Patent
US 8,952,258IMPLEMENTING GRAPHENE INTERCONNECT FOR HIGH CONDUCTIVITY APPLICATIONS
Mark D. Plucinski
US
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Patent
Atlas literature
Patent
US 8,952,258Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a perspective view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment; and 3 RO C₉₂₀₁₂₀₁₅₇US₁ [0015]
FIG. 2 is a cross- sectional side view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A structure for implementing enhanced interconnects for high conductivity applications comprising: an interconnect structure comp ri sing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and a winded graphene ribbon being carried around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical curr ent carrying capability and increased thermal conductivity.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a generally S-shape.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a controlled cross-section geometry defining a predefined area for receiving said winded graphene ribbon.
The structure as recited in claim 1 wherein said electrically conductive interconnect member is formed of beryllium copper.
The structure as recited in claim 1 wherein said winded graphene ribbon comprises graphene nano-ribbons.
The structure as recited in claim 1 wherein said winded graphene ribbon extends around the predefined shape of the electrically conductive interconnect member including the spaced apart end portions. 9 RO C₉₂₀₁₂₀₁₅₇US₁
The structure as recited in claim 1 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating.
The structure as recited in claim 1 wherein said winded graphene ribbon is provided in predefined areas of said electrically conductive interconnect member.
The structure as recited in claim 1 wherein said predefined areas of said electrically conductive interconnect member include predefined areas of said electrically conductive interconnect member having reduced cross-section.
A method for implementing enhanced interconnects for high conductivity applications comprising: providing an interconnect structure comprising providing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and winding a graphene ribbon around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical current ca rr ying capability and increased thermal conductivity.
The method as recited in claim 12 includes providing a generally S-shape for said predefined shape of said electrically conductive interconnect member.
The method as recited in claim 12 includes providing said predefined shape of said electrically conductive interconnect member with a controlled cross- section geometry defining a predefined area for receiving said winded graphene ribbon. 10 RO C₉₂₀₁₂₀₁₅₇US₁
The method as recited in claim 12 includes forming said electrically conductive interconnect member of beryllium copper.
The method as recited in claim 12 wherein winding said graphene ribbon around said electrically conductive interconnect member includes winding said graphene ribbon spaced apart around the entire predefined shape of the electrically conductive interconnect member including the spaced apart end portions.
The method as recited in claim 12 includes providing predefined areas of said electrically conductive interconnect member for receiving said winded graphene ribbon.
The method as recited in claim 12 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating. 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene interconnect structure
graphene interconnect structure with controlled cross-section geometry (FIG. 2)
Materials described outside the worked examples.
winded graphene ribbon
electrically conductive interconnect member
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical current carrying capability increase (graphene interconnect vs. conventional) | 10 x (fold) | winded graphene ribbonelectrically conductive interconnect member |
Joule heating reduction (graphene interconnect vs. conventional) |
Patent
Atlas literature
Patent
US 8,952,258Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a perspective view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment; and 3 RO C₉₂₀₁₂₀₁₅₇US₁ [0015]
FIG. 2 is a cross- sectional side view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A structure for implementing enhanced interconnects for high conductivity applications comprising: an interconnect structure comp ri sing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and a winded graphene ribbon being carried around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical curr ent carrying capability and increased thermal conductivity.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a generally S-shape.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a controlled cross-section geometry defining a predefined area for receiving said winded graphene ribbon.
The structure as recited in claim 1 wherein said electrically conductive interconnect member is formed of beryllium copper.
The structure as recited in claim 1 wherein said winded graphene ribbon comprises graphene nano-ribbons.
The structure as recited in claim 1 wherein said winded graphene ribbon extends around the predefined shape of the electrically conductive interconnect member including the spaced apart end portions. 9 RO C₉₂₀₁₂₀₁₅₇US₁
The structure as recited in claim 1 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating.
The structure as recited in claim 1 wherein said winded graphene ribbon is provided in predefined areas of said electrically conductive interconnect member.
