Patent
US 8,284,811AlGaN first cladding layer
AlGaN
InAlGaN first cladding layer
InAlGaN
Second cladding layer semiconductor material
| ≤ 1000000 cm⁻¹ |
AlGaN |
misfit dislocation density at interface between core semiconductor region and second epitaxial semiconductor region | ≤ 1000000 cm⁻¹ | Second cladding layer semiconductor material |
lasing wavelength (lower bound) | ≥ 500 nm | InxGa(1-x)N |
lasing wavelength upper bound (claim 3) | ≤ 530 nm | InxGa(1-x)N |
sum of thicknesses of first and second optical guide layers (claim 2) | ≤ 400 nm | InxGa(1-x)NGaNInxGa(1-x)NGaN |
indium composition difference X0-X1 between active layer and first optical guide layer InGaN sub-layer (claim 4) | ≥ 0.26 dimensionless | InxGa(1-x)NInxGa(1-x)N |
indium composition X1 of first InGaN optical guide layer (claim 5) | 0.01–0.05 dimensionless | InxGa(1-x)N |
misfit dislocation density at interface between first InGaN layer and first GaN layer in first optical guide layer (claim 5) | ≤ 1000000 cm⁻¹ | InxGa(1-x)NGaN |
aluminum composition of AlGaN first cladding layer (claim 9) | ≤ 0.04 dimensionless | AlGaN |
thickness of AlGaN first cladding layer (claim 9) | ≤ 500 nm | AlGaN |
Thickness | ≥ 400 nm | — |
Thickness | ≥ 530 nm | — |
GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES
AlGaN first cladding layer
AlGaN
InAlGaN first cladding layer
InAlGaN
Second cladding layer semiconductor material
| ≤ 1000000 cm⁻¹ |
AlGaN |
misfit dislocation density at interface between core semiconductor region and second epitaxial semiconductor region | ≤ 1000000 cm⁻¹ | Second cladding layer semiconductor material |
lasing wavelength (lower bound) | ≥ 500 nm | InxGa(1-x)N |
lasing wavelength upper bound (claim 3) | ≤ 530 nm | InxGa(1-x)N |
sum of thicknesses of first and second optical guide layers (claim 2) | ≤ 400 nm | InxGa(1-x)NGaNInxGa(1-x)NGaN |
indium composition difference X0-X1 between active layer and first optical guide layer InGaN sub-layer (claim 4) | ≥ 0.26 dimensionless | InxGa(1-x)NInxGa(1-x)N |
indium composition X1 of first InGaN optical guide layer (claim 5) | 0.01–0.05 dimensionless | InxGa(1-x)N |
misfit dislocation density at interface between first InGaN layer and first GaN layer in first optical guide layer (claim 5) | ≤ 1000000 cm⁻¹ | InxGa(1-x)NGaN |
aluminum composition of AlGaN first cladding layer (claim 9) | ≤ 0.04 dimensionless | AlGaN |
thickness of AlGaN first cladding layer (claim 9) | ≤ 500 nm | AlGaN |
Thickness | ≥ 400 nm | — |
Thickness | ≥ 530 nm | — |
GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES
AlGaN first cladding layer
AlGaN
InAlGaN first cladding layer
InAlGaN
Second cladding layer semiconductor material
| ≤ 1000000 cm⁻¹ |
AlGaN |
misfit dislocation density at interface between core semiconductor region and second epitaxial semiconductor region | ≤ 1000000 cm⁻¹ | Second cladding layer semiconductor material |
lasing wavelength (lower bound) | ≥ 500 nm | InxGa(1-x)N |
lasing wavelength upper bound (claim 3) | ≤ 530 nm | InxGa(1-x)N |
sum of thicknesses of first and second optical guide layers (claim 2) | ≤ 400 nm | InxGa(1-x)NGaNInxGa(1-x)NGaN |
indium composition difference X0-X1 between active layer and first optical guide layer InGaN sub-layer (claim 4) | ≥ 0.26 dimensionless | InxGa(1-x)NInxGa(1-x)N |
indium composition X1 of first InGaN optical guide layer (claim 5) | 0.01–0.05 dimensionless | InxGa(1-x)N |
misfit dislocation density at interface between first InGaN layer and first GaN layer in first optical guide layer (claim 5) | ≤ 1000000 cm⁻¹ | InxGa(1-x)NGaN |
aluminum composition of AlGaN first cladding layer (claim 9) | ≤ 0.04 dimensionless | AlGaN |
thickness of AlGaN first cladding layer (claim 9) | ≤ 500 nm | AlGaN |
Thickness | ≥ 400 nm | — |
Thickness | ≥ 530 nm | — |
GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES
AlGaN first cladding layer
AlGaN
InAlGaN first cladding layer
InAlGaN
Second cladding layer semiconductor material
| ≤ 1000000 cm⁻¹ |
AlGaN |
misfit dislocation density at interface between core semiconductor region and second epitaxial semiconductor region | ≤ 1000000 cm⁻¹ | Second cladding layer semiconductor material |
lasing wavelength (lower bound) | ≥ 500 nm | InxGa(1-x)N |
lasing wavelength upper bound (claim 3) | ≤ 530 nm | InxGa(1-x)N |
sum of thicknesses of first and second optical guide layers (claim 2) | ≤ 400 nm | InxGa(1-x)NGaNInxGa(1-x)NGaN |
indium composition difference X0-X1 between active layer and first optical guide layer InGaN sub-layer (claim 4) | ≥ 0.26 dimensionless | InxGa(1-x)NInxGa(1-x)N |
indium composition X1 of first InGaN optical guide layer (claim 5) | 0.01–0.05 dimensionless | InxGa(1-x)N |
misfit dislocation density at interface between first InGaN layer and first GaN layer in first optical guide layer (claim 5) | ≤ 1000000 cm⁻¹ | InxGa(1-x)NGaN |
aluminum composition of AlGaN first cladding layer (claim 9) | ≤ 0.04 dimensionless | AlGaN |
thickness of AlGaN first cladding layer (claim 9) | ≤ 500 nm | AlGaN |
Thickness | ≥ 400 nm | — |
Thickness | ≥ 530 nm | — |
GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES