Patent
US 9,725,625Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG.1 shows a flow chart of manufacturing method for a conductive adhesive to the invention. DETAILED DISCRIPTION OF THE MEBODIMENTS Reference will now be made …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and use using the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer microsphere micro ball after pre-treatment from step 2 to grow graphene on the outside surfaces of or inside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; step 5: dispersing the spherical graphene from step 3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa r ming the pre-material of conductive adhesive of spherical graphene, and then obtain the conductive adhesive withef spherical graphene; wherein the plasma etching pre-treatment in step 2 is to obtain an active polymer microsphere by etching the polymer microsphere with inductively coupled plasma in sulfur hexafluoride and dioxygen, at 80-150"C for 2min-lh.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one selected from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is Page 9 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein an amount o f ratio for the monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount o f ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount o f ratio for the dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount o f ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein the method of the heating pre-treatment in from the step 2 is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein step of the chemical vapor deposition in from the step 3 is dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere ball b y via heating the polymer microsphere micro ball pretreated fro m in step 2 after pre-treatment by with at least one way following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat induction heating.
A method for producing conductive adhesive with spherical graphene according to claim 1, wherein in step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E 5 1, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPO N₈₂₆ or bisphenol A epoxy resins EP O N828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~Swt%.
A manufacturing method for producing graphene sphere conductive adhesive according to claim 1, wherein in the step 5, a mass ratio for the epoxy gel system to the spherical graphene is 100: 2~30.
(Withdrawn-Currently amended) A conductive adhesive comprises spherical graphene and an epoxy gel system, wherein mass ratio for the epoxy system to the spherical graphene is 100: 2 ~ 30; the epoxy gel system is comprising epoxy, hardener and accelerant; the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EP O N₈₂₆ or bisphenol A epoxy resins EP O N828; a ratio for the epoxy to the epoxy gel system is 80wt% ' 95wt%; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; an amount o f ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine;an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%. Page 13 of 15 REMARKS/ARGUMENTS In response to the restriction requirement set forth in the Office Action mailed, A complete listing of all of the claims is presented herewith. Where, claims 1-4 and 6-10
Particularly, the original claim terms "monomer compound" is amended to "monomer mixture", while "polymer micro ball" is amended to "polymer microsphere", for introducing more commonly used terms for one having ordinary skill in the art. Besides, the claim term "deforming" is amended to "defoaming" for correcting typographical error. Some claim descriptions are also amended for a better interpretation. All the amendments to claim 1 can be supported by the corresponding PCT application (PCT/CN₂₀₁₄/084332) of the present application, no new matters are introduced in this response. Furthermore, the Applicant also amends claim 1 by merging the technical feature recited in the original claim 5 after reviewed the cited references provided by the Examiner. canceled
canceled
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and using use the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer micro ball after pre-treatment from step 2 to grow graphene inside or outside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system is-made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; Page 11 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 step 5: dispersing the spherical graphene from step3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa rrm ing the pre-material of conductive adhesive withef spherical graphene, and then obtain the conductive adhesive withef spherical graphene;, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol; wherein an amount of ratio for t he monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount of ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount of ratio for t he dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount of ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%, wherein in the step 2, the method of the heating pre-treatment is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h;- wherein in the step 2, the method of the plasma etching pre-treatment is to obtain an active polymer microsphere micro balls by etching the polymer microsphere micro balls with inductively coupled plasma in- sulfur hexafluoride and dioxygen, at 80-150"C for 2min~ lh;- wherein in the step 3, steps of the chemical vapor deposition are dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere balls by via heating the polymer microsphere micro ball pretreated from-in step 2 after pre-treatment by with at least one way listed as following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat Page 12 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 induction heating; wherein a volume ratio for the methane to the mixture gas is 1 %~ 10%; a volume ratio for the hydrogen to the mixture gas is 50%'99%; the other auxiliary gas is comprising at least one selected from vapor, nitrogen, or argon; wherein in the step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPON₈₂₆ or bisphenol A epoxy resins EPON828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%; Wherein in the step 5, a mass ratio for the epoxy system to the spherical graphene is 100: 2~30.
