MITSUBISHI CHEMICAL CORPORATION, Tokyo (JP)·Jul. 8, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 is a perspective view that illustrates an n-type GaN 45 crystal according to one embodiment.
FIG. 2
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
FIG. 3
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 4
FIG. 4 is a perspective view that illustrates a GaN wafer according to one embodiment.
FIG. 5
FIG. 5 may be produced through the steps of completing a c-plane GaN wafer composed of UID-GaN and subsequently growing an ID-GaN layer on the Ga-polar main …
FIG. 6
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 8
FIG. 8 is a perspective view that illustrates one example of a bilayer GaN wafer. 60
FIG. 9
FIG. 9. The procedures were generally as follows. B₂ First, the seed was set on the susceptor.An edge cover was not used. Next, while supplying N2, H₂ and NH₃ …
FIG. 10
FIG. 10A. B₂
FIG. 11
FIG. 11 is a cross-sectional view illustrating a state where a seed and an edge cover are set on a susceptor.
FIG. 12
FIG. 12 was used for growing a GaN crystal by an ammonothermal method. This crystal growth apparatus is provided with an autoclave, and a capsule which is made …
FIG. 13
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 14
FIG. 14 is a drawing that illustrates the constitution of the sample produced in Experiment 6, and the direction of observing a three-photon excitation image …
FIG. 15
FIG. 15, when the normal direction of the first main surface 21 is the z-direction and the vector parallel to the c-axis is “vector Vc”, the off-cut angle of …
FIG. 16
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 22 dependent
1
IndependentGaN
An n-type GaN crystal, wherein Ge is a donor impurity contained in the n-type GaN crystal at the highest concentration, and the n-type GaN crystal has a room-temperature resistivity of lower than 0.03 Ω·cm and a (004) XRD rocking curve FWHM of less than 20 arcsec.
2
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, the two main surfaces each have an area of 3 cm2 or larger, and one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane.
4
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along at least one line over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points is 20 arcsec or less.
6
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along each of at least two lines perpendicular to one another over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points on each line is 20 arcsec or less.
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN wafer (single region)
GaNn-type GaN crystal substrate
GaN wafer (two-region structure)
GaNfirst region (Ga-polar side, n-type GaN)
GaNsecond region (N-polar side, lower carrier concentration)
Materials
Materials described outside the worked examples.
n-type GaN crystal (Ge-doped)
GaN
N-Type Semiconductor Crystal With Ge As Primary Donor Impurity
Second Region Of GaN Wafer With Lower Carrier Concentration On N-Polar Side
Process steps
Additional fabrication and treatment steps described in the patent.
1
Hvpe Growth
Step 1
Process details
dopant:Ge
method:HVPE (Hydride Vapor-Phase Epitaxy)
Materials:GaN
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
xrd
XRD
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
MITSUBISHI CHEMICAL CORPORATION, Tokyo (JP)·Jul. 8, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 is a perspective view that illustrates an n-type GaN 45 crystal according to one embodiment.
FIG. 2
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
FIG. 3
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 4
FIG. 4 is a perspective view that illustrates a GaN wafer according to one embodiment.
FIG. 5
FIG. 5 may be produced through the steps of completing a c-plane GaN wafer composed of UID-GaN and subsequently growing an ID-GaN layer on the Ga-polar main …
FIG. 6
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 8
FIG. 8 is a perspective view that illustrates one example of a bilayer GaN wafer. 60
FIG. 9
FIG. 9. The procedures were generally as follows. B₂ First, the seed was set on the susceptor.An edge cover was not used. Next, while supplying N2, H₂ and NH₃ …
FIG. 10
FIG. 10A. B₂
FIG. 11
FIG. 11 is a cross-sectional view illustrating a state where a seed and an edge cover are set on a susceptor.
