Patent
US 10,995,419METHODS AND APPARATUS FOR GALLIUM NITRIDE DEPOSITION
Brian H. BURROWS, Ala MORADIAN, Kartik SHAH, Shu-Kwan LAU
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 10,995,419Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic sectional view of a deposition system.
Figure 2 is a schematic top plan view one embodiment of a gas delivery system for the chamber of
Figure 3 is a schematic sectional view of a portion of the chamber showing components of the first injection block.
Figure 4 is a schematic sectional view of a portion of the chamber showing flow paths for a precursor gas, a flow path for a processing gas, and flow paths for a purge gas through the injection block.
Figures 5A and 5B are isometric views of a portion of the first injection block showing inner and outer zones for injecting one or more gases, respectively.
Figure 6 is a schematic top plan view of the injector plate liner showing various locations flow paths for a purge gas into a processing volume.
Figures 7A-7C are various views of one embodiment of the reflector plate that may be used with the chamber of
Figures 8A-8C are schematic sectional views of portions of the reflector plate of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a plurality of purge q as flow paths are formed in the liner assembly. Currently amended
The liner assembly of claim 1, further comprising a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The liner assembly of claim 1, further comprising a liner cover positioned over the gas injector liner. Original
The liner assembly of claim 1, further comprising an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
The liner assembly of claim 1, wherein the injector plate liner couples to an optically transparent divider. Original
Canceled
A process chamber, comprising: an optically transparent divider and an optically transparent plate positioned opposite the optically transparent divider; and a liner assembly, the liner assembly comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The process chamber of claim 10, wherein a plurality of purge gas flow paths are formed in the liner assembly. Original
The process chamber of claim 10, wherein the liner assembly further comprises a liner cover positioned over the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
A method of forming a film on a substrate, the method comprising: flowing a precursor gas through a liner assembly comprising an injector plate liner surrounding a substrate; cooling the precursor gas prior to the gas exiting the injector plate liner to a temperature of about 350 degrees Celsius; flowing a processing gas through the liner assembly and toward the substrate at a position below a flow path of the precursor gas while preventing mixing of the processing gas with the precursor gas while the gases are in the liner assembly; and heating the precursor gas to a temperature of about 400 degrees Celsius to about 1,200 degrees Celsius above the substrate. Original
The method of claim 16, wherein the liner assembly includes a cooling fluid channel is formed in an injector plate that is coupled to the injector plate liner. Original
The method of claim 16, wherein the liner assembly is coupled to an optically transparent plate. Original
The method of claim 16, further comprising flowing a purge gas through the liner assembly. Original
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; a baseplate ring positioned between the injector plate and the lower process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a first cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a second cooling fluid channel is formed in the baseplate ring. New
Layer stacks claimed or described, ordered top of device to substrate.
liner assembly
Materials described outside the worked examples.
gallium nitride
GaN
quartz
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substrate bow range for 200 mm substrate (prior art background) | 50–150 µm | GaN |
substrate bow range for 300 mm substrate (prior art background) | 50–300 µm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,995,419Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic sectional view of a deposition system.
Figure 2 is a schematic top plan view one embodiment of a gas delivery system for the chamber of
Figure 3 is a schematic sectional view of a portion of the chamber showing components of the first injection block.
Figure 4 is a schematic sectional view of a portion of the chamber showing flow paths for a precursor gas, a flow path for a processing gas, and flow paths for a purge gas through the injection block.
Figures 5A and 5B are isometric views of a portion of the first injection block showing inner and outer zones for injecting one or more gases, respectively.
Figure 6 is a schematic top plan view of the injector plate liner showing various locations flow paths for a purge gas into a processing volume.
