Patent
US 9,360,905Thermal Management System Containing an Integrated Graphene Film for Electronic Devices
Aruna Zhamu, Mingchao Wang, Wei Xiong, Bor Z. Jang
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 9,360,905Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A flow chart illustrating various prior art processes of producing exfoliated graphite products (flexible graphite sheets and flexible graphite composites) …
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
FIG.4 Thermal conductivity values of GO gel bonded NGP composites, integrated graphene film from treated GO gel (heat treatment times 4 hours for GO and GO-NGP …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based heat dissipation system for an electronic device, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device; (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device; wherein the heat-conducting layer consists of a graphene material which is made from one or more at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source, wherein said integrated graphene film is composed of chemically merged graphene oxide gel molecules that are merged in an edge-to-edge manner or graphene oxide gel- bonded nano graphene platelets (NGPs) and exhibits a thermal conductivity of at least 600 W/mK, and said integrated graphene film has at least one of the following features: i) having an oxygen content of at least 0.1% by weight, but less than 10% by weight; ii) having a single grain, a single crystal, or few grains that has no or few sheet-to-sheet grain boundaries per layer; iii) having an electrical conductivity greater than 2,000 S/cm, a physical density greater than 2.0 SVG 13506265.12-10-2015.IIBR₃DVYPXXIFW4.CLM.1.25.519.2385.635.2442.svg 0.19 0.387 Chemistry Black and white, or a tensile strength greater than 40 MPa.
(Previously amended) The system of claim 1, wherein said integrated graphene film is a graphene film formed from a graphene oxide gel or a graphene composite film formed of graphene oxide gel-bonded nano graphene platelets (NGPs) through a heat treatment conducted at a temperature from 100 * C to 3,200 * C that allows individual graphene oxide molecules or graphene oxide sheets to merge with one another in an edge-to-edge manner for forming an integrated graphene film. 2
The system of claim 1, wherein the electronic device further comprises a heat dissipation device positioned in a location not directly adjacent to the heat source and wherein one of the major surfaces of the heat-conducting layer is in operative contact with the heat dissipation device.
(Previously amended) The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 800 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,000 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,500 W/mK.
The system of claim 1, wherein the integrated graphene film further comprises a protective coating applied thereon.
The system of claim 1, wherein said integrated graphene film is a graphene composite film composed of nano graphene platelets (NGPs) bonded by a graphene oxide binder, wherein said NGPs contain single-layer graphene or multi-layer graphene sheets having a thickness from 0.335 nm to 100 nm, and said NGPs occupy a weight fraction of 1% to 99.9% of the total composite weight; and said graphene oxide binder, having an oxygen content of 0.1%- 40% by weight based on the total graphene oxide weight, occupies a weight fraction of 0.1% to 99% of the total composite weight, and wherein said composite forms a thin film with a thickness no greater than 1 mm and no less than 1 pm.
The system of claim 1, wherein said integrated graphene film has a thickness less than 100 pm.
The system of claim 1, wherein said integrated graphene film has a thickness greater than p m, but less than 100 pm.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in a powder or fibrous form in an oxidizing liquid to form an optically opaque suspension in a reaction vessel at a reaction temperature for a length of time sufficient to obtain a graphene oxide gel that is optically transparent or translucent, wherein said graphene oxide gel is composed of graphene oxide molecules dispersed in an acidic medium having a pH value of no higher than 5 and said graphene oxide molecules have an oxygen content no less than 20% by weight.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in an oxidizing agent to form an optically opaque suspension and allowing an oxidizing reaction to proceed until an optically transparent or translucent solution is formed, and wherein said graphitic material is selected from natural graphite, artificial graphite, meso-phase carbon, meso-phase pitch, meso-carbon micro-bead, soft carbon, hard carbon, coke, carbon fiber, carbon nano-fiber, carbon nanotube, or a combination thereof.
The system of claim 1, wherein a thermal transfer material is positioned between the heat-conducting layer and the heat source.