FIG. 12
FIG. 12 was used for growing a GaN crystal by an ammonothermal method. This crystal growth apparatus is provided with an autoclave, and a capsule which is made …
FIG. 13
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 14
FIG. 14 is a drawing that illustrates the constitution of the sample produced in Experiment 6, and the direction of observing a three-photon excitation image …
FIG. 15
FIG. 15, when the normal direction of the first main surface 21 is the z-direction and the vector parallel to the c-axis is “vector Vc”, the off-cut angle of …
FIG. 16
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 22 dependent
1
IndependentGaN
An n-type GaN crystal, wherein Ge is a donor impurity contained in the n-type GaN crystal at the highest concentration, and the n-type GaN crystal has a room-temperature resistivity of lower than 0.03 Ω·cm and a (004) XRD rocking curve FWHM of less than 20 arcsec.
2
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, the two main surfaces each have an area of 3 cm2 or larger, and one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane.
4
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along at least one line over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points is 20 arcsec or less.
6
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along each of at least two lines perpendicular to one another over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points on each line is 20 arcsec or less.
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN wafer (single region)
GaNn-type GaN crystal substrate
GaN wafer (two-region structure)
GaNfirst region (Ga-polar side, n-type GaN)
GaNsecond region (N-polar side, lower carrier concentration)
Materials
Materials described outside the worked examples.
n-type GaN crystal (Ge-doped)
GaN
N-Type Semiconductor Crystal With Ge As Primary Donor Impurity
Second Region Of GaN Wafer With Lower Carrier Concentration On N-Polar Side
Process steps
Additional fabrication and treatment steps described in the patent.
1
Hvpe Growth
Step 1
Process details
dopant:Ge
method:HVPE (Hydride Vapor-Phase Epitaxy)
Materials:GaN
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
xrd
XRD
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
MITSUBISHI CHEMICAL CORPORATION, Tokyo (JP)·Jul. 8, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 is a perspective view that illustrates an n-type GaN 45 crystal according to one embodiment.
FIG. 2
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
FIG. 3
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 4
FIG. 4 is a perspective view that illustrates a GaN wafer according to one embodiment.
FIG. 5
FIG. 5 may be produced through the steps of completing a c-plane GaN wafer composed of UID-GaN and subsequently growing an ID-GaN layer on the Ga-polar main …
FIG. 6
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 8
FIG. 8 is a perspective view that illustrates one example of a bilayer GaN wafer. 60
FIG. 9
FIG. 9. The procedures were generally as follows. B₂ First, the seed was set on the susceptor.An edge cover was not used. Next, while supplying N2, H₂ and NH₃ …
FIG. 10
FIG. 10A. B₂
FIG. 11
FIG. 11 is a cross-sectional view illustrating a state where a seed and an edge cover are set on a susceptor.
FIG. 12
FIG. 12 was used for growing a GaN crystal by an ammonothermal method. This crystal growth apparatus is provided with an autoclave, and a capsule which is made …
FIG. 13
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 14
FIG. 14 is a drawing that illustrates the constitution of the sample produced in Experiment 6, and the direction of observing a three-photon excitation image …
FIG. 15
FIG. 15, when the normal direction of the first main surface 21 is the z-direction and the vector parallel to the c-axis is “vector Vc”, the off-cut angle of …
FIG. 16
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 22 dependent
1
IndependentGaN
An n-type GaN crystal, wherein Ge is a donor impurity contained in the n-type GaN crystal at the highest concentration, and the n-type GaN crystal has a room-temperature resistivity of lower than 0.03 Ω·cm and a (004) XRD rocking curve FWHM of less than 20 arcsec.
2
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, the two main surfaces each have an area of 3 cm2 or larger, and one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane.
4
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along at least one line over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points is 20 arcsec or less.
6
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along each of at least two lines perpendicular to one another over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points on each line is 20 arcsec or less.
