Patent
US 9,640,650dual-heterojunction AlGaN/GaN HEMT in RF power amplifier system
AlGaN/GaN HEMT with n+ AlGaN doped sublayer (described embodiment)
first germanium-doped AlGaN sublayer (Al~15%, Ge>=5e19 cm⁻³, ~10 angstroms)
AlGaN:Ge
germanium dopant
Ge
TRANSISTOR WITH MULTIPLE GAN-BASED ALLOY LAYERS
dual-heterojunction AlGaN/GaN HEMT in RF power amplifier system
AlGaN/GaN HEMT with n+ AlGaN doped sublayer (described embodiment)
first germanium-doped AlGaN sublayer (Al~15%, Ge>=5e19 cm⁻³, ~10 angstroms)
AlGaN:Ge
germanium dopant
Ge
TRANSISTOR WITH MULTIPLE GAN-BASED ALLOY LAYERS
dual-heterojunction AlGaN/GaN HEMT in RF power amplifier system
AlGaN/GaN HEMT with n+ AlGaN doped sublayer (described embodiment)
first germanium-doped AlGaN sublayer (Al~15%, Ge>=5e19 cm⁻³, ~10 angstroms)
AlGaN:Ge
germanium dopant
Ge
TRANSISTOR WITH MULTIPLE GAN-BASED ALLOY LAYERS
dual-heterojunction AlGaN/GaN HEMT in RF power amplifier system
AlGaN/GaN HEMT with n+ AlGaN doped sublayer (described embodiment)
first germanium-doped AlGaN sublayer (Al~15%, Ge>=5e19 cm⁻³, ~10 angstroms)
AlGaN:Ge
germanium dopant
Ge