FLEXIBLE HEXAGONAL BORON NITRIDE COMPOSITES FOR ADDITIVE MANUFACTURING APPLICATIONS

Linda M. Guiney; Nikhita D. Mansukhani; Adam E. Jakus; Ramille N. Shah; Mark C. Hersam

Patent

Atlas literature

Patent

US 11,850,327 B2

FLEXIBLE HEXAGONAL BORON NITRIDE COMPOSITES FOR ADDITIVE MANUFACTURING APPLICATIONS

Linda M. Guiney, Nikhita D. Mansukhani, Adam E. Jakus, Ramille N. Shah et al.

Northwestern University, Evanston, IL (US)·Dec. 26, 2023·US

Drawings

Patent drawings and their descriptions. Click a drawing to enlarge it.

FIG. 1

FIG. 1 depicts scanning electron micrographs of a 3D printed 40% vol. hBN scaffold. The 3D printed struts are highly uniform and can be printed consistently …

FIG. 2

FIG. 2D) tensile strength values (n≥3) extracted from the tensile testing stress-strain characterization. Tensile strength and modulus are signiﬁcantly …

FIG. 3

FIG. 3B) porosity of 3D printed constructs (n=3) for different hBN loading. Thermal conductivity for the 20%, 30%, and 40% vol. hBN samples are signiﬁcantly …

FIG. 4

FIG. 4 depicts DNA quantiﬁcation of hMSCs seeded onto 40% vol. hBN scaffolds (n=3) over 28 days. Error bars 10 represent one standard deviation.

FIG. 5

FIG. 5 depicts thermogravimetric analysis (TGA) scans of 3D printed hBN with varying hBN:PLGA composition ratios. The PLGA curve is the raw PLGA polymer …

FIG. 6

FIGS. 6A-6C depict powder X-ray diffraction (PXRD) scans of (

Claims

Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.

1 independent · 9 dependent

1
IndependentBNbiocompatible elastomeric polymer binderbiocompatible implantable device with thermally conductive scaffold
A biocompatible device comprising: an implantable electronic device; and a thermally conductive, electrically insulating scaffold around at least a portion of the implantable electronic device, the scaffold comprising continuous ﬂexible ﬁbers of a cytocompatible composite, the cytocompat-ible composite comprising: 15 a biocompatible elastomeric polymer binder; and hexagonal boron nitride particles dispersed in the bio-compatible elastomeric polymer binder.
1. 2
  Dependent← claim 1BNbiocompatible elastomeric polymer binderbiocompatible implantable device with thermally conductive scaffold
  The device of claim 1, wherein the cytocompatible composite has a hexagonal boron nitride particle content in the range from 30 vol. % to 60 vol. %.
2. 3
  Dependent← claim 1BNbiocompatible elastomeric polymer binderbiocompatible implantable device with thermally conductive scaffold
  The device of claim 1, wherein the cytocompatible composite has a hexagonal boron nitride particle content in the range from 35 vol. % to 45 vol. %.
3. 4
  Dependent← claim 1BNbiocompatible elastomeric polymer binderbiocompatible implantable device with thermally conductive scaffold
  The device of claim 1, wherein the cytocompatible composite has a porosity in the range from 20% to 40%.
4. 5
  Dependent← claim 1BNbiocompatible elastomeric polymer binderbiocompatible implantable device with thermally conductive scaffold
  The device of claim 1, wherein the cytocompatible composite has a porosity in the range from 20% to 35%.
5. 9
  Dependent← claim 1BNbiocompatible elastomeric polymer binderbiocompatible implantable device with thermally conductive scaffold
  The device of claim 1, wherein the one or more ﬁbers have a cross-sectional diameter in the range from 50 µm to 500 µm.

Device structures

Layer stacks claimed or described, ordered top of device to substrate.

biocompatible implantable device with thermally conductive scaffold

hBN-polymer cytocompatible compositethermally conductive electrically insulating scaffold (continuous flexible fibers)

implantable electronic device coreimplantable electronic device core

Materials

Materials described outside the worked examples.

hexagonal boron nitride particles

Thermal Filler/Thermally Conductive Electrically Insulating Filler

biocompatible elastomeric polymer binder

Polymer Matrix Binder

Characterization

Measurements and analyses referenced in the patent, with their drawing references.

sem

SEM

FIG. 1 depicts scanning electron micrographs of a 3D printed 40% vol. hBN scaffold. The 3D printed struts are highly uniform and can be printed consistently …

Figure references

FIG. 1

hBNhBN

Reported properties

Performance values and ranges asserted in the specification or claims.