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN wafer (single region)
GaNn-type GaN crystal substrate
GaN wafer (two-region structure)
GaNfirst region (Ga-polar side, n-type GaN)
GaNsecond region (N-polar side, lower carrier concentration)
Materials
Materials described outside the worked examples.
n-type GaN crystal (Ge-doped)
GaN
N-Type Semiconductor Crystal With Ge As Primary Donor Impurity
Second Region Of GaN Wafer With Lower Carrier Concentration On N-Polar Side
Process steps
Additional fabrication and treatment steps described in the patent.
1
Hvpe Growth
Step 1
Process details
dopant:Ge
method:HVPE (Hydride Vapor-Phase Epitaxy)
Materials:GaN
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
xrd
XRD
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
MITSUBISHI CHEMICAL CORPORATION, Tokyo (JP)·Jul. 8, 2025·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1 is a perspective view that illustrates an n-type GaN 45 crystal according to one embodiment.
FIG. 2
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
FIG. 3
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 4
FIG. 4 is a perspective view that illustrates a GaN wafer according to one embodiment.
FIG. 5
FIG. 5 may be produced through the steps of completing a c-plane GaN wafer composed of UID-GaN and subsequently growing an ID-GaN layer on the Ga-polar main …
FIG. 6
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 8
FIG. 8 is a perspective view that illustrates one example of a bilayer GaN wafer. 60
FIG. 9
FIG. 9. The procedures were generally as follows. B₂ First, the seed was set on the susceptor.An edge cover was not used. Next, while supplying N2, H₂ and NH₃ …
FIG. 10
FIG. 10A. B₂
FIG. 11
FIG. 11 is a cross-sectional view illustrating a state where a seed and an edge cover are set on a susceptor.
FIG. 12
FIG. 12 was used for growing a GaN crystal by an ammonothermal method. This crystal growth apparatus is provided with an autoclave, and a capsule which is made …
FIG. 13
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 14
FIG. 14 is a drawing that illustrates the constitution of the sample produced in Experiment 6, and the direction of observing a three-photon excitation image …
FIG. 15
FIG. 15, when the normal direction of the first main surface 21 is the z-direction and the vector parallel to the c-axis is “vector Vc”, the off-cut angle of …
FIG. 16
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 22 dependent
1
IndependentGaN
An n-type GaN crystal, wherein Ge is a donor impurity contained in the n-type GaN crystal at the highest concentration, and the n-type GaN crystal has a room-temperature resistivity of lower than 0.03 Ω·cm and a (004) XRD rocking curve FWHM of less than 20 arcsec.
2
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, the two main surfaces each have an area of 3 cm2 or larger, and one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane.
4
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along at least one line over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points is 20 arcsec or less.
6
Dependent← claim 1GaN
The n-type GaN crystal according to claim 1, wherein the n-type GaN crystal has two main surfaces facing opposite directions from each other, one of the two main surfaces has a Ga polarity and is inclined at an angle of 0° to 10° with respect to a (0001) crystal plane, and when a (004) XRD rocking curve is measured on the one of the two main surfaces along each of at least two lines perpendicular to one another over a length of 40 mm at 1-mm intervals, a maximum value of a (004) XRD rocking curve FWHM among all measurement points on each line is 20 arcsec or less.
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN wafer (single region)
GaNn-type GaN crystal substrate
GaN wafer (two-region structure)
GaNfirst region (Ga-polar side, n-type GaN)
GaNsecond region (N-polar side, lower carrier concentration)
Materials
Materials described outside the worked examples.
n-type GaN crystal (Ge-doped)
GaN
N-Type Semiconductor Crystal With Ge As Primary Donor Impurity
Second Region Of GaN Wafer With Lower Carrier Concentration On N-Polar Side
Process steps
Additional fabrication and treatment steps described in the patent.