Layer stacks claimed or described, ordered top of device to substrate.
conductive adhesive with spherical graphene
Materials described outside the worked examples.
spherical graphene
epoxy gel system
epoxy
hardener
accelerant
conductive adhesive with spherical graphene
acrylic acid
C₃H₄O₂
phenylethene
C₈H₈
methyl methacrylate
C₅H₈O₂
divinylbenzene
C₁₀H₁₀
azobisisobutyronitrile
C₈H₁₂N₄
benzoyl peroxide
C₁₄H₁₀O₄
polyvinylpyrrolidone
polyethylene glycol
polyglycolic acid
polyacrylic acid
water
H₂O
ethanol
C₂H₅OH
methanol
CH₃OH
methane
CH₄
hydrogen
H₂
nitrogen
N₂
argon
Ar
bisphenol A epoxy resins E₄₄
bisphenol A epoxy resins E₅₁
bisphenol A epoxy resins E₅₄
bisphenol A epoxy resins EPON₈₂₆
bisphenol A epoxy resins EPON₈₂₈
hexahydrophthalic anhydride
tetrahydrophthalic anhydride
succinic dihydrazide
adipic acid dihydrazide
dicyandiamide
C₂H₄N₄
phenylenediamine
C₆H₈N₂
2-ethyl-4-methylimidazole
imidazole
C₃H₄N₂
2-methylimidazole
triethylamine
C₆H₁₅N
polymer microsphere
sulfur hexafluoride
SF₆
dioxygen
O₂
isopropanol
C₃H₈O
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
GRAPHENE HYBRID STRUCTURES FOR ENERGY STORAGE APPLICATIONS
GRAPHENE NANO RIBBONS AND METHODS OF PREPARING THE SAME
Method of transferring a graphene film
APPARATUS AND METHOD OF MANUFACTURING GRAPHENE FILM
METHOD FOR MANUFACTURING GRAPHENE NANO ARRAY AND FIELD-EFFECT TRANSISTOR INCLUDING THE SAME
Method for Preparing a Silicon Dioxide Substrate-Based Graphene Transparent Conductive Film
LIGHT EMITTING DIODE CHIP WITH PROTECTIVE LAYER OF METAL CATALYST AND FLUORINATED GRAPHENE AND PREPARATION METHOD THEREOF
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG.1 shows a flow chart of manufacturing method for a conductive adhesive to the invention. DETAILED DISCRIPTION OF THE MEBODIMENTS Reference will now be made …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and use using the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer microsphere micro ball after pre-treatment from step 2 to grow graphene on the outside surfaces of or inside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; step 5: dispersing the spherical graphene from step 3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa r ming the pre-material of conductive adhesive of spherical graphene, and then obtain the conductive adhesive withef spherical graphene; wherein the plasma etching pre-treatment in step 2 is to obtain an active polymer microsphere by etching the polymer microsphere with inductively coupled plasma in sulfur hexafluoride and dioxygen, at 80-150"C for 2min-lh.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one selected from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is Page 9 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein an amount o f ratio for the monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount o f ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount o f ratio for the dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount o f ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein the method of the heating pre-treatment in from the step 2 is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein step of the chemical vapor deposition in from the step 3 is dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere ball b y via heating the polymer microsphere micro ball pretreated fro m in step 2 after pre-treatment by with at least one way following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat induction heating.
A method for producing conductive adhesive with spherical graphene according to claim 1, wherein in step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E 5 1, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPO N₈₂₆ or bisphenol A epoxy resins EP O N828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~Swt%.
A manufacturing method for producing graphene sphere conductive adhesive according to claim 1, wherein in the step 5, a mass ratio for the epoxy gel system to the spherical graphene is 100: 2~30.