The system of claim 1, wherein the electronic device is a portable computing device containing a central processing unit (CP U) or a battery as a heat source. 6
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based heat dissipation system
Materials described outside the worked examples.
integrated graphene film
nano graphene platelets (NGPs)
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity In Plane | ≥ 600 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 800 W/mK |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,360,905Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A flow chart illustrating various prior art processes of producing exfoliated graphite products (flexible graphite sheets and flexible graphite composites) …
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
FIG.4 Thermal conductivity values of GO gel bonded NGP composites, integrated graphene film from treated GO gel (heat treatment times 4 hours for GO and GO-NGP …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based heat dissipation system for an electronic device, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device; (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device; wherein the heat-conducting layer consists of a graphene material which is made from one or more at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source, wherein said integrated graphene film is composed of chemically merged graphene oxide gel molecules that are merged in an edge-to-edge manner or graphene oxide gel- bonded nano graphene platelets (NGPs) and exhibits a thermal conductivity of at least 600 W/mK, and said integrated graphene film has at least one of the following features: i) having an oxygen content of at least 0.1% by weight, but less than 10% by weight; ii) having a single grain, a single crystal, or few grains that has no or few sheet-to-sheet grain boundaries per layer; iii) having an electrical conductivity greater than 2,000 S/cm, a physical density greater than 2.0 SVG 13506265.12-10-2015.IIBR₃DVYPXXIFW4.CLM.1.25.519.2385.635.2442.svg 0.19 0.387 Chemistry Black and white, or a tensile strength greater than 40 MPa.
(Previously amended) The system of claim 1, wherein said integrated graphene film is a graphene film formed from a graphene oxide gel or a graphene composite film formed of graphene oxide gel-bonded nano graphene platelets (NGPs) through a heat treatment conducted at a temperature from 100 * C to 3,200 * C that allows individual graphene oxide molecules or graphene oxide sheets to merge with one another in an edge-to-edge manner for forming an integrated graphene film. 2
The system of claim 1, wherein the electronic device further comprises a heat dissipation device positioned in a location not directly adjacent to the heat source and wherein one of the major surfaces of the heat-conducting layer is in operative contact with the heat dissipation device.
(Previously amended) The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 800 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,000 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,500 W/mK.
The system of claim 1, wherein the integrated graphene film further comprises a protective coating applied thereon.
The system of claim 1, wherein said integrated graphene film is a graphene composite film composed of nano graphene platelets (NGPs) bonded by a graphene oxide binder, wherein said NGPs contain single-layer graphene or multi-layer graphene sheets having a thickness from 0.335 nm to 100 nm, and said NGPs occupy a weight fraction of 1% to 99.9% of the total composite weight; and said graphene oxide binder, having an oxygen content of 0.1%- 40% by weight based on the total graphene oxide weight, occupies a weight fraction of 0.1% to 99% of the total composite weight, and wherein said composite forms a thin film with a thickness no greater than 1 mm and no less than 1 pm.
The system of claim 1, wherein said integrated graphene film has a thickness less than 100 pm.
The system of claim 1, wherein said integrated graphene film has a thickness greater than p m, but less than 100 pm.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in a powder or fibrous form in an oxidizing liquid to form an optically opaque suspension in a reaction vessel at a reaction temperature for a length of time sufficient to obtain a graphene oxide gel that is optically transparent or translucent, wherein said graphene oxide gel is composed of graphene oxide molecules dispersed in an acidic medium having a pH value of no higher than 5 and said graphene oxide molecules have an oxygen content no less than 20% by weight.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in an oxidizing agent to form an optically opaque suspension and allowing an oxidizing reaction to proceed until an optically transparent or translucent solution is formed, and wherein said graphitic material is selected from natural graphite, artificial graphite, meso-phase carbon, meso-phase pitch, meso-carbon micro-bead, soft carbon, hard carbon, coke, carbon fiber, carbon nano-fiber, carbon nanotube, or a combination thereof.
The system of claim 1, wherein a thermal transfer material is positioned between the heat-conducting layer and the heat source.
The system of claim 1, wherein the electronic device is a portable computing device containing a central processing unit (CP U) or a battery as a heat source. 6
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based heat dissipation system
Materials described outside the worked examples.
integrated graphene film
nano graphene platelets (NGPs)
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity In Plane | ≥ 600 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 800 W/mK |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,360,905Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A flow chart illustrating various prior art processes of producing exfoliated graphite products (flexible graphite sheets and flexible graphite composites) …
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
FIG.4 Thermal conductivity values of GO gel bonded NGP composites, integrated graphene film from treated GO gel (heat treatment times 4 hours for GO and GO-NGP …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based heat dissipation system for an electronic device, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device; (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device; wherein the heat-conducting layer consists of a graphene material which is made from one or more at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source, wherein said integrated graphene film is composed of chemically merged graphene oxide gel molecules that are merged in an edge-to-edge manner or graphene oxide gel- bonded nano graphene platelets (NGPs) and exhibits a thermal conductivity of at least 600 W/mK, and said integrated graphene film has at least one of the following features: i) having an oxygen content of at least 0.1% by weight, but less than 10% by weight; ii) having a single grain, a single crystal, or few grains that has no or few sheet-to-sheet grain boundaries per layer; iii) having an electrical conductivity greater than 2,000 S/cm, a physical density greater than 2.0 SVG 13506265.12-10-2015.IIBR₃DVYPXXIFW4.CLM.1.25.519.2385.635.2442.svg 0.19 0.387 Chemistry Black and white, or a tensile strength greater than 40 MPa.
(Previously amended) The system of claim 1, wherein said integrated graphene film is a graphene film formed from a graphene oxide gel or a graphene composite film formed of graphene oxide gel-bonded nano graphene platelets (NGPs) through a heat treatment conducted at a temperature from 100 * C to 3,200 * C that allows individual graphene oxide molecules or graphene oxide sheets to merge with one another in an edge-to-edge manner for forming an integrated graphene film. 2
The system of claim 1, wherein the electronic device further comprises a heat dissipation device positioned in a location not directly adjacent to the heat source and wherein one of the major surfaces of the heat-conducting layer is in operative contact with the heat dissipation device.
(Previously amended) The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 800 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,000 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,500 W/mK.
The system of claim 1, wherein the integrated graphene film further comprises a protective coating applied thereon.
The system of claim 1, wherein said integrated graphene film is a graphene composite film composed of nano graphene platelets (NGPs) bonded by a graphene oxide binder, wherein said NGPs contain single-layer graphene or multi-layer graphene sheets having a thickness from 0.335 nm to 100 nm, and said NGPs occupy a weight fraction of 1% to 99.9% of the total composite weight; and said graphene oxide binder, having an oxygen content of 0.1%- 40% by weight based on the total graphene oxide weight, occupies a weight fraction of 0.1% to 99% of the total composite weight, and wherein said composite forms a thin film with a thickness no greater than 1 mm and no less than 1 pm.
The system of claim 1, wherein said integrated graphene film has a thickness less than 100 pm.
The system of claim 1, wherein said integrated graphene film has a thickness greater than p m, but less than 100 pm.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in a powder or fibrous form in an oxidizing liquid to form an optically opaque suspension in a reaction vessel at a reaction temperature for a length of time sufficient to obtain a graphene oxide gel that is optically transparent or translucent, wherein said graphene oxide gel is composed of graphene oxide molecules dispersed in an acidic medium having a pH value of no higher than 5 and said graphene oxide molecules have an oxygen content no less than 20% by weight.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in an oxidizing agent to form an optically opaque suspension and allowing an oxidizing reaction to proceed until an optically transparent or translucent solution is formed, and wherein said graphitic material is selected from natural graphite, artificial graphite, meso-phase carbon, meso-phase pitch, meso-carbon micro-bead, soft carbon, hard carbon, coke, carbon fiber, carbon nano-fiber, carbon nanotube, or a combination thereof.
The system of claim 1, wherein a thermal transfer material is positioned between the heat-conducting layer and the heat source.
The system of claim 1, wherein the electronic device is a portable computing device containing a central processing unit (CP U) or a battery as a heat source. 6
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based heat dissipation system
Materials described outside the worked examples.
integrated graphene film
nano graphene platelets (NGPs)
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity In Plane | ≥ 600 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 800 W/mK |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,360,905Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A flow chart illustrating various prior art processes of producing exfoliated graphite products (flexible graphite sheets and flexible graphite composites) …
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
FIG.4 Thermal conductivity values of GO gel bonded NGP composites, integrated graphene film from treated GO gel (heat treatment times 4 hours for GO and GO-NGP …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A graphene-based heat dissipation system for an electronic device, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the electronic device; (b) a heat-conducting layer comprising two major surfaces, the heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface of the electronic device; wherein the heat-conducting layer consists of a graphene material which is made from one or more at least one sheet of integrated graphene film which thermally shields the second component or the external surface of the electronic device from heat generated by the heat source, wherein said integrated graphene film is composed of chemically merged graphene oxide gel molecules that are merged in an edge-to-edge manner or graphene oxide gel- bonded nano graphene platelets (NGPs) and exhibits a thermal conductivity of at least 600 W/mK, and said integrated graphene film has at least one of the following features: i) having an oxygen content of at least 0.1% by weight, but less than 10% by weight; ii) having a single grain, a single crystal, or few grains that has no or few sheet-to-sheet grain boundaries per layer; iii) having an electrical conductivity greater than 2,000 S/cm, a physical density greater than 2.0 SVG 13506265.12-10-2015.IIBR₃DVYPXXIFW4.CLM.1.25.519.2385.635.2442.svg 0.19 0.387 Chemistry Black and white, or a tensile strength greater than 40 MPa.
(Previously amended) The system of claim 1, wherein said integrated graphene film is a graphene film formed from a graphene oxide gel or a graphene composite film formed of graphene oxide gel-bonded nano graphene platelets (NGPs) through a heat treatment conducted at a temperature from 100 * C to 3,200 * C that allows individual graphene oxide molecules or graphene oxide sheets to merge with one another in an edge-to-edge manner for forming an integrated graphene film. 2
The system of claim 1, wherein the electronic device further comprises a heat dissipation device positioned in a location not directly adjacent to the heat source and wherein one of the major surfaces of the heat-conducting layer is in operative contact with the heat dissipation device.
(Previously amended) The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 800 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,000 W/mK.
The system of claim 1, wherein the integrated graphene film has an in-plane thermal conductivity of at least 1,500 W/mK.
The system of claim 1, wherein the integrated graphene film further comprises a protective coating applied thereon.
The system of claim 1, wherein said integrated graphene film is a graphene composite film composed of nano graphene platelets (NGPs) bonded by a graphene oxide binder, wherein said NGPs contain single-layer graphene or multi-layer graphene sheets having a thickness from 0.335 nm to 100 nm, and said NGPs occupy a weight fraction of 1% to 99.9% of the total composite weight; and said graphene oxide binder, having an oxygen content of 0.1%- 40% by weight based on the total graphene oxide weight, occupies a weight fraction of 0.1% to 99% of the total composite weight, and wherein said composite forms a thin film with a thickness no greater than 1 mm and no less than 1 pm.
The system of claim 1, wherein said integrated graphene film has a thickness less than 100 pm.
The system of claim 1, wherein said integrated graphene film has a thickness greater than p m, but less than 100 pm.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in a powder or fibrous form in an oxidizing liquid to form an optically opaque suspension in a reaction vessel at a reaction temperature for a length of time sufficient to obtain a graphene oxide gel that is optically transparent or translucent, wherein said graphene oxide gel is composed of graphene oxide molecules dispersed in an acidic medium having a pH value of no higher than 5 and said graphene oxide molecules have an oxygen content no less than 20% by weight.
The system of claim 1 wherein said integrated graphene film is a film produced from a graphene oxide gel, which is prepared by immersing a graphitic material in an oxidizing agent to form an optically opaque suspension and allowing an oxidizing reaction to proceed until an optically transparent or translucent solution is formed, and wherein said graphitic material is selected from natural graphite, artificial graphite, meso-phase carbon, meso-phase pitch, meso-carbon micro-bead, soft carbon, hard carbon, coke, carbon fiber, carbon nano-fiber, carbon nanotube, or a combination thereof.