1
Hvpe Growth
Step 1
Process details
dopant:Ge
method:HVPE (Hydride Vapor-Phase Epitaxy)
Materials:GaN
Characterization
Measurements and analyses referenced in the patent, with their drawing references.
xrd
XRD
FIG. 2, by performing ω-scan under the above-described conditions along a single line L on the first main surface 11 over a length of 40 mm at 1-mm intervals, a …
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
(002) XRD rocking curve FWHM of Si-doped GaN grown by HVPE (background reference)
32 arcsec
—
(002) XRD rocking curve FWHM of Ge-doped GaN grown by HVPE (background reference)
67 arcsec
—
(200) XRD rocking curve FWHM of m-plane HVPE GaN wafer at center (background reference)
13 arcsec
—
Thickness
5–250 µm
—
examiner
US 2009/0081110 A12009/0081110 A1 3/2009 Shibata et al.
US 2009/0127664 A12009/0127664 A1 5/2009 Okahisa et al.
US 2012/0034149 A12012/0034149 A1 2/2012 Fujiwara et al.
US 2012/0326169 A12012/0326169 A1 12/2012 Sakai et al.
US 2017/0327971 A12017/0327971 A1 11/2017 Fujisawa et al.
US 2019/0189438 A12019/0189438 A1 6/2019 Mikawa et al.
JP 2009126723 AJP 2009126723 A 6/2009
JP 2009269816 AJP 2009269816 A 11/2009
JP 2011256082 AJP 2011256082 A 12/2011
JP 2015214441 AJP 2015214441 A 12/2015
Cited non-patent literature · 6
Combined Chinese Office Action and Search Report issued Aug. 10, 2022 in Patent Application No. 201980053810.4 (with English translation).
Combined Chinese Office Action and Search Report issued Jan. 29, 2022 in Patent Application No. 201980053810.4 (with English translation), 20 pages. Combined Taiwanese Office Action and Search Report issued Nov. 27, 2023 in Patent Application No. 108126120 (with English translation), 78 pages. Extended European Search Report issued Sep. 21, 2021 in Patent Application No. 19849371.0, 11 pages.
HVPE GaN wafers with improved crystalline and electrical properties. Freitas et al., “HVPE GaN wafers with improved crystalline and electrical properties”, Journal of Crystal Growth, vol. 456, XP029836153, 2016, pp. 113-120.
Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN. H. Amano, “Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN”, Japanese Journal of Applied Physics, 52, 2013, 050001-1-050001-10. International Preliminary Report on Patentability and Written Opin- ion issued Feb. 23, 2021 in PCT/JP2019/028991 (English transla- tion only), 23 pages. International Search Report issued Oct. 21, 2019 in PCT/JP2019/028991 (English translation only), 6 pages. Iwinska, M. et al., “Crystal growth of HVPE-GaN doped with germanium”, Journal of Crystal Growth, 2017, vol. 480, pp. 102- 107. Iwinska, M. et al., “Homoepitaxial growth of HVPE-GaN doped with Si”, Journal of Crystal Growth, 2016, vol. 456, pp. 91-96.
Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates. J. Z. Domagala et al., “Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates”, Journal of Crystal Growth, 2016, vol. 456, pp. 80-85. Office Action issued Apr. 5, 2022 in Japanese Patent Application No. 2021-007728 (with English machine translation), 19 pages. Office Action issued Mar. 5, 2024 in Japanese Patent Application No. 2020-537396 (with machine English translation), 7 pages. Office Action issued Sep. 5, 2023 in Japanese Patent Application No. 2020-537396 (with English translation), 15 pages.
High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds. Y. Tsukada et al., “High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds”, Japanese Journal of Applied Physics, 55, 2016, 05FC01-1-05FC01-5. Office Action issued Mar. 22, 2024 in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English transla- tion), 49 pages. Office Action issued Mar. 28, 2024 in corresponding European Patent Application No. 19849371.0, 7 pages. Final Office Action issued Dec. 30, 2024, in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English translation), 8 pages.
characterization XRDproperty XRD structurematerial GaN
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
(002) XRD rocking curve FWHM of Si-doped GaN grown by HVPE (background reference)
32 arcsec
—
(002) XRD rocking curve FWHM of Ge-doped GaN grown by HVPE (background reference)
67 arcsec
—
(200) XRD rocking curve FWHM of m-plane HVPE GaN wafer at center (background reference)
13 arcsec
—
Thickness
5–250 µm
—
examiner
US 2009/0081110 A12009/0081110 A1 3/2009 Shibata et al.
