Patent
US 9,332,632GRAPHENE-BASED THERMAL MANAGEMENT CORES AND SYSTEMS AND METHODS FOR CONSTRUCTING PRINTED WIRING BOARDS
Douglas Schneider
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,332,632Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
FIG. 2 is a schematic cross-sectional view of a graphene-based thermal management core that includes graphene nanoplatelets in accordance with an embodiment of …
FIGS. 3A-3C are schematic cross-sectional views of various reinforcement layers that can be embedded within graphene-based thermal management cores in …
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
FIG. 5 is a flow chart illustrating a process for manufacturing a PWB that includes a graphene-based thermal management core in accordance with an embodiment of …
FIGS. 6A-6F are schematic cross-section views of various PWB subassemblies that are constructed as part of the manufacturing process illustrated in
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based thermal management core comprising: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer;and wherein at least either the first reinforcement layer or the second reinforcement layer comprises a substrate impreqnated with a non-dielectric resin.
The graphene-based thermal management core of claim 1, wherein the at least one sheet of graphene is implemented via at least one graphene nanoplatelet.
The graphene-based thermal management core of claim 1 [[7]], wherein at least either the first reinforcement layer or second reinforcement laver comprises a [[the]]resin that is one of: Stablcor @ EP-01, a phenolic based resin, a Bismaleimide Triazine (BT) epoxy based resin, a Cyanate Ester based resin, and a polyimide based resin.
The graphene-based thermal management core of claim 1 [[7]], wherein the substrate comprises carbon.
The graphene-based thermal management core of claim 1, further comprising: a first electrically conductive layer bound to the first reinforcement layer; and a second electrically conductive layer bound to the second reinforcement layer.
canceled
canceled
canceled
canceled
A printed wiring board comprising: a graphene-based thermal management core that itself comprises: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer; and 4 APPLN N O. 14/464,656 REPLY TO OFFICE ACTION OF wherein at least either the first reinforcement laver or the second reinforcement layer comprises a substrate impreqnated with a non- dielectric resin; at least one dielectric layer; and at least one electrically conductive layer that includes a circuit trace; wherein at least one dielectric layer is disposed between the graphene-based thermal management core and at least one electrically conductive layer.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically isolated from any circuit traces.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to at least one circuit trace.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to the circuit trace by a via.
The printed wiring board of claim 19, wherein the layer including at least one sheet of graphene comprises at least one graphene nanoplatelet.
canceled
canceled
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based thermal management core
printed wiring board
Materials described outside the worked examples.
graphene sheet
graphene nanoplatelet
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity | 500–2500 | graphene nanoplatelet |
Thickness | 1–20 |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,332,632Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
FIG. 2 is a schematic cross-sectional view of a graphene-based thermal management core that includes graphene nanoplatelets in accordance with an embodiment of …
FIGS. 3A-3C are schematic cross-sectional views of various reinforcement layers that can be embedded within graphene-based thermal management cores in …
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
FIG. 5 is a flow chart illustrating a process for manufacturing a PWB that includes a graphene-based thermal management core in accordance with an embodiment of …
FIGS. 6A-6F are schematic cross-section views of various PWB subassemblies that are constructed as part of the manufacturing process illustrated in
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based thermal management core comprising: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer;and wherein at least either the first reinforcement layer or the second reinforcement layer comprises a substrate impreqnated with a non-dielectric resin.
The graphene-based thermal management core of claim 1, wherein the at least one sheet of graphene is implemented via at least one graphene nanoplatelet.
The graphene-based thermal management core of claim 1 [[7]], wherein at least either the first reinforcement layer or second reinforcement laver comprises a [[the]]resin that is one of: Stablcor @ EP-01, a phenolic based resin, a Bismaleimide Triazine (BT) epoxy based resin, a Cyanate Ester based resin, and a polyimide based resin.
The graphene-based thermal management core of claim 1 [[7]], wherein the substrate comprises carbon.