The system of claim 1, wherein a thermal transfer material is positioned between the heat-conducting layer and the heat source.
The system of claim 1, wherein the electronic device is a portable computing device containing a central processing unit (CP U) or a battery as a heat source. 6
Layer stacks claimed or described, ordered top of device to substrate.
graphene-based heat dissipation system
Materials described outside the worked examples.
integrated graphene film
nano graphene platelets (NGPs)
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG.2 (a) A SEM image of a graphite worm sample after exfoliation of graphite intercalation compounds (GICs); (b) An SEM image of a cross-section of a flexible …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thermal Conductivity In Plane | ≥ 600 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 800 W/mK |
Related documents with shared materials, methods, properties, or citations.
graphene oxide gel
graphene oxide binder
pristine graphene
graphitic material precursor
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
Thermal Conductivity In Plane | ≥ 1000 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 1500 W/mK | integrated graphene film |
Electrical Conductivity | ≥ 2000 S/cm | integrated graphene film |
Electrical Conductivity | ≥ 3000 S/cm | integrated graphene film |
Tensile Strength | ≥ 40 MPa | integrated graphene film |
Oxygen Content Wt Percent | 0.1–10 wt% | integrated graphene film |
Electrical Conductivity | ≥ 1500 S/cm | integrated graphene film |
Thermal Conductivity | ≥ 600 W/mK | integrated graphene film |
Physical Density | ≥ 1.4 g/cm3 | integrated graphene film |
Tensile Strength | ≥ 10 MPa | integrated graphene film |
Physical Density | ≥ 1.8 g/cm3 | integrated graphene film |
Physical Density | ≥ 2 g/cm3 | integrated graphene film |
Duration | 15–120 s | — |
Thickness | 3.35–33.5 nm | — |
Thickness | 6.7–20 nm | — |
Duration | 900–7200 s | — |
— | 140–450 W | — |
— | 3000–5000 W | — |
— | 140–300 W | — |
— | 600–2230 W | — |
Temperature | 1500–2800 °C | — |
Duration | 2–4 hours | — |
Temperature | 2500–3000 °C | — |
Thickness | ≥ 0.125 mm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1 mm | — |
— | ≥ 800 W | — |
— | ≥ 1500 W | — |
— | ≥ 1800 W | — |
— | ≥ 1600 W | — |
Thickness | 0.335–100 nm | — |
— | ≥ 600 W | — |
— | ≥ 1 W | — |
graphene oxide gel
graphene oxide binder
pristine graphene
graphitic material precursor
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
Thermal Conductivity In Plane | ≥ 1000 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 1500 W/mK | integrated graphene film |
Electrical Conductivity | ≥ 2000 S/cm | integrated graphene film |
Electrical Conductivity | ≥ 3000 S/cm | integrated graphene film |
Tensile Strength | ≥ 40 MPa | integrated graphene film |
Oxygen Content Wt Percent | 0.1–10 wt% | integrated graphene film |
Electrical Conductivity | ≥ 1500 S/cm | integrated graphene film |
Thermal Conductivity | ≥ 600 W/mK | integrated graphene film |
Physical Density | ≥ 1.4 g/cm3 | integrated graphene film |
Tensile Strength | ≥ 10 MPa | integrated graphene film |
Physical Density | ≥ 1.8 g/cm3 | integrated graphene film |
Physical Density | ≥ 2 g/cm3 | integrated graphene film |
Duration | 15–120 s | — |
Thickness | 3.35–33.5 nm | — |
Thickness | 6.7–20 nm | — |
Duration | 900–7200 s | — |