Property	Value	Material
thermal conductivity at least 1.5 W/m-K	≥ 1.5 W/m-K	hBN-polymer cytocompatible composite
thermal conductivity at least 2 W/m-K (described embodiment)	≥ 2 W/m-K

Cited prior art

Patents and literature cited by this patent (applicant and examiner references).

Cited patents · 3

US 8,287,895 B18,287,895 B1 10/2012 Kisailus et al.
US 2015/0202351 A12015/0202351 A1 7/2015 Kaplan et al.
US 2017/0081534 A12017/0081534 A1 3/2017 Shah et al.

Cited non-patent literature · 7

High Thermally Conduc- tive PLA-Based Composites with Tailored Hybrid Network of Hexagonal Boron Nitride and Graphene Nanoplatelets. Shahriar Ghaffari Mosanenzadeh et al., “High Thermally Conduc- tive PLA-Based Composites with Tailored Hybrid Network of Hexagonal Boron Nitride and Graphene Nanoplatelets,” Polym. Compos. 2015, 37, 2196-2205.
High stiffness nano-composite ﬁbres from polyvinylalcohol ﬁlled with graphene and boron nitride. Conor S. Boland et al., “High stiffness nano-composite ﬁbres from polyvinylalcohol ﬁlled with graphene and boron nitride,” Carbon, vol. 99, 2016, pp. 280-288. Xieliang Cui et al., “Thermal Conductive and Mechanical Proper- ties of Polymeric Composites Based on Solution-Exfoliated Boron Nitride and Graphene Nanosheets: A Morphology-Promoted Syn- ergistic Effect,” ACS Appl. Mater. Interfaces, 2015, vol. 7, pp. 19068-19075. Cheng Zhu et al., “Supercapacitors Based on Three-Dimensional Hierarchical Graphene Aerogels with Periodic Macropores,” Nano Lett. 2016, vol. 16, pp. 3448-3456. Wei-Li Song et al., “Polymer/Boron Nitride Nanocomposite Mate- rials for Superior Thermal Transport Performance,” Angew. Chem. Ed. 2012, vol. 124, pp. 6604-6607. Zhiqiao Kuang, “Fabrication of Highly Oriented Hexagonal Boron Nitride Nanosheet/Elastomer Nanocomposites with High Thermal Conductivity,” Small 2015, 11, 1655-1659. Chunyi Zhi et al., “Large-Scale Fabrication of Boron Nitride Nanosheets and Their Utilizaion in Polymeric Composites with Improved Thermal and Mechanical Properties,” Adv. Mater. 2009, 21, 2889-2893. Qunhong Weng et al., “Highly.Water-Soluble, Porous, and Biocompat- ible Boron Nitrides for Anticancer Drug Delivery,” ACS Nano 2014, vol. 8, No. 6, pp. 6123-6130. New technique produces longer-lasting lithium batteries, ScienceDaily, Columbia University Schoolof Engineering and Applied Science, Apr. 22, 2019, pp. 1-4. Stefano Moscato et al., “Inﬁll-Dependent 3-D-Printed Material Based on NinjaFlex Filament forAntenna Applications,” IEEE Antennas and Wireless Propagation Letters, vol. 15, 2016, pp. 1506-1509. Gaurav Lalwani et al., “Two-Dimensional Nanostructure- Reinforced Biodegradable Polymeric Nanocomposites for Bone Tissue Engineering,” Biomacromolecules, Mar. 11, 2013, vol. 14, No. 3, pp. 900-909. Doi: 10.1021/bm301995s. Manuela Loeblein et al., “High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Mate- rial,” ACS Nano, vol. 11, No. 2, (2017), pp. 1-33. Adam E. Jakus et al., “Three-Dimensional Printing of High-Content Graphene Scaffolds for Electronic and Biomedical Applications,” ACS Nano, 2015, vol. 9, No. 4, pp. 4636-4648. Esther Garcia-Tunon et al., “Printing in three-dimensions with graphene,” Adv. Mater. http://dx.doi.org/10.1002/adma.201405046, pp. 1-14. Christopher W. Foster et al., “3D Printed Graphene Based Energy Storage Devices,” Scientiﬁc Reports, 7:42233, DOI:10.1038/srep42233, pp. 1-11. Behzad Farshid et al., “Boron Nitride Nanotubes and Nanoplatelets as Reinforcing Agents of Polymeric Matrices for Bone Tissue Engineering,” J. Biomed. Mater. Res. B. Appl. Biomater., Feb. 2017, vol. 105, No. 2, pp. 406-419. doi:10.1002/jbm.b.33565. The International Search Report and Written Opinion dated Jul. 29, 2019 for International PatentApplication No. PCT/US19/29902, pp. 1-9.

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