Patent
US 11,021,371thermal management device
binder resin
graphitic material
solid polymer carrier material
high carbon-yield polymer
low carbon-yield polymer
specific surface area of hollow graphene balls | 50–3000 m2/g | graphene sheets |
Temperature | 1500–2500 °C | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Temperature | 300–1500 °C | — |
Duration | 0.5–5 hours | — |
Thickness | 0.2–2 mm | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
thermal management device
binder resin
graphitic material
solid polymer carrier material
high carbon-yield polymer
low carbon-yield polymer
specific surface area of hollow graphene balls | 50–3000 m2/g | graphene sheets |
Temperature | 1500–2500 °C | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Temperature | 300–1500 °C | — |
Duration | 0.5–5 hours | — |
Thickness | 0.2–2 mm | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
thermal management device
binder resin
graphitic material
solid polymer carrier material
high carbon-yield polymer
low carbon-yield polymer
specific surface area of hollow graphene balls | 50–3000 m2/g | graphene sheets |
Temperature | 1500–2500 °C | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Temperature | 300–1500 °C | — |
Duration | 0.5–5 hours | — |
Thickness | 0.2–2 mm | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |
thermal management device
binder resin
graphitic material
solid polymer carrier material
high carbon-yield polymer
low carbon-yield polymer
specific surface area of hollow graphene balls | 50–3000 m2/g | graphene sheets |
Temperature | 1500–2500 °C | — |
Thickness | 0.3354–0.4 nm | — |
Thickness | 2–50 nm | — |
Thickness | 0.3345–0.4 nm | — |
Duration | 0.5–5 minutes | — |
— | 250–500 W | — |
Temperature | 300–2500 °C | — |
Temperature | 300–1500 °C | — |
Duration | 0.5–5 hours | — |
Thickness | 0.2–2 mm | — |
Duration | 10–120 minutes | — |
Duration | 2–48 hours | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 20 nm | — |
Thickness | ≥ 1 nm | — |
— | ≥ 200 W | — |
Thickness | 10–10000000 nm | — |
Thickness | 100–1000000 nm | — |
Temperature | 200–2500 °C | — |
Temperature | 2500–3200 °C | — |