Patent
US 9,527,062substrate
highly ordered pyrolytic graphite
sapphire
silicon oxide on silicon
SiO₂/Si
Raman A1g-E2g frequency difference | 20.2–24 cm⁻¹ | MoS₂ |
surface roughness | ≤ 0.2 nm | MoS₂ |
average film thickness | 0.68–2.54 nm | MoS₂ |
film area | 1–3 cm2 | MoS₂ |
Raman A1g-E2g frequency difference (monolayer, measured) | 20.3–20.7 cm⁻¹ | MoS₂ |
Temperature | 600–900 °C | — |
Pressure | 2–10 Torr | — |
Thickness | 2–3 cm | — |
substrate
highly ordered pyrolytic graphite
sapphire
silicon oxide on silicon
SiO₂/Si
Raman A1g-E2g frequency difference | 20.2–24 cm⁻¹ | MoS₂ |
surface roughness | ≤ 0.2 nm | MoS₂ |
average film thickness | 0.68–2.54 nm | MoS₂ |
film area | 1–3 cm2 | MoS₂ |
Raman A1g-E2g frequency difference (monolayer, measured) | 20.3–20.7 cm⁻¹ | MoS₂ |
Temperature | 600–900 °C | — |
Pressure | 2–10 Torr | — |
Thickness | 2–3 cm | — |
substrate
highly ordered pyrolytic graphite
sapphire
silicon oxide on silicon
SiO₂/Si
Raman A1g-E2g frequency difference | 20.2–24 cm⁻¹ | MoS₂ |
surface roughness | ≤ 0.2 nm | MoS₂ |
average film thickness | 0.68–2.54 nm | MoS₂ |
film area | 1–3 cm2 | MoS₂ |
Raman A1g-E2g frequency difference (monolayer, measured) | 20.3–20.7 cm⁻¹ | MoS₂ |
Temperature | 600–900 °C | — |
Pressure | 2–10 Torr | — |
Thickness | 2–3 cm | — |
substrate
highly ordered pyrolytic graphite
sapphire
silicon oxide on silicon
SiO₂/Si
Raman A1g-E2g frequency difference | 20.2–24 cm⁻¹ | MoS₂ |
surface roughness | ≤ 0.2 nm | MoS₂ |
average film thickness | 0.68–2.54 nm | MoS₂ |
film area | 1–3 cm2 | MoS₂ |
Raman A1g-E2g frequency difference (monolayer, measured) | 20.3–20.7 cm⁻¹ | MoS₂ |
Temperature | 600–900 °C | — |
Pressure | 2–10 Torr | — |
Thickness | 2–3 cm | — |