Patent
US 9,580,834silicon wafer
Si
silicon-oxide coating
SiO₂
chalcogen source (oxygen, sulfur, selenium, tellurium)
sulfur
S
selenium
Se
metal source (molybdenum, tungsten, or titanium)
molybdenum trioxide
MoO₃
MoS₂
MoSe₂
MoS₁Se₁
MoSSe
WS₂
WSe₂
TiS₂
MoS₂(1-x)Se2x
transition metal dichalcogenide
molybdenum oxisulfide
MoOS₂
| — |
— | 1.68–1.85 eV | — |
Voltage | 150–150 V | — |
Thickness | 3.8–15.3 cm | — |
Pressure | 0.5–1 KPa | — |
Pressure | 1–4 KPa | — |
Pressure | 40–80 KPa | — |
Pressure | 80–120 KPa | — |
Thickness | 0.2–18 cm | — |
— | 1.2–1.8 eV | — |
Thickness | 0.004–0.04 cm | — |
Thickness | 0.1–10 cm | — |
Thickness | 1–2 µm | — |
Thickness | 10–40 nm | — |
Temperature | 4–10 K | — |
Thickness | 64–1000 nm | — |
Thickness | 50–200 nm | — |
— | ≤ 0.01 eV | — |
Voltage | 5531-2950v. | — |
silicon wafer
Si
silicon-oxide coating
SiO₂
chalcogen source (oxygen, sulfur, selenium, tellurium)
sulfur
S
selenium
Se
metal source (molybdenum, tungsten, or titanium)
molybdenum trioxide
MoO₃
MoS₂
MoSe₂
MoS₁Se₁
MoSSe
WS₂
WSe₂
TiS₂
MoS₂(1-x)Se2x
transition metal dichalcogenide
molybdenum oxisulfide
MoOS₂
| — |
— | 1.68–1.85 eV | — |
Voltage | 150–150 V | — |
Thickness | 3.8–15.3 cm | — |
Pressure | 0.5–1 KPa | — |
Pressure | 1–4 KPa | — |
Pressure | 40–80 KPa | — |
Pressure | 80–120 KPa | — |
Thickness | 0.2–18 cm | — |
— | 1.2–1.8 eV | — |
Thickness | 0.004–0.04 cm | — |
Thickness | 0.1–10 cm | — |
Thickness | 1–2 µm | — |
Thickness | 10–40 nm | — |
Temperature | 4–10 K | — |
Thickness | 64–1000 nm | — |
Thickness | 50–200 nm | — |
— | ≤ 0.01 eV | — |
Voltage | 5531-2950v. | — |
silicon wafer
Si
silicon-oxide coating
SiO₂
chalcogen source (oxygen, sulfur, selenium, tellurium)
sulfur
S
selenium
Se
metal source (molybdenum, tungsten, or titanium)
molybdenum trioxide
MoO₃
MoS₂
MoSe₂
MoS₁Se₁
MoSSe
WS₂
WSe₂
TiS₂
MoS₂(1-x)Se2x
transition metal dichalcogenide
molybdenum oxisulfide
MoOS₂
| — |
— | 1.68–1.85 eV | — |
Voltage | 150–150 V | — |
Thickness | 3.8–15.3 cm | — |
Pressure | 0.5–1 KPa | — |
Pressure | 1–4 KPa | — |
Pressure | 40–80 KPa | — |
Pressure | 80–120 KPa | — |
Thickness | 0.2–18 cm | — |
— | 1.2–1.8 eV | — |
Thickness | 0.004–0.04 cm | — |
Thickness | 0.1–10 cm | — |
Thickness | 1–2 µm | — |
Thickness | 10–40 nm | — |
Temperature | 4–10 K | — |
Thickness | 64–1000 nm | — |
Thickness | 50–200 nm | — |
— | ≤ 0.01 eV | — |
Voltage | 5531-2950v. | — |
silicon wafer
Si
silicon-oxide coating
SiO₂
chalcogen source (oxygen, sulfur, selenium, tellurium)
sulfur
S
selenium
Se
metal source (molybdenum, tungsten, or titanium)
molybdenum trioxide
MoO₃
MoS₂
MoSe₂
MoS₁Se₁
MoSSe
WS₂
WSe₂
TiS₂
MoS₂(1-x)Se2x
transition metal dichalcogenide
molybdenum oxisulfide
MoOS₂
| — |
— | 1.68–1.85 eV | — |
Voltage | 150–150 V | — |
Thickness | 3.8–15.3 cm | — |
Pressure | 0.5–1 KPa | — |
Pressure | 1–4 KPa | — |
Pressure | 40–80 KPa | — |
Pressure | 80–120 KPa | — |
Thickness | 0.2–18 cm | — |
— | 1.2–1.8 eV | — |
Thickness | 0.004–0.04 cm | — |
Thickness | 0.1–10 cm | — |
Thickness | 1–2 µm | — |
Thickness | 10–40 nm | — |
Temperature | 4–10 K | — |
Thickness | 64–1000 nm | — |
Thickness | 50–200 nm | — |
— | ≤ 0.01 eV | — |
Voltage | 5531-2950v. | — |