The graphene-based thermal management core of claim 1, further comprising: a first electrically conductive layer bound to the first reinforcement layer; and a second electrically conductive layer bound to the second reinforcement layer.
canceled
canceled
canceled
canceled
A printed wiring board comprising: a graphene-based thermal management core that itself comprises: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer; and 4 APPLN N O. 14/464,656 REPLY TO OFFICE ACTION OF wherein at least either the first reinforcement laver or the second reinforcement layer comprises a substrate impreqnated with a non- dielectric resin; at least one dielectric layer; and at least one electrically conductive layer that includes a circuit trace; wherein at least one dielectric layer is disposed between the graphene-based thermal management core and at least one electrically conductive layer.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically isolated from any circuit traces.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to at least one circuit trace.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to the circuit trace by a via.
The printed wiring board of claim 19, wherein the layer including at least one sheet of graphene comprises at least one graphene nanoplatelet.
canceled
canceled
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based thermal management core
printed wiring board
Materials described outside the worked examples.
graphene sheet
graphene nanoplatelet
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity | 500–2500 | graphene nanoplatelet |
Thickness | 1–20 |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,332,632Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
FIG. 2 is a schematic cross-sectional view of a graphene-based thermal management core that includes graphene nanoplatelets in accordance with an embodiment of …
FIGS. 3A-3C are schematic cross-sectional views of various reinforcement layers that can be embedded within graphene-based thermal management cores in …
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
FIG. 5 is a flow chart illustrating a process for manufacturing a PWB that includes a graphene-based thermal management core in accordance with an embodiment of …
FIGS. 6A-6F are schematic cross-section views of various PWB subassemblies that are constructed as part of the manufacturing process illustrated in
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based thermal management core comprising: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer;and wherein at least either the first reinforcement layer or the second reinforcement layer comprises a substrate impreqnated with a non-dielectric resin.
The graphene-based thermal management core of claim 1, wherein the at least one sheet of graphene is implemented via at least one graphene nanoplatelet.
The graphene-based thermal management core of claim 1 [[7]], wherein at least either the first reinforcement layer or second reinforcement laver comprises a [[the]]resin that is one of: Stablcor @ EP-01, a phenolic based resin, a Bismaleimide Triazine (BT) epoxy based resin, a Cyanate Ester based resin, and a polyimide based resin.
The graphene-based thermal management core of claim 1 [[7]], wherein the substrate comprises carbon.
The graphene-based thermal management core of claim 1, further comprising: a first electrically conductive layer bound to the first reinforcement layer; and a second electrically conductive layer bound to the second reinforcement layer.
canceled
canceled
canceled
canceled
A printed wiring board comprising: a graphene-based thermal management core that itself comprises: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer; and 4 APPLN N O. 14/464,656 REPLY TO OFFICE ACTION OF wherein at least either the first reinforcement laver or the second reinforcement layer comprises a substrate impreqnated with a non- dielectric resin; at least one dielectric layer; and at least one electrically conductive layer that includes a circuit trace; wherein at least one dielectric layer is disposed between the graphene-based thermal management core and at least one electrically conductive layer.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically isolated from any circuit traces.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to at least one circuit trace.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to the circuit trace by a via.
The printed wiring board of claim 19, wherein the layer including at least one sheet of graphene comprises at least one graphene nanoplatelet.
canceled
canceled
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based thermal management core
printed wiring board
Materials described outside the worked examples.
graphene sheet
graphene nanoplatelet
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity | 500–2500 | graphene nanoplatelet |
Thickness | 1–20 |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,332,632Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
FIG. 2 is a schematic cross-sectional view of a graphene-based thermal management core that includes graphene nanoplatelets in accordance with an embodiment of …
FIGS. 3A-3C are schematic cross-sectional views of various reinforcement layers that can be embedded within graphene-based thermal management cores in …
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
FIG. 5 is a flow chart illustrating a process for manufacturing a PWB that includes a graphene-based thermal management core in accordance with an embodiment of …
FIGS. 6A-6F are schematic cross-section views of various PWB subassemblies that are constructed as part of the manufacturing process illustrated in
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based thermal management core comprising: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer;and wherein at least either the first reinforcement layer or the second reinforcement layer comprises a substrate impreqnated with a non-dielectric resin.