— | 140–450 W | — |
— | 3000–5000 W | — |
— | 140–300 W | — |
— | 600–2230 W | — |
Temperature | 1500–2800 °C | — |
Duration | 2–4 hours | — |
Temperature | 2500–3000 °C | — |
Thickness | ≥ 0.125 mm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1 mm | — |
— | ≥ 800 W | — |
— | ≥ 1500 W | — |
— | ≥ 1800 W | — |
— | ≥ 1600 W | — |
Thickness | 0.335–100 nm | — |
— | ≥ 600 W | — |
— | ≥ 1 W | — |
graphene oxide gel
graphene oxide binder
pristine graphene
graphitic material precursor
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
Thermal Conductivity In Plane | ≥ 1000 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 1500 W/mK | integrated graphene film |
Electrical Conductivity | ≥ 2000 S/cm | integrated graphene film |
Electrical Conductivity | ≥ 3000 S/cm | integrated graphene film |
Tensile Strength | ≥ 40 MPa | integrated graphene film |
Oxygen Content Wt Percent | 0.1–10 wt% | integrated graphene film |
Electrical Conductivity | ≥ 1500 S/cm | integrated graphene film |
Thermal Conductivity | ≥ 600 W/mK | integrated graphene film |
Physical Density | ≥ 1.4 g/cm3 | integrated graphene film |
Tensile Strength | ≥ 10 MPa | integrated graphene film |
Physical Density | ≥ 1.8 g/cm3 | integrated graphene film |
Physical Density | ≥ 2 g/cm3 | integrated graphene film |
Duration | 15–120 s | — |
Thickness | 3.35–33.5 nm | — |
Thickness | 6.7–20 nm | — |
Duration | 900–7200 s | — |
— | 140–450 W | — |
— | 3000–5000 W | — |
— | 140–300 W | — |
— | 600–2230 W | — |
Temperature | 1500–2800 °C | — |
Duration | 2–4 hours | — |
Temperature | 2500–3000 °C | — |
Thickness | ≥ 0.125 mm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1 mm | — |
— | ≥ 800 W | — |
— | ≥ 1500 W | — |
— | ≥ 1800 W | — |
— | ≥ 1600 W | — |
Thickness | 0.335–100 nm | — |
— | ≥ 600 W | — |
— | ≥ 1 W | — |
graphene oxide gel
graphene oxide binder
pristine graphene
graphitic material precursor
FIG.3 (A) Thermal conductivity, (B) electrical conductivity, and (C) tensile strength of GO gel bonded NGP composites as a function of the GO content in the …
Thermal Conductivity In Plane | ≥ 1000 W/mK | integrated graphene film |
Thermal Conductivity In Plane | ≥ 1500 W/mK | integrated graphene film |
Electrical Conductivity | ≥ 2000 S/cm | integrated graphene film |
Electrical Conductivity | ≥ 3000 S/cm | integrated graphene film |
Tensile Strength | ≥ 40 MPa | integrated graphene film |
Oxygen Content Wt Percent | 0.1–10 wt% | integrated graphene film |
Electrical Conductivity | ≥ 1500 S/cm | integrated graphene film |
Thermal Conductivity | ≥ 600 W/mK | integrated graphene film |
Physical Density | ≥ 1.4 g/cm3 | integrated graphene film |
Tensile Strength | ≥ 10 MPa | integrated graphene film |
Physical Density | ≥ 1.8 g/cm3 | integrated graphene film |
Physical Density | ≥ 2 g/cm3 | integrated graphene film |
Duration | 15–120 s | — |
Thickness | 3.35–33.5 nm | — |
Thickness | 6.7–20 nm | — |
Duration | 900–7200 s | — |
— | 140–450 W | — |
— | 3000–5000 W | — |
— | 140–300 W | — |
— | 600–2230 W | — |
Temperature | 1500–2800 °C | — |
Duration | 2–4 hours | — |
Temperature | 2500–3000 °C | — |
Thickness | ≥ 0.125 mm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 1 mm | — |
— | ≥ 800 W | — |
— | ≥ 1500 W | — |
— | ≥ 1800 W | — |
— | ≥ 1600 W | — |
Thickness | 0.335–100 nm | — |
— | ≥ 600 W | — |
— | ≥ 1 W | — |