(Withdrawn-Currently amended) A conductive adhesive comprises spherical graphene and an epoxy gel system, wherein mass ratio for the epoxy system to the spherical graphene is 100: 2 ~ 30; the epoxy gel system is comprising epoxy, hardener and accelerant; the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EP O N₈₂₆ or bisphenol A epoxy resins EP O N828; a ratio for the epoxy to the epoxy gel system is 80wt% ' 95wt%; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; an amount o f ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine;an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%. Page 13 of 15 REMARKS/ARGUMENTS In response to the restriction requirement set forth in the Office Action mailed, A complete listing of all of the claims is presented herewith. Where, claims 1-4 and 6-10
Particularly, the original claim terms "monomer compound" is amended to "monomer mixture", while "polymer micro ball" is amended to "polymer microsphere", for introducing more commonly used terms for one having ordinary skill in the art. Besides, the claim term "deforming" is amended to "defoaming" for correcting typographical error. Some claim descriptions are also amended for a better interpretation. All the amendments to claim 1 can be supported by the corresponding PCT application (PCT/CN₂₀₁₄/084332) of the present application, no new matters are introduced in this response. Furthermore, the Applicant also amends claim 1 by merging the technical feature recited in the original claim 5 after reviewed the cited references provided by the Examiner. canceled
canceled
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and using use the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer micro ball after pre-treatment from step 2 to grow graphene inside or outside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system is-made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; Page 11 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 step 5: dispersing the spherical graphene from step3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa rrm ing the pre-material of conductive adhesive withef spherical graphene, and then obtain the conductive adhesive withef spherical graphene;, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol; wherein an amount of ratio for t he monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount of ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount of ratio for t he dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount of ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%, wherein in the step 2, the method of the heating pre-treatment is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h;- wherein in the step 2, the method of the plasma etching pre-treatment is to obtain an active polymer microsphere micro balls by etching the polymer microsphere micro balls with inductively coupled plasma in- sulfur hexafluoride and dioxygen, at 80-150"C for 2min~ lh;- wherein in the step 3, steps of the chemical vapor deposition are dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere balls by via heating the polymer microsphere micro ball pretreated from-in step 2 after pre-treatment by with at least one way listed as following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat Page 12 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 induction heating; wherein a volume ratio for the methane to the mixture gas is 1 %~ 10%; a volume ratio for the hydrogen to the mixture gas is 50%'99%; the other auxiliary gas is comprising at least one selected from vapor, nitrogen, or argon; wherein in the step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPON₈₂₆ or bisphenol A epoxy resins EPON828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%; Wherein in the step 5, a mass ratio for the epoxy system to the spherical graphene is 100: 2~30.
Layer stacks claimed or described, ordered top of device to substrate.
conductive adhesive with spherical graphene
Materials described outside the worked examples.
spherical graphene
epoxy gel system
epoxy
hardener
accelerant
conductive adhesive with spherical graphene
acrylic acid
C₃H₄O₂
phenylethene
C₈H₈
methyl methacrylate
C₅H₈O₂
divinylbenzene
C₁₀H₁₀
azobisisobutyronitrile
C₈H₁₂N₄
benzoyl peroxide
C₁₄H₁₀O₄
polyvinylpyrrolidone
polyethylene glycol
polyglycolic acid
polyacrylic acid
water
H₂O
ethanol
C₂H₅OH
methanol
CH₃OH
methane
CH₄
hydrogen
H₂
nitrogen
N₂
argon
Ar
bisphenol A epoxy resins E₄₄
bisphenol A epoxy resins E₅₁
bisphenol A epoxy resins E₅₄
bisphenol A epoxy resins EPON₈₂₆
bisphenol A epoxy resins EPON₈₂₈
hexahydrophthalic anhydride
tetrahydrophthalic anhydride
succinic dihydrazide
adipic acid dihydrazide
dicyandiamide
C₂H₄N₄
phenylenediamine
C₆H₈N₂
2-ethyl-4-methylimidazole
imidazole
C₃H₄N₂
2-methylimidazole
triethylamine
C₆H₁₅N
polymer microsphere
sulfur hexafluoride
SF₆
dioxygen
O₂
isopropanol
C₃H₈O
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
GRAPHENE HYBRID STRUCTURES FOR ENERGY STORAGE APPLICATIONS
GRAPHENE NANO RIBBONS AND METHODS OF PREPARING THE SAME
Method of transferring a graphene film
APPARATUS AND METHOD OF MANUFACTURING GRAPHENE FILM
METHOD FOR MANUFACTURING GRAPHENE NANO ARRAY AND FIELD-EFFECT TRANSISTOR INCLUDING THE SAME
Method for Preparing a Silicon Dioxide Substrate-Based Graphene Transparent Conductive Film
LIGHT EMITTING DIODE CHIP WITH PROTECTIVE LAYER OF METAL CATALYST AND FLUORINATED GRAPHENE AND PREPARATION METHOD THEREOF
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG.1 shows a flow chart of manufacturing method for a conductive adhesive to the invention. DETAILED DISCRIPTION OF THE MEBODIMENTS Reference will now be made …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and use using the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer microsphere micro ball after pre-treatment from step 2 to grow graphene on the outside surfaces of or inside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; step 5: dispersing the spherical graphene from step 3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa r ming the pre-material of conductive adhesive of spherical graphene, and then obtain the conductive adhesive withef spherical graphene; wherein the plasma etching pre-treatment in step 2 is to obtain an active polymer microsphere by etching the polymer microsphere with inductively coupled plasma in sulfur hexafluoride and dioxygen, at 80-150"C for 2min-lh.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one selected from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is Page 9 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein an amount o f ratio for the monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount o f ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount o f ratio for the dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount o f ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein the method of the heating pre-treatment in from the step 2 is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein step of the chemical vapor deposition in from the step 3 is dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere ball b y via heating the polymer microsphere micro ball pretreated fro m in step 2 after pre-treatment by with at least one way following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat induction heating.
A method for producing conductive adhesive with spherical graphene according to claim 1, wherein in step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E 5 1, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPO N₈₂₆ or bisphenol A epoxy resins EP O N828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~Swt%.
A manufacturing method for producing graphene sphere conductive adhesive according to claim 1, wherein in the step 5, a mass ratio for the epoxy gel system to the spherical graphene is 100: 2~30.
(Withdrawn-Currently amended) A conductive adhesive comprises spherical graphene and an epoxy gel system, wherein mass ratio for the epoxy system to the spherical graphene is 100: 2 ~ 30; the epoxy gel system is comprising epoxy, hardener and accelerant; the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EP O N₈₂₆ or bisphenol A epoxy resins EP O N828; a ratio for the epoxy to the epoxy gel system is 80wt% ' 95wt%; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; an amount o f ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine;an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%. Page 13 of 15 REMARKS/ARGUMENTS In response to the restriction requirement set forth in the Office Action mailed, A complete listing of all of the claims is presented herewith. Where, claims 1-4 and 6-10
Particularly, the original claim terms "monomer compound" is amended to "monomer mixture", while "polymer micro ball" is amended to "polymer microsphere", for introducing more commonly used terms for one having ordinary skill in the art. Besides, the claim term "deforming" is amended to "defoaming" for correcting typographical error. Some claim descriptions are also amended for a better interpretation. All the amendments to claim 1 can be supported by the corresponding PCT application (PCT/CN₂₀₁₄/084332) of the present application, no new matters are introduced in this response. Furthermore, the Applicant also amends claim 1 by merging the technical feature recited in the original claim 5 after reviewed the cited references provided by the Examiner. canceled
canceled
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and using use the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer micro ball after pre-treatment from step 2 to grow graphene inside or outside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system is-made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; Page 11 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 step 5: dispersing the spherical graphene from step3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa rrm ing the pre-material of conductive adhesive withef spherical graphene, and then obtain the conductive adhesive withef spherical graphene;, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol; wherein an amount of ratio for t he monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount of ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount of ratio for t he dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount of ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%, wherein in the step 2, the method of the heating pre-treatment is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h;- wherein in the step 2, the method of the plasma etching pre-treatment is to obtain an active polymer microsphere micro balls by etching the polymer microsphere micro balls with inductively coupled plasma in- sulfur hexafluoride and dioxygen, at 80-150"C for 2min~ lh;- wherein in the step 3, steps of the chemical vapor deposition are dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere balls by via heating the polymer microsphere micro ball pretreated from-in step 2 after pre-treatment by with at least one way listed as following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat Page 12 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 induction heating; wherein a volume ratio for the methane to the mixture gas is 1 %~ 10%; a volume ratio for the hydrogen to the mixture gas is 50%'99%; the other auxiliary gas is comprising at least one selected from vapor, nitrogen, or argon; wherein in the step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPON₈₂₆ or bisphenol A epoxy resins EPON828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%; Wherein in the step 5, a mass ratio for the epoxy system to the spherical graphene is 100: 2~30.