US 2009/0127664 A12009/0127664 A1 5/2009 Okahisa et al.
US 2012/0034149 A12012/0034149 A1 2/2012 Fujiwara et al.
US 2012/0326169 A12012/0326169 A1 12/2012 Sakai et al.
US 2017/0327971 A12017/0327971 A1 11/2017 Fujisawa et al.
US 2019/0189438 A12019/0189438 A1 6/2019 Mikawa et al.
JP 2009126723 AJP 2009126723 A 6/2009
JP 2009269816 AJP 2009269816 A 11/2009
JP 2011256082 AJP 2011256082 A 12/2011
JP 2015214441 AJP 2015214441 A 12/2015
Cited non-patent literature · 6
Combined Chinese Office Action and Search Report issued Aug. 10, 2022 in Patent Application No. 201980053810.4 (with English translation).
Combined Chinese Office Action and Search Report issued Jan. 29, 2022 in Patent Application No. 201980053810.4 (with English translation), 20 pages. Combined Taiwanese Office Action and Search Report issued Nov. 27, 2023 in Patent Application No. 108126120 (with English translation), 78 pages. Extended European Search Report issued Sep. 21, 2021 in Patent Application No. 19849371.0, 11 pages.
HVPE GaN wafers with improved crystalline and electrical properties. Freitas et al., “HVPE GaN wafers with improved crystalline and electrical properties”, Journal of Crystal Growth, vol. 456, XP029836153, 2016, pp. 113-120.
Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN. H. Amano, “Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN”, Japanese Journal of Applied Physics, 52, 2013, 050001-1-050001-10. International Preliminary Report on Patentability and Written Opin- ion issued Feb. 23, 2021 in PCT/JP2019/028991 (English transla- tion only), 23 pages. International Search Report issued Oct. 21, 2019 in PCT/JP2019/028991 (English translation only), 6 pages. Iwinska, M. et al., “Crystal growth of HVPE-GaN doped with germanium”, Journal of Crystal Growth, 2017, vol. 480, pp. 102- 107. Iwinska, M. et al., “Homoepitaxial growth of HVPE-GaN doped with Si”, Journal of Crystal Growth, 2016, vol. 456, pp. 91-96.
Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates. J. Z. Domagala et al., “Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates”, Journal of Crystal Growth, 2016, vol. 456, pp. 80-85. Office Action issued Apr. 5, 2022 in Japanese Patent Application No. 2021-007728 (with English machine translation), 19 pages. Office Action issued Mar. 5, 2024 in Japanese Patent Application No. 2020-537396 (with machine English translation), 7 pages. Office Action issued Sep. 5, 2023 in Japanese Patent Application No. 2020-537396 (with English translation), 15 pages.
High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds. Y. Tsukada et al., “High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds”, Japanese Journal of Applied Physics, 55, 2016, 05FC01-1-05FC01-5. Office Action issued Mar. 22, 2024 in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English transla- tion), 49 pages. Office Action issued Mar. 28, 2024 in corresponding European Patent Application No. 19849371.0, 7 pages. Final Office Action issued Dec. 30, 2024, in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English translation), 8 pages.
characterization XRDproperty XRD structurematerial GaN
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
(002) XRD rocking curve FWHM of Si-doped GaN grown by HVPE (background reference)
32 arcsec
—
(002) XRD rocking curve FWHM of Ge-doped GaN grown by HVPE (background reference)
67 arcsec
—
(200) XRD