The structure as recited in claim 1 wherein said predefined areas of said electrically conductive interconnect member include predefined areas of said electrically conductive interconnect member having reduced cross-section.
A method for implementing enhanced interconnects for high conductivity applications comprising: providing an interconnect structure comprising providing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and winding a graphene ribbon around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical current ca rr ying capability and increased thermal conductivity.
The method as recited in claim 12 includes providing a generally S-shape for said predefined shape of said electrically conductive interconnect member.
The method as recited in claim 12 includes providing said predefined shape of said electrically conductive interconnect member with a controlled cross- section geometry defining a predefined area for receiving said winded graphene ribbon. 10 RO C₉₂₀₁₂₀₁₅₇US₁
The method as recited in claim 12 includes forming said electrically conductive interconnect member of beryllium copper.
The method as recited in claim 12 wherein winding said graphene ribbon around said electrically conductive interconnect member includes winding said graphene ribbon spaced apart around the entire predefined shape of the electrically conductive interconnect member including the spaced apart end portions.
The method as recited in claim 12 includes providing predefined areas of said electrically conductive interconnect member for receiving said winded graphene ribbon.
The method as recited in claim 12 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating. 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene interconnect structure
graphene interconnect structure with controlled cross-section geometry (FIG. 2)
Materials described outside the worked examples.
winded graphene ribbon
electrically conductive interconnect member
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical current carrying capability increase (graphene interconnect vs. conventional) | 10 x (fold) | winded graphene ribbonelectrically conductive interconnect member |
Joule heating reduction (graphene interconnect vs. conventional) |
Patent
Atlas literature
Patent
US 8,952,258Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a perspective view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment; and 3 RO C₉₂₀₁₂₀₁₅₇US₁ [0015]
FIG. 2 is a cross- sectional side view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A structure for implementing enhanced interconnects for high conductivity applications comprising: an interconnect structure comp ri sing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and a winded graphene ribbon being carried around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical curr ent carrying capability and increased thermal conductivity.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a generally S-shape.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a controlled cross-section geometry defining a predefined area for receiving said winded graphene ribbon.
The structure as recited in claim 1 wherein said electrically conductive interconnect member is formed of beryllium copper.
The structure as recited in claim 1 wherein said winded graphene ribbon comprises graphene nano-ribbons.
The structure as recited in claim 1 wherein said winded graphene ribbon extends around the predefined shape of the electrically conductive interconnect member including the spaced apart end portions. 9 RO C₉₂₀₁₂₀₁₅₇US₁
The structure as recited in claim 1 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating.
The structure as recited in claim 1 wherein said winded graphene ribbon is provided in predefined areas of said electrically conductive interconnect member.
The structure as recited in claim 1 wherein said predefined areas of said electrically conductive interconnect member include predefined areas of said electrically conductive interconnect member having reduced cross-section.
A method for implementing enhanced interconnects for high conductivity applications comprising: providing an interconnect structure comprising providing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and winding a graphene ribbon around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical current ca rr ying capability and increased thermal conductivity.
The method as recited in claim 12 includes providing a generally S-shape for said predefined shape of said electrically conductive interconnect member.
The method as recited in claim 12 includes providing said predefined shape of said electrically conductive interconnect member with a controlled cross- section geometry defining a predefined area for receiving said winded graphene ribbon. 10 RO C₉₂₀₁₂₀₁₅₇US₁
The method as recited in claim 12 includes forming said electrically conductive interconnect member of beryllium copper.
The method as recited in claim 12 wherein winding said graphene ribbon around said electrically conductive interconnect member includes winding said graphene ribbon spaced apart around the entire predefined shape of the electrically conductive interconnect member including the spaced apart end portions.
The method as recited in claim 12 includes providing predefined areas of said electrically conductive interconnect member for receiving said winded graphene ribbon.