Layer stacks claimed or described, ordered top of device to substrate.
conductive adhesive with spherical graphene
Materials described outside the worked examples.
spherical graphene
epoxy gel system
epoxy
hardener
accelerant
conductive adhesive with spherical graphene
acrylic acid
C₃H₄O₂
phenylethene
C₈H₈
methyl methacrylate
C₅H₈O₂
divinylbenzene
C₁₀H₁₀
azobisisobutyronitrile
C₈H₁₂N₄
benzoyl peroxide
C₁₄H₁₀O₄
polyvinylpyrrolidone
polyethylene glycol
polyglycolic acid
polyacrylic acid
water
H₂O
ethanol
C₂H₅OH
methanol
CH₃OH
methane
CH₄
hydrogen
H₂
nitrogen
N₂
argon
Ar
bisphenol A epoxy resins E₄₄
bisphenol A epoxy resins E₅₁
bisphenol A epoxy resins E₅₄
bisphenol A epoxy resins EPON₈₂₆
bisphenol A epoxy resins EPON₈₂₈
hexahydrophthalic anhydride
tetrahydrophthalic anhydride
succinic dihydrazide
adipic acid dihydrazide
dicyandiamide
C₂H₄N₄
phenylenediamine
C₆H₈N₂
2-ethyl-4-methylimidazole
imidazole
C₃H₄N₂
2-methylimidazole
triethylamine
C₆H₁₅N
polymer microsphere
sulfur hexafluoride
SF₆
dioxygen
O₂
isopropanol
C₃H₈O
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
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GRAPHENE NANO RIBBONS AND METHODS OF PREPARING THE SAME
Method of transferring a graphene film
APPARATUS AND METHOD OF MANUFACTURING GRAPHENE FILM
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LIGHT EMITTING DIODE CHIP WITH PROTECTIVE LAYER OF METAL CATALYST AND FLUORINATED GRAPHENE AND PREPARATION METHOD THEREOF
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG.1 shows a flow chart of manufacturing method for a conductive adhesive to the invention. DETAILED DISCRIPTION OF THE MEBODIMENTS Reference will now be made …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and use using the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer microsphere micro ball after pre-treatment from step 2 to grow graphene on the outside surfaces of or inside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; step 5: dispersing the spherical graphene from step 3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa r ming the pre-material of conductive adhesive of spherical graphene, and then obtain the conductive adhesive withef spherical graphene; wherein the plasma etching pre-treatment in step 2 is to obtain an active polymer microsphere by etching the polymer microsphere with inductively coupled plasma in sulfur hexafluoride and dioxygen, at 80-150"C for 2min-lh.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one selected from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is Page 9 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein an amount o f ratio for the monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount o f ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount o f ratio for the dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount o f ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein the method of the heating pre-treatment in from the step 2 is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h.
A manufacturing method for producing conductive adhesive with spherical graphene according to claim 1, wherein step of the chemical vapor deposition in from the step 3 is dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere ball b y via heating the polymer microsphere micro ball pretreated fro m in step 2 after pre-treatment by with at least one way following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat induction heating.
