Patent
US 10,734,537HEMT UV photodetector with AlN interlayer (described embodiment)
electrically conducting graphene
AlGaN
GaN
semiconductor interlayer
semiconductor cap layer
AlN
intrinsic AlxGa₁-xN
AlxGa₁-xN
silicon doped AlGaN cap layer
| ≤ 1e-12 A |
| — |
UV-to-Vis ratio (visible-blind performance) | ≥ 10000 dimensionless | — |
bandgap range for UVA-UVC photodetection | 3.1–6.2 eV | photoresponsive intrinsic semiconductor |
graphene transparency at operating wavelength(s) | ≥ 99 % | electrically conducting graphene |
Voltage | 0.7–1 V | — |
Thickness | 680–1090 nm | — |
Thickness | 420–680 nm | — |
Thickness | 300–1088 nm | — |
Thickness | 800–1300 nm | — |
Thickness | ≤ 420 nm | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 50 nm | — |
Thickness | ≥ 30 nm | — |
FIELD-EFFECT TRANSISTOR WITH TWO-DIMENSIONAL CHANNEL REALIZED WITH LATERAL HETEROSTRUCTURES BASED ON HYBRIDIZED GRAPHENE
HEMT UV photodetector with AlN interlayer (described embodiment)
electrically conducting graphene
AlGaN
GaN
semiconductor interlayer
semiconductor cap layer
AlN
intrinsic AlxGa₁-xN
AlxGa₁-xN
silicon doped AlGaN cap layer
| ≤ 1e-12 A |
| — |
UV-to-Vis ratio (visible-blind performance) | ≥ 10000 dimensionless | — |
bandgap range for UVA-UVC photodetection | 3.1–6.2 eV | photoresponsive intrinsic semiconductor |
graphene transparency at operating wavelength(s) | ≥ 99 % | electrically conducting graphene |
Voltage | 0.7–1 V | — |
Thickness | 680–1090 nm | — |
Thickness | 420–680 nm | — |
Thickness | 300–1088 nm | — |
Thickness | 800–1300 nm | — |
Thickness | ≤ 420 nm | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 50 nm | — |
Thickness | ≥ 30 nm | — |
FIELD-EFFECT TRANSISTOR WITH TWO-DIMENSIONAL CHANNEL REALIZED WITH LATERAL HETEROSTRUCTURES BASED ON HYBRIDIZED GRAPHENE
HEMT UV photodetector with AlN interlayer (described embodiment)
electrically conducting graphene
AlGaN
GaN
semiconductor interlayer
semiconductor cap layer
AlN
intrinsic AlxGa₁-xN
AlxGa₁-xN
silicon doped AlGaN cap layer
| ≤ 1e-12 A |
| — |
UV-to-Vis ratio (visible-blind performance) | ≥ 10000 dimensionless | — |
bandgap range for UVA-UVC photodetection | 3.1–6.2 eV | photoresponsive intrinsic semiconductor |
graphene transparency at operating wavelength(s) | ≥ 99 % | electrically conducting graphene |
Voltage | 0.7–1 V | — |
Thickness | 680–1090 nm | — |
Thickness | 420–680 nm | — |
Thickness | 300–1088 nm | — |
Thickness | 800–1300 nm | — |
Thickness | ≤ 420 nm | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 50 nm | — |
Thickness | ≥ 30 nm | — |
FIELD-EFFECT TRANSISTOR WITH TWO-DIMENSIONAL CHANNEL REALIZED WITH LATERAL HETEROSTRUCTURES BASED ON HYBRIDIZED GRAPHENE
HEMT UV photodetector with AlN interlayer (described embodiment)
electrically conducting graphene
AlGaN
GaN
semiconductor interlayer
semiconductor cap layer
AlN
intrinsic AlxGa₁-xN
AlxGa₁-xN
silicon doped AlGaN cap layer
| ≤ 1e-12 A |
| — |
UV-to-Vis ratio (visible-blind performance) | ≥ 10000 dimensionless | — |
bandgap range for UVA-UVC photodetection | 3.1–6.2 eV | photoresponsive intrinsic semiconductor |
graphene transparency at operating wavelength(s) | ≥ 99 % | electrically conducting graphene |
Voltage | 0.7–1 V | — |
Thickness | 680–1090 nm | — |
Thickness | 420–680 nm | — |
Thickness | 300–1088 nm | — |
Thickness | 800–1300 nm | — |
Thickness | ≤ 420 nm | — |
Thickness | ≤ 2 nm | — |
Thickness | ≥ 1 nm | — |
Thickness | ≥ 50 nm | — |
Thickness | ≥ 30 nm | — |
FIELD-EFFECT TRANSISTOR WITH TWO-DIMENSIONAL CHANNEL REALIZED WITH LATERAL HETEROSTRUCTURES BASED ON HYBRIDIZED GRAPHENE