The graphene-based thermal management core of claim 1, wherein the at least one sheet of graphene is implemented via at least one graphene nanoplatelet.
The graphene-based thermal management core of claim 1 [[7]], wherein at least either the first reinforcement layer or second reinforcement laver comprises a [[the]]resin that is one of: Stablcor @ EP-01, a phenolic based resin, a Bismaleimide Triazine (BT) epoxy based resin, a Cyanate Ester based resin, and a polyimide based resin.
The graphene-based thermal management core of claim 1 [[7]], wherein the substrate comprises carbon.
The graphene-based thermal management core of claim 1, further comprising: a first electrically conductive layer bound to the first reinforcement layer; and a second electrically conductive layer bound to the second reinforcement layer.
canceled
canceled
canceled
canceled
A printed wiring board comprising: a graphene-based thermal management core that itself comprises: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; wherein the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer; and 4 APPLN N O. 14/464,656 REPLY TO OFFICE ACTION OF wherein at least either the first reinforcement laver or the second reinforcement layer comprises a substrate impreqnated with a non- dielectric resin; at least one dielectric layer; and at least one electrically conductive layer that includes a circuit trace; wherein at least one dielectric layer is disposed between the graphene-based thermal management core and at least one electrically conductive layer.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically isolated from any circuit traces.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to at least one circuit trace.
The printed wiring board of claim 19, wherein the graphene-based thermal management core is electrically connected to the circuit trace by a via.
The printed wiring board of claim 19, wherein the layer including at least one sheet of graphene comprises at least one graphene nanoplatelet.
canceled
canceled
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based thermal management core
printed wiring board
Materials described outside the worked examples.
graphene sheet
graphene nanoplatelet
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically connected to other electrically …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity | 500–2500 | graphene nanoplatelet |
Thickness | 1–20 |
Related documents with shared materials, methods, properties, or citations.
carbon substrate
reinforcement layer substrate
non-dielectric resin
Stablcor EP-01 resin
phenolic based resin
Bismaleimide Triazine (BT) epoxy based resin
Cyanate Ester based resin
copper
Cu
polyimide based resin
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
Width | 1–50 | graphene nanoplatelet |
Thermal Conductivity | 4400–5780 | graphene sheet |
Thickness | 1–20 nm | — |
Thickness | 1–50 µm | — |
— | 500–2500 W | — |
carbon substrate
reinforcement layer substrate
non-dielectric resin
Stablcor EP-01 resin
phenolic based resin
Bismaleimide Triazine (BT) epoxy based resin
Cyanate Ester based resin
copper
Cu
polyimide based resin
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
Width | 1–50 | graphene nanoplatelet |
Thermal Conductivity | 4400–5780 | graphene sheet |
Thickness | 1–20 nm | — |
Thickness | 1–50 µm | — |
— | 500–2500 W | — |
carbon substrate
reinforcement layer substrate
non-dielectric resin
Stablcor EP-01 resin
phenolic based resin
Bismaleimide Triazine (BT) epoxy based resin
Cyanate Ester based resin
copper
Cu
polyimide based resin
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
Width | 1–50 | graphene nanoplatelet |
Thermal Conductivity | 4400–5780 | graphene sheet |
Thickness | 1–20 nm | — |
Thickness | 1–50 µm | — |
— | 500–2500 W | — |
carbon substrate
reinforcement layer substrate
non-dielectric resin
Stablcor EP-01 resin
phenolic based resin
Bismaleimide Triazine (BT) epoxy based resin
Cyanate Ester based resin
copper
Cu
polyimide based resin
FIG. 4 is a schematic cross-sectional view of a PWB that includes a graphene-based thermal management core that is electrically insulated from the electrically …
Width | 1–50 | graphene nanoplatelet |
Thermal Conductivity | 4400–5780 | graphene sheet |
Thickness | 1–20 nm | — |
Thickness | 1–50 µm | — |
— | 500–2500 W | — |