Patent
US 8,766,258graphene device array (substrate/die/IC) as described in detailed description
aluminum oxide
Al₂O₃
aluminum oxynitride
AlON
nitrogen dioxide
NO₂
passivation layer (high-k dielectric)
hafnium oxide
HfO₂
tantalum oxide
Ta₂O₅
titanium dioxide
TiO₂
silicon nitride
Si₃N₄
polyacrylate film
inorganic oxide
poly-para-xylene polymer (parylene)
low-k polymer
ozone
O₃
perylene tetracarboxylic acid
graphene |
resistance variation over temperature range after vacuum anneal (unpassivated graphene, 29°C to 80°C) | 5 % | graphene |
average resistance increase after one week in nitrogen environment (unpassivated graphene) | 87 ohm/device | graphene |
fraction of passivated graphene devices with less than 26 ohm variation after one week in nitrogen environment | 66 % | graphene |
Thickness | 10–20 nm | — |
graphene device array (substrate/die/IC) as described in detailed description
aluminum oxide
Al₂O₃
aluminum oxynitride
AlON
nitrogen dioxide
NO₂
passivation layer (high-k dielectric)
hafnium oxide
HfO₂
tantalum oxide
Ta₂O₅
titanium dioxide
TiO₂
silicon nitride
Si₃N₄
polyacrylate film
inorganic oxide
poly-para-xylene polymer (parylene)
low-k polymer
ozone
O₃
perylene tetracarboxylic acid
graphene |
resistance variation over temperature range after vacuum anneal (unpassivated graphene, 29°C to 80°C) | 5 % | graphene |
average resistance increase after one week in nitrogen environment (unpassivated graphene) | 87 ohm/device | graphene |
fraction of passivated graphene devices with less than 26 ohm variation after one week in nitrogen environment | 66 % | graphene |
Thickness | 10–20 nm | — |
graphene device array (substrate/die/IC) as described in detailed description
aluminum oxide
Al₂O₃
aluminum oxynitride
AlON
nitrogen dioxide
NO₂
passivation layer (high-k dielectric)
hafnium oxide
HfO₂
tantalum oxide
Ta₂O₅
titanium dioxide
TiO₂
silicon nitride
Si₃N₄
polyacrylate film
inorganic oxide
poly-para-xylene polymer (parylene)
low-k polymer
ozone
O₃
perylene tetracarboxylic acid
graphene |
resistance variation over temperature range after vacuum anneal (unpassivated graphene, 29°C to 80°C) | 5 % | graphene |
average resistance increase after one week in nitrogen environment (unpassivated graphene) | 87 ohm/device | graphene |
fraction of passivated graphene devices with less than 26 ohm variation after one week in nitrogen environment | 66 % | graphene |
Thickness | 10–20 nm | — |
graphene device array (substrate/die/IC) as described in detailed description
aluminum oxide
Al₂O₃
aluminum oxynitride
AlON
nitrogen dioxide
NO₂
passivation layer (high-k dielectric)
hafnium oxide
HfO₂
tantalum oxide
Ta₂O₅
titanium dioxide
TiO₂
silicon nitride
Si₃N₄
polyacrylate film
inorganic oxide
poly-para-xylene polymer (parylene)
low-k polymer
ozone
O₃
perylene tetracarboxylic acid
graphene |
resistance variation over temperature range after vacuum anneal (unpassivated graphene, 29°C to 80°C) | 5 % | graphene |
average resistance increase after one week in nitrogen environment (unpassivated graphene) | 87 ohm/device | graphene |
fraction of passivated graphene devices with less than 26 ohm variation after one week in nitrogen environment | 66 % | graphene |
Thickness | 10–20 nm | — |