Figures 7A-7C are various views of one embodiment of the reflector plate that may be used with the chamber of
Figures 8A-8C are schematic sectional views of portions of the reflector plate of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a plurality of purge q as flow paths are formed in the liner assembly. Currently amended
The liner assembly of claim 1, further comprising a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The liner assembly of claim 1, further comprising a liner cover positioned over the gas injector liner. Original
The liner assembly of claim 1, further comprising an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
The liner assembly of claim 1, wherein the injector plate liner couples to an optically transparent divider. Original
Canceled
A process chamber, comprising: an optically transparent divider and an optically transparent plate positioned opposite the optically transparent divider; and a liner assembly, the liner assembly comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The process chamber of claim 10, wherein a plurality of purge gas flow paths are formed in the liner assembly. Original
The process chamber of claim 10, wherein the liner assembly further comprises a liner cover positioned over the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
A method of forming a film on a substrate, the method comprising: flowing a precursor gas through a liner assembly comprising an injector plate liner surrounding a substrate; cooling the precursor gas prior to the gas exiting the injector plate liner to a temperature of about 350 degrees Celsius; flowing a processing gas through the liner assembly and toward the substrate at a position below a flow path of the precursor gas while preventing mixing of the processing gas with the precursor gas while the gases are in the liner assembly; and heating the precursor gas to a temperature of about 400 degrees Celsius to about 1,200 degrees Celsius above the substrate. Original
The method of claim 16, wherein the liner assembly includes a cooling fluid channel is formed in an injector plate that is coupled to the injector plate liner. Original
The method of claim 16, wherein the liner assembly is coupled to an optically transparent plate. Original
The method of claim 16, further comprising flowing a purge gas through the liner assembly. Original
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; a baseplate ring positioned between the injector plate and the lower process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a first cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a second cooling fluid channel is formed in the baseplate ring. New
Layer stacks claimed or described, ordered top of device to substrate.
liner assembly
Materials described outside the worked examples.
gallium nitride
GaN
quartz
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substrate bow range for 200 mm substrate (prior art background) | 50–150 µm | GaN |
substrate bow range for 300 mm substrate (prior art background) | 50–300 µm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,995,419Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic sectional view of a deposition system.
Figure 2 is a schematic top plan view one embodiment of a gas delivery system for the chamber of
Figure 3 is a schematic sectional view of a portion of the chamber showing components of the first injection block.
Figure 4 is a schematic sectional view of a portion of the chamber showing flow paths for a precursor gas, a flow path for a processing gas, and flow paths for a purge gas through the injection block.
Figures 5A and 5B are isometric views of a portion of the first injection block showing inner and outer zones for injecting one or more gases, respectively.
Figure 6 is a schematic top plan view of the injector plate liner showing various locations flow paths for a purge gas into a processing volume.
Figures 7A-7C are various views of one embodiment of the reflector plate that may be used with the chamber of
Figures 8A-8C are schematic sectional views of portions of the reflector plate of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a plurality of purge q as flow paths are formed in the liner assembly. Currently amended
The liner assembly of claim 1, further comprising a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The liner assembly of claim 1, further comprising a liner cover positioned over the gas injector liner. Original
The liner assembly of claim 1, further comprising an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
The liner assembly of claim 1, wherein the injector plate liner couples to an optically transparent divider. Original
Canceled
A process chamber, comprising: an optically transparent divider and an optically transparent plate positioned opposite the optically transparent divider; and a liner assembly, the liner assembly comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The process chamber of claim 10, wherein a plurality of purge gas flow paths are formed in the liner assembly. Original
The process chamber of claim 10, wherein the liner assembly further comprises a liner cover positioned over the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
A method of forming a film on a substrate, the method comprising: flowing a precursor gas through a liner assembly comprising an injector plate liner surrounding a substrate; cooling the precursor gas prior to the gas exiting the injector plate liner to a temperature of about 350 degrees Celsius; flowing a processing gas through the liner assembly and toward the substrate at a position below a flow path of the precursor gas while preventing mixing of the processing gas with the precursor gas while the gases are in the liner assembly; and heating the precursor gas to a temperature of about 400 degrees Celsius to about 1,200 degrees Celsius above the substrate. Original
The method of claim 16, wherein the liner assembly includes a cooling fluid channel is formed in an injector plate that is coupled to the injector plate liner. Original
The method of claim 16, wherein the liner assembly is coupled to an optically transparent plate. Original
The method of claim 16, further comprising flowing a purge gas through the liner assembly. Original
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; a baseplate ring positioned between the injector plate and the lower process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a first cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a second cooling fluid channel is formed in the baseplate ring. New
Layer stacks claimed or described, ordered top of device to substrate.
liner assembly
Materials described outside the worked examples.
gallium nitride
GaN
quartz
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substrate bow range for 200 mm substrate (prior art background) | 50–150 µm | GaN |
substrate bow range for 300 mm substrate (prior art background) | 50–300 µm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,995,419Patent drawings and their descriptions. Click a drawing to enlarge it.
Figure 1 is a schematic sectional view of a deposition system.
Figure 2 is a schematic top plan view one embodiment of a gas delivery system for the chamber of
Figure 3 is a schematic sectional view of a portion of the chamber showing components of the first injection block.
Figure 4 is a schematic sectional view of a portion of the chamber showing flow paths for a precursor gas, a flow path for a processing gas, and flow paths for a purge gas through the injection block.
Figures 5A and 5B are isometric views of a portion of the first injection block showing inner and outer zones for injecting one or more gases, respectively.
Figure 6 is a schematic top plan view of the injector plate liner showing various locations flow paths for a purge gas into a processing volume.
Figures 7A-7C are various views of one embodiment of the reflector plate that may be used with the chamber of
Figures 8A-8C are schematic sectional views of portions of the reflector plate of
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a plurality of purge q as flow paths are formed in the liner assembly. Currently amended
The liner assembly of claim 1, further comprising a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The liner assembly of claim 1, further comprising a liner cover positioned over the gas injector liner. Original
The liner assembly of claim 1, further comprising an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
The liner assembly of claim 1, wherein the injector plate liner couples to an optically transparent divider. Original
Canceled
A process chamber, comprising: an optically transparent divider and an optically transparent plate positioned opposite the optically transparent divider; and a liner assembly, the liner assembly comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises a baseplate ring positioned between the injector plate and the lower process gas liner. Original
The process chamber of claim 10, wherein a plurality of purge gas flow paths are formed in the liner assembly. Original
The process chamber of claim 10, wherein the liner assembly further comprises a liner cover positioned over the gas injector liner. Original
The process chamber of claim 10, wherein the liner assembly further comprises an inject baffle positioned between the upper process gas liner and the lower process gas liner. Original
A method of forming a film on a substrate, the method comprising: flowing a precursor gas through a liner assembly comprising an injector plate liner surrounding a substrate; cooling the precursor gas prior to the gas exiting the injector plate liner to a temperature of about 350 degrees Celsius; flowing a processing gas through the liner assembly and toward the substrate at a position below a flow path of the precursor gas while preventing mixing of the processing gas with the precursor gas while the gases are in the liner assembly; and heating the precursor gas to a temperature of about 400 degrees Celsius to about 1,200 degrees Celsius above the substrate. Original
The method of claim 16, wherein the liner assembly includes a cooling fluid channel is formed in an injector plate that is coupled to the injector plate liner. Original
The method of claim 16, wherein the liner assembly is coupled to an optically transparent plate. Original
The method of claim 16, further comprising flowing a purge gas through the liner assembly. Original
A liner assembly, comprising: an injector plate liner; a gas injector liner coupled to the injector plate liner; an upper process gas liner coupled to the gas injector liner; a lower process gas liner coupled to the upper process gas liner; a baseplate ring positioned between the injector plate and the lower process gas liner; and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a first cooling fluid channel is formed in the injector plate adjacent to the gas injector liner, and wherein a second cooling fluid channel is formed in the baseplate ring. New
Layer stacks claimed or described, ordered top of device to substrate.
liner assembly
Materials described outside the worked examples.
gallium nitride
GaN
quartz
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
substrate bow range for 200 mm substrate (prior art background) | 50–150 µm | GaN |
substrate bow range for 300 mm substrate (prior art background) | 50–300 µm |
Related documents with shared materials, methods, properties, or citations.
process chamber
deposition system
copper
Cu
gold
Au
silicon
Si
substrate bow less than 50 µm achievable with disclosed methods/systems | 0–50 µm | GaN |
optically transparent divider temperature less than ~400°C during processing | ≤ 400 °C | quartz |
Pressure | ≤ 500 Torr | — |
process chamber
deposition system
copper
Cu
gold
Au
silicon
Si
substrate bow less than 50 µm achievable with disclosed methods/systems | 0–50 µm | GaN |
optically transparent divider temperature less than ~400°C during processing | ≤ 400 °C | quartz |
Pressure | ≤ 500 Torr | — |
process chamber
deposition system
copper
Cu
gold
Au
silicon
Si
substrate bow less than 50 µm achievable with disclosed methods/systems | 0–50 µm | GaN |
optically transparent divider temperature less than ~400°C during processing | ≤ 400 °C | quartz |
Pressure | ≤ 500 Torr | — |
process chamber
deposition system
copper
Cu
gold
Au
silicon
Si
substrate bow less than 50 µm achievable with disclosed methods/systems | 0–50 µm | GaN |
optically transparent divider temperature less than ~400°C during processing | ≤ 400 °C | quartz |
Pressure | ≤ 500 Torr | — |