A method for producing conductive adhesive with spherical graphene according to claim 1, wherein in step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E 5 1, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPO N₈₂₆ or bisphenol A epoxy resins EP O N828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~Swt%.
A manufacturing method for producing graphene sphere conductive adhesive according to claim 1, wherein in the step 5, a mass ratio for the epoxy gel system to the spherical graphene is 100: 2~30.
(Withdrawn-Currently amended) A conductive adhesive comprises spherical graphene and an epoxy gel system, wherein mass ratio for the epoxy system to the spherical graphene is 100: 2 ~ 30; the epoxy gel system is comprising epoxy, hardener and accelerant; the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EP O N₈₂₆ or bisphenol A epoxy resins EP O N828; a ratio for the epoxy to the epoxy gel system is 80wt% ' 95wt%; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; an amount o f ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine;an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%. Page 13 of 15 REMARKS/ARGUMENTS In response to the restriction requirement set forth in the Office Action mailed, A complete listing of all of the claims is presented herewith. Where, claims 1-4 and 6-10
Particularly, the original claim terms "monomer compound" is amended to "monomer mixture", while "polymer micro ball" is amended to "polymer microsphere", for introducing more commonly used terms for one having ordinary skill in the art. Besides, the claim term "deforming" is amended to "defoaming" for correcting typographical error. Some claim descriptions are also amended for a better interpretation. All the amendments to claim 1 can be supported by the corresponding PCT application (PCT/CN₂₀₁₄/084332) of the present application, no new matters are introduced in this response. Furthermore, the Applicant also amends claim 1 by merging the technical feature recited in the original claim 5 after reviewed the cited references provided by the Examiner. canceled
canceled
A manufacturing method for producing conductive adhesive with spherical graphene, comprising: step 1: preparing a monomer, an initiator, a dispersing agent and a solvent to manufacture a monomer mixture compound, and using use the monomer mixture compound to produce a polymer microsphere micro ball; step 2: heating pre-treatment or plasma etching pretreatment to the said polymer microsphere micro ball; step3: by chemical vapor deposition, the polymer micro ball after pre-treatment from step 2 to grow graphene inside or outside the polymer microsphere micro ball, and then obtain the spherical graphene; step 4: producing an epoxy gel system is-made by epoxy, hardener and accelerant with a certain ratio mixing homogeneously; Page 11 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 step 5: dispersing the spherical graphene from step3 into the epoxy gel system to produce a pre-material of conductive adhesive withef spherical graphene; and Step 6: defoa rrm ing the pre-material of conductive adhesive withef spherical graphene, and then obtain the conductive adhesive withef spherical graphene;, wherein in the step 1, the monomer is acrylic acid, phenylethene, methyl methacrylate or divinylbenzene; the initiator is comprising at least one from azobisisobutyronitrile or benzoyl peroxide; the dispersing agent is polyvinylpyrrolidone, polyethylene glycol, polyglycolic acid or polyacrylic acid; the solvent is comprising water and a composition mixed at least one selected from ethanol, methanol or isopropanol; wherein an amount of ratio for t he monomer to the monomer mixture polymer is between 8wt%'42wt%; an amount of ratio for the initiator to the monomer mixture polymer is between 0.1 1wt%~5.2wt%; an amount of ratio for t he dispersing agent to the monomer mixture polymer is between 4.9wt%'21wt%; an