Patent
US 9,431,573gold
Au
niobium
Nb
chromium
Cr
titanium
Ti
flexible polymer substrate
reflective material
doped silicon
Si
silicon dioxide insulating layer
SiO₂
Nb(2nm)/Pd(100nm) electrode stack
Cr(2nm)/Au(100nm) electrode stack
| 100000000 |
MoS₂ |
electron mobility for MoS2 FET with HfO2 gate oxide | 200 cm2 V-1 s-1 | MoS₂ |
Thickness | 0.5–100 nm | — |
Voltage | ≤ 1 V | — |
Thickness | ≤ 10 cm | — |
gold
Au
niobium
Nb
chromium
Cr
titanium
Ti
flexible polymer substrate
reflective material
doped silicon
Si
silicon dioxide insulating layer
SiO₂
Nb(2nm)/Pd(100nm) electrode stack
Cr(2nm)/Au(100nm) electrode stack
| 100000000 |
MoS₂ |
electron mobility for MoS2 FET with HfO2 gate oxide | 200 cm2 V-1 s-1 | MoS₂ |
Thickness | 0.5–100 nm | — |
Voltage | ≤ 1 V | — |
Thickness | ≤ 10 cm | — |
gold
Au
niobium
Nb
chromium
Cr
titanium
Ti
flexible polymer substrate
reflective material
doped silicon
Si
silicon dioxide insulating layer
SiO₂
Nb(2nm)/Pd(100nm) electrode stack
Cr(2nm)/Au(100nm) electrode stack
| 100000000 |
MoS₂ |
electron mobility for MoS2 FET with HfO2 gate oxide | 200 cm2 V-1 s-1 | MoS₂ |
Thickness | 0.5–100 nm | — |
Voltage | ≤ 1 V | — |
Thickness | ≤ 10 cm | — |
gold
Au
niobium
Nb
chromium
Cr
titanium
Ti
flexible polymer substrate
reflective material
doped silicon
Si
silicon dioxide insulating layer
SiO₂
Nb(2nm)/Pd(100nm) electrode stack
Cr(2nm)/Au(100nm) electrode stack
| 100000000 |
MoS₂ |
electron mobility for MoS2 FET with HfO2 gate oxide | 200 cm2 V-1 s-1 | MoS₂ |
Thickness | 0.5–100 nm | — |
Voltage | ≤ 1 V | — |
Thickness | ≤ 10 cm | — |