Patent
US 9,042,683optical modulator with planar graphene layers parallel to semiconductor bottom surface
optical modulator base structure (described embodiment)
second insulating layer
silicon oxide
SiO₂
aluminum oxide
Al₂O₃
silicon nitride
Si₃N₄
boron nitride
BN
hexagonal boron nitride
h-BN
semiconductor layer
third insulating layer
silicon
Si
germanium
Ge
amorphous silicon layer
a-Si
oxide layer (buried oxide)
substrate
| — |
Thickness | ≥ 1 nm | — |
optical modulator with planar graphene layers parallel to semiconductor bottom surface
optical modulator base structure (described embodiment)
second insulating layer
silicon oxide
SiO₂
aluminum oxide
Al₂O₃
silicon nitride
Si₃N₄
boron nitride
BN
hexagonal boron nitride
h-BN
semiconductor layer
third insulating layer
silicon
Si
germanium
Ge
amorphous silicon layer
a-Si
oxide layer (buried oxide)
substrate
| — |
Thickness | ≥ 1 nm | — |
optical modulator with planar graphene layers parallel to semiconductor bottom surface
optical modulator base structure (described embodiment)
second insulating layer
silicon oxide
SiO₂
aluminum oxide
Al₂O₃
silicon nitride
Si₃N₄
boron nitride
BN
hexagonal boron nitride
h-BN
semiconductor layer
third insulating layer
silicon
Si
germanium
Ge
amorphous silicon layer
a-Si
oxide layer (buried oxide)
substrate
| — |
Thickness | ≥ 1 nm | — |
optical modulator with planar graphene layers parallel to semiconductor bottom surface
optical modulator base structure (described embodiment)
second insulating layer
silicon oxide
SiO₂
aluminum oxide
Al₂O₃
silicon nitride
Si₃N₄
boron nitride
BN
hexagonal boron nitride
h-BN
semiconductor layer
third insulating layer
silicon
Si
germanium
Ge
amorphous silicon layer
a-Si
oxide layer (buried oxide)
substrate
| — |
Thickness | ≥ 1 nm | — |