Patent
US 10,337,102dihydrogen
H₂
metallic thin layer
platinum
Pt
copper
Cu
titanium
Ti
nickel
Ni
platinum-iridium alloy
silicon
Si
chromium adhesion layer
Cr
| — |
Thickness | 100–400 nm | — |
dihydrogen
H₂
metallic thin layer
platinum
Pt
copper
Cu
titanium
Ti
nickel
Ni
platinum-iridium alloy
silicon
Si
chromium adhesion layer
Cr
| — |
Thickness | 100–400 nm | — |
dihydrogen
H₂
metallic thin layer
platinum
Pt
copper
Cu
titanium
Ti
nickel
Ni
platinum-iridium alloy
silicon
Si
chromium adhesion layer
Cr
| — |
Thickness | 100–400 nm | — |
dihydrogen
H₂
metallic thin layer
platinum
Pt
copper
Cu
titanium
Ti
nickel
Ni
platinum-iridium alloy
silicon
Si
chromium adhesion layer
Cr
| — |
Thickness | 100–400 nm | — |