amount of ratio for the solvent to the monomer mixture polymer is between 3wt%'56wt%, wherein in the step 2, the method of the heating pre-treatment is to obtain a porous polymer microsphere micro balls by dispersing the polymer microsphere micro balls into inert atmosphere at 100-500"C for 0.5-5h;- wherein in the step 2, the method of the plasma etching pre-treatment is to obtain an active polymer microsphere micro balls by etching the polymer microsphere micro balls with inductively coupled plasma in- sulfur hexafluoride and dioxygen, at 80-150"C for 2min~ lh;- wherein in the step 3, steps of the chemical vapor deposition are dispersing the pretreated polymer microsphere micro balls after pre-treatment from the step 2 into a sealed space of chemical vapor deposition; next, inserting a mixture gas of methane, hydrogen and other auxiliary gas inside the sealed space after vacuuming; and then growing graphene on the outside surfaces of or inside the polymer microsphere balls by via heating the polymer microsphere micro ball pretreated from-in step 2 after pre-treatment by with at least one way listed as following: infrared ray, thermal radiation, laser, micro-wave, plasma body, ultraviolet ray or heat Page 12 of 15 Application No.: 14/398,978 Attorney Docket No.: CD₁₄₁₂₀ Reply to Office Action dated Dec. 0 5, 2016 induction heating; wherein a volume ratio for the methane to the mixture gas is 1 %~ 10%; a volume ratio for the hydrogen to the mixture gas is 50%'99%; the other auxiliary gas is comprising at least one selected from vapor, nitrogen, or argon; wherein in the step 4, the epoxy is bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPON₈₂₆ or bisphenol A epoxy resins EPON828; the hardener is hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide or phenylenediamine; the accelerant is 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole or triethylamine; an amount o f ratio for the epoxy to the epoxy gel system is 80wt%'95wt%; an amount of ratio for the hardener to the epoxy gel system is lwt%~ 12wt%; and an amount o f ratio for the accelerant to the epoxy gel system is 0.3wt%~5wt%; Wherein in the step 5, a mass ratio for the epoxy system to the spherical graphene is 100: 2~30.
Layer stacks claimed or described, ordered top of device to substrate.
conductive adhesive with spherical graphene
Materials described outside the worked examples.
spherical graphene
epoxy gel system
epoxy
hardener
accelerant
conductive adhesive with spherical graphene
acrylic acid
C₃H₄O₂
phenylethene
C₈H₈
methyl methacrylate
C₅H₈O₂
divinylbenzene
C₁₀H₁₀
azobisisobutyronitrile
C₈H₁₂N₄
benzoyl peroxide
C₁₄H₁₀O₄
polyvinylpyrrolidone
polyethylene glycol
polyglycolic acid
polyacrylic acid
water
H₂O
ethanol
C₂H₅OH
methanol
CH₃OH
methane
CH₄
hydrogen
H₂
nitrogen
N₂
argon
Ar
bisphenol A epoxy resins E₄₄
bisphenol A epoxy resins E₅₁
bisphenol A epoxy resins E₅₄
bisphenol A epoxy resins EPON₈₂₆
bisphenol A epoxy resins EPON₈₂₈
hexahydrophthalic anhydride
tetrahydrophthalic anhydride
succinic dihydrazide
adipic acid dihydrazide
dicyandiamide
C₂H₄N₄
phenylenediamine
C₆H₈N₂
2-ethyl-4-methylimidazole
imidazole
C₃H₄N₂
2-methylimidazole
triethylamine
C₆H₁₅N
polymer microsphere
sulfur hexafluoride
SF₆
dioxygen
O₂
isopropanol
C₃H₈O
Additional fabrication and treatment steps described in the patent.
Related documents with shared materials, methods, properties, or citations.
GRAPHENE HYBRID STRUCTURES FOR ENERGY STORAGE APPLICATIONS
GRAPHENE NANO RIBBONS AND METHODS OF PREPARING THE SAME
Method of transferring a graphene film
APPARATUS AND METHOD OF MANUFACTURING GRAPHENE FILM
METHOD FOR MANUFACTURING GRAPHENE NANO ARRAY AND FIELD-EFFECT TRANSISTOR INCLUDING THE SAME
Method for Preparing a Silicon Dioxide Substrate-Based Graphene Transparent Conductive Film
LIGHT EMITTING DIODE CHIP WITH PROTECTIVE LAYER OF METAL CATALYST AND FLUORINATED GRAPHENE AND PREPARATION METHOD THEREOF