Research paper
Experimental Characterization| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Raman Peak | E12g | 383cm⁻¹ | — | |||
| Raman Peak | A1g | 408cm⁻¹ | — | |||
| Raman Mode Separation | E12g-A1g separation | 25cm⁻¹ | — | |||
| Stm Step Height | interlayer step | 0.65nm | — | |||
| Stm Lattice Constant | hexagonal lattice constant a | 3.15angstrom | — | |||
| Defect Concentration | surface defect concentration | 110000000000cm⁻² | — | |||
| Defect Concentration | bulk defect concentration | 1700000000000000000cm⁻³ | — | |||
| Carrier Density | n-type carrier density | 13000000000000000000cm⁻³ | — | |||
| Afm Rms Roughness | RMS roughness | 0.31nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.312nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.307nm | — | |||
| Stm Feature Energy | ionization ring deepest energy | 0.24eV | — | |||
| Stm Feature Distance | ring disappearance distance | 1.8nm | — | |||
| Stm Feature Distance | edge profile distance from defect center | 2.5nm | — | |||
| Defect Size | depression-like defect diameter | 4nm | — | |||
| Defect Depth | depression depth | 40pm | — | |||
| Xps Binding Energy | Mo 3d5/2 | 230eV | — | |||
| Xps Binding Energy | S 2p | 227.1eV | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Raman Peak | E12g | 383cm⁻¹ | — | |||
| Raman Peak | A1g | 408cm⁻¹ | — | |||
| Raman Mode Separation | E12g-A1g separation | 25cm⁻¹ | — | |||
| Stm Step Height | interlayer step | 0.65nm | — | |||
| Stm Lattice Constant | hexagonal lattice constant a | 3.15angstrom | — | |||
| Defect Concentration | surface defect concentration | 110000000000cm⁻² | — | |||
| Defect Concentration | bulk defect concentration | 1700000000000000000cm⁻³ | — | |||
| Carrier Density | n-type carrier density | 13000000000000000000cm⁻³ | — | |||
| Afm Rms Roughness | RMS roughness | 0.31nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.312nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.307nm | — | |||
| Stm Feature Energy | ionization ring deepest energy | 0.24eV | — | |||
| Stm Feature Distance | ring disappearance distance | 1.8nm | — | |||
| Stm Feature Distance | edge profile distance from defect center | 2.5nm | — | |||
| Defect Size | depression-like defect diameter | 4nm | — | |||
| Defect Depth | depression depth | 40pm | — | |||
| Xps Binding Energy | Mo 3d5/2 | 230eV | — | |||
| Xps Binding Energy | S 2p | 227.1eV | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Raman Peak | E12g | 383cm⁻¹ | — | |||
| Raman Peak | A1g | 408cm⁻¹ | — | |||
| Raman Mode Separation | E12g-A1g separation | 25cm⁻¹ | — | |||
| Stm Step Height | interlayer step | 0.65nm | — | |||
| Stm Lattice Constant | hexagonal lattice constant a | 3.15angstrom | — | |||
| Defect Concentration | surface defect concentration | 110000000000cm⁻² | — | |||
| Defect Concentration | bulk defect concentration | 1700000000000000000cm⁻³ | — | |||
| Carrier Density | n-type carrier density | 13000000000000000000cm⁻³ | — | |||
| Afm Rms Roughness | RMS roughness | 0.31nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.312nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.307nm | — | |||
| Stm Feature Energy | ionization ring deepest energy | 0.24eV | — | |||
| Stm Feature Distance | ring disappearance distance | 1.8nm | — | |||
| Stm Feature Distance | edge profile distance from defect center | 2.5nm | — | |||
| Defect Size | depression-like defect diameter | 4nm | — | |||
| Defect Depth | depression depth | 40pm | — | |||
| Xps Binding Energy | Mo 3d5/2 | 230eV | — | |||
| Xps Binding Energy | S 2p | 227.1eV | — |
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Raman Peak | E12g | 383cm⁻¹ | — | |||
| Raman Peak | A1g | 408cm⁻¹ | — | |||
| Raman Mode Separation | E12g-A1g separation | 25cm⁻¹ | — | |||
| Stm Step Height | interlayer step | 0.65nm | — | |||
| Stm Lattice Constant | hexagonal lattice constant a | 3.15angstrom | — | |||
| Defect Concentration | surface defect concentration | 110000000000cm⁻² | — | |||
| Defect Concentration | bulk defect concentration | 1700000000000000000cm⁻³ | — | |||
| Carrier Density | n-type carrier density | 13000000000000000000cm⁻³ | — | |||
| Afm Rms Roughness | RMS roughness | 0.31nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.312nm | — | |||
| Afm Rms Roughness | RMS roughness | 0.307nm | — | |||
| Stm Feature Energy | ionization ring deepest energy | 0.24eV | — | |||
| Stm Feature Distance | ring disappearance distance | 1.8nm | — | |||
| Stm Feature Distance | edge profile distance from defect center | 2.5nm | — | |||
| Defect Size | depression-like defect diameter | 4nm | — | |||
| Defect Depth | depression depth | 40pm | — | |||
| Xps Binding Energy | Mo 3d5/2 | 230eV | — | |||
| Xps Binding Energy | S 2p | 227.1eV | — |