The method as recited in claim 12 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating. 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene interconnect structure
graphene interconnect structure with controlled cross-section geometry (FIG. 2)
Materials described outside the worked examples.
winded graphene ribbon
electrically conductive interconnect member
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical current carrying capability increase (graphene interconnect vs. conventional) | 10 x (fold) | winded graphene ribbonelectrically conductive interconnect member |
Joule heating reduction (graphene interconnect vs. conventional) |
Patent
Atlas literature
Patent
US 8,952,258Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a perspective view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment; and 3 RO C₉₂₀₁₂₀₁₅₇US₁ [0015]
FIG. 2 is a cross- sectional side view not to scale of an example graphene interconnect structure in accordance with a preferred embodiment.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A structure for implementing enhanced interconnects for high conductivity applications comprising: an interconnect structure comp ri sing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and a winded graphene ribbon being carried around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical curr ent carrying capability and increased thermal conductivity.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a generally S-shape.
The structure as recited in claim 1 wherein said predefined shape of said electrically conductive interconnect member includes a controlled cross-section geometry defining a predefined area for receiving said winded graphene ribbon.
The structure as recited in claim 1 wherein said electrically conductive interconnect member is formed of beryllium copper.
The structure as recited in claim 1 wherein said winded graphene ribbon comprises graphene nano-ribbons.
The structure as recited in claim 1 wherein said winded graphene ribbon extends around the predefined shape of the electrically conductive interconnect member including the spaced apart end portions. 9 RO C₉₂₀₁₂₀₁₅₇US₁
The structure as recited in claim 1 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating.
The structure as recited in claim 1 wherein said winded graphene ribbon is provided in predefined areas of said electrically conductive interconnect member.
The structure as recited in claim 1 wherein said predefined areas of said electrically conductive interconnect member include predefined areas of said electrically conductive interconnect member having reduced cross-section.
A method for implementing enhanced interconnects for high conductivity applications comprising: providing an interconnect structure comprising providing an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane; and winding a graphene ribbon around said electrically conductive interconnect member, said winded graphene ribbon providing increased electrical current ca rr ying capability and increased thermal conductivity.
The method as recited in claim 12 includes providing a generally S-shape for said predefined shape of said electrically conductive interconnect member.
The method as recited in claim 12 includes providing said predefined shape of said electrically conductive interconnect member with a controlled cross- section geometry defining a predefined area for receiving said winded graphene ribbon. 10 RO C₉₂₀₁₂₀₁₅₇US₁
The method as recited in claim 12 includes forming said electrically conductive interconnect member of beryllium copper.
The method as recited in claim 12 wherein winding said graphene ribbon around said electrically conductive interconnect member includes winding said graphene ribbon spaced apart around the entire predefined shape of the electrically conductive interconnect member including the spaced apart end portions.
The method as recited in claim 12 includes providing predefined areas of said electrically conductive interconnect member for receiving said winded graphene ribbon.
The method as recited in claim 12 wherein said winded graphene ribbon enables substantially increased electrical current ca rr ying capability without substantially increasing Joule heating. 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene interconnect structure
graphene interconnect structure with controlled cross-section geometry (FIG. 2)
Materials described outside the worked examples.
winded graphene ribbon
electrically conductive interconnect member
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
electrical current carrying capability increase (graphene interconnect vs. conventional) | 10 x (fold) | winded graphene ribbonelectrically conductive interconnect member |
Joule heating reduction (graphene interconnect vs. conventional) |
beryllium copper
graphene nano-ribbons
iron nickel
Fe/Ni
| 3 x decrease |
winded graphene ribbonelectrically conductive interconnect member |
beryllium copper
graphene nano-ribbons
iron nickel
Fe/Ni
| 3 x decrease |
winded graphene ribbonelectrically conductive interconnect member |
beryllium copper
graphene nano-ribbons
iron nickel
Fe/Ni
| 3 x decrease |
winded graphene ribbonelectrically conductive interconnect member |
beryllium copper
graphene nano-ribbons
iron nickel
Fe/Ni
| 3 x decrease |
winded graphene ribbonelectrically conductive interconnect member |