Patent
US 9,393,767metal substrate
copper
Cu
nickel
Ni
carbon source gas
methane
CH₄
hydrogen gas
H₂
| 0.34–10 nm |
graphene film |
graphene film heat capacity (monolayer) | ≤ 0.000557 J/cm2·K | graphene film |
metal substrate thickness range | 100–100000 nm | metal substrate |
width of strip-shaped gap in carbon nanotube film | 10–100 nm | drawn carbon nanotube film |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Thickness | 0.5–100000 nm | — |
Thickness | 15000–5000000 nm | — |
Thickness | 100–900 µm | — |
Thickness | 1–10 cm | — |
Thickness | 0.01–100 µm | — |
Thickness | 50–80 nm | — |
Thickness | 2–200 µm | — |
Duration | 5–180 s | — |
Duration | 5–300 s | — |
Duration | 3–5 minutes | — |
Pressure | ≥ 1 Pa | — |
Pressure | ≥ 600 Pa | — |
metal substrate
copper
Cu
nickel
Ni
carbon source gas
methane
CH₄
hydrogen gas
H₂
| 0.34–10 nm |
graphene film |
graphene film heat capacity (monolayer) | ≤ 0.000557 J/cm2·K | graphene film |
metal substrate thickness range | 100–100000 nm | metal substrate |
width of strip-shaped gap in carbon nanotube film | 10–100 nm | drawn carbon nanotube film |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Thickness | 0.5–100000 nm | — |
Thickness | 15000–5000000 nm | — |
Thickness | 100–900 µm | — |
Thickness | 1–10 cm | — |
Thickness | 0.01–100 µm | — |
Thickness | 50–80 nm | — |
Thickness | 2–200 µm | — |
Duration | 5–180 s | — |
Duration | 5–300 s | — |
Duration | 3–5 minutes | — |
Pressure | ≥ 1 Pa | — |
Pressure | ≥ 600 Pa | — |
metal substrate
copper
Cu
nickel
Ni
carbon source gas
methane
CH₄
hydrogen gas
H₂
| 0.34–10 nm |
graphene film |
graphene film heat capacity (monolayer) | ≤ 0.000557 J/cm2·K | graphene film |
metal substrate thickness range | 100–100000 nm | metal substrate |
width of strip-shaped gap in carbon nanotube film | 10–100 nm | drawn carbon nanotube film |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Thickness | 0.5–100000 nm | — |
Thickness | 15000–5000000 nm | — |
Thickness | 100–900 µm | — |
Thickness | 1–10 cm | — |
Thickness | 0.01–100 µm | — |
Thickness | 50–80 nm | — |
Thickness | 2–200 µm | — |
Duration | 5–180 s | — |
Duration | 5–300 s | — |
Duration | 3–5 minutes | — |
Pressure | ≥ 1 Pa | — |
Pressure | ≥ 600 Pa | — |
metal substrate
copper
Cu
nickel
Ni
carbon source gas
methane
CH₄
hydrogen gas
H₂
| 0.34–10 nm |
graphene film |
graphene film heat capacity (monolayer) | ≤ 0.000557 J/cm2·K | graphene film |
metal substrate thickness range | 100–100000 nm | metal substrate |
width of strip-shaped gap in carbon nanotube film | 10–100 nm | drawn carbon nanotube film |
Duration | 20–60 minutes | — |
Pressure | 0.1–100 Pa | — |
Duration | 10–60 minutes | — |
Thickness | 0.5–100000 nm | — |
Thickness | 15000–5000000 nm | — |
Thickness | 100–900 µm | — |
Thickness | 1–10 cm | — |
Thickness | 0.01–100 µm | — |
Thickness | 50–80 nm | — |
Thickness | 2–200 µm | — |
Duration | 5–180 s | — |
Duration | 5–300 s | — |
Duration | 3–5 minutes | — |
Pressure | ≥ 1 Pa | — |
Pressure | ≥ 600 Pa | — |