat conducting cable and grooved heat pipes, and carries out detailed thermal design and thermal analysis of its cooling path. The finite element model is established by thermal analysis software and thermal simulation is carried out. In steady state, the work temperature range of the CCD chip is -12.8~-10.9 ℃, which meets the temperature control index, and the work temperatures of other components are also within the design requirements, indicating that the thermal design scheme is reasonable and feasible, and meets the task requirements.

Abstract

The focal plane assembly of wavefront camera is the key imaging device of wavefront detection camera and the key load of the exoplanet imaging coronagraph module. In order to ensure the imaging quality and reduce the dark current and thermal noise, it is necessary to effectively dissipate the heat of the focal plane CCD and other high-power electronic devices to ensure the working performance and reliability of the focal plane assembly. Based on the limited space and cooling resources, this paper adopts the flexible graphene heat conducting cable and grooved heat pipes, and carries out detailed thermal design and thermal analysis of its cooling path. The finite element model is established by thermal analysis software and thermal simulation is carried out. In steady state, the work temperature range of the CCD chip is -12.8~-10.9 ℃, which meets the temperature control index, and the work temperatures of other components are also within the design requirements, indicating that the thermal design scheme is reasonable and feasible, and meets the task requirements.

Abstract

The focal plane assembly of wavefront camera is the key imaging device of wavefront detection camera and the key load of the exoplanet imaging coronagraph module. In order to ensure the imaging quality and reduce the dark current and thermal noise, it is necessary to effectively dissipate the heat of the focal plane CCD and other high-power electronic devices to ensure the working performance and reliability of the focal plane assembly. Based on the limited space and cooling resources, this paper adopts the flexible graphene heat conducting cable and grooved heat pipes, and carries out detailed thermal design and thermal analysis of its cooling path. The finite element model is established by thermal analysis software and thermal simulation is carried out. In steady state, the work temperature range of the CCD chip is -12.8~-10.9 ℃, which meets the temperature control index, and the work temperatures of other components are also within the design requirements, indicating that the thermal design scheme is reasonable and feasible, and meets the task requirements.

Abstract

The focal plane assembly of wavefront camera is the key imaging device of wavefront detection camera and the key load of the exoplanet imaging coronagraph module. In order to ensure the imaging quality and reduce the dark current and thermal noise, it is necessary to effectively dissipate the heat of the focal plane CCD and other high-power electronic devices to ensure the working performance and reliability of the focal plane assembly. Based on the limited space and cooling resources, this paper adopts the flexible graphene heat conducting cable and grooved heat pipes, and carries out detailed thermal design and thermal analysis of its cooling path. The finite element model is established by thermal analysis software and thermal simulation is carried out. In steady state, the work temperature range of the CCD chip is -12.8~-10.9 ℃, which meets the temperature control index, and the work temperatures of other components are also within the design requirements, indicating that the thermal design scheme is reasonable and feasible, and meets the task requirements.