Patent
US 8,637,118silicon nitride substrate
Si₃N₄
silicon carbonitride substrate
SiCN
silicon oxygen carbon fluorine substrate
SiOCF
silicon boronitride substrate
PECVD plasma power range | 50–1000 W | amorphous carbon |
PECVD pressure range | 1–20 torr | amorphous carbon |
substrate temperature range during PECVD | 100–1000 °C | amorphous carbon |
laser irradiation wavelength range for annealing | 200–600 nm | amorphous carbon |
laser pulse energy range for annealing | 0.1–100 J/cm2 | amorphous carbon |
— | 0.6–0.8 eV | — |
Duration | 60–43200 s | — |
Flow Rate | 50–2000 sccm | — |
Pressure | 1–1000 torr | — |
Pressure | 1–106 torr | — |
silicon nitride substrate
Si₃N₄
silicon carbonitride substrate
SiCN
silicon oxygen carbon fluorine substrate
SiOCF
silicon boronitride substrate
PECVD plasma power range | 50–1000 W | amorphous carbon |
PECVD pressure range | 1–20 torr | amorphous carbon |
substrate temperature range during PECVD | 100–1000 °C | amorphous carbon |
laser irradiation wavelength range for annealing | 200–600 nm | amorphous carbon |
laser pulse energy range for annealing | 0.1–100 J/cm2 | amorphous carbon |
— | 0.6–0.8 eV | — |
Duration | 60–43200 s | — |
Flow Rate | 50–2000 sccm | — |
Pressure | 1–1000 torr | — |
Pressure | 1–106 torr | — |
silicon nitride substrate
Si₃N₄
silicon carbonitride substrate
SiCN
silicon oxygen carbon fluorine substrate
SiOCF
silicon boronitride substrate
PECVD plasma power range | 50–1000 W | amorphous carbon |
PECVD pressure range | 1–20 torr | amorphous carbon |
substrate temperature range during PECVD | 100–1000 °C | amorphous carbon |
laser irradiation wavelength range for annealing | 200–600 nm | amorphous carbon |
laser pulse energy range for annealing | 0.1–100 J/cm2 | amorphous carbon |
— | 0.6–0.8 eV | — |
Duration | 60–43200 s | — |
Flow Rate | 50–2000 sccm | — |
Pressure | 1–1000 torr | — |
Pressure | 1–106 torr | — |
silicon nitride substrate
Si₃N₄
silicon carbonitride substrate
SiCN
silicon oxygen carbon fluorine substrate
SiOCF
silicon boronitride substrate
PECVD plasma power range | 50–1000 W | amorphous carbon |
PECVD pressure range | 1–20 torr | amorphous carbon |
substrate temperature range during PECVD | 100–1000 °C | amorphous carbon |
laser irradiation wavelength range for annealing | 200–600 nm | amorphous carbon |
laser pulse energy range for annealing | 0.1–100 J/cm2 | amorphous carbon |
— | 0.6–0.8 eV | — |
Duration | 60–43200 s | — |
Flow Rate | 50–2000 sccm | — |
Pressure | 1–1000 torr | — |
Pressure | 1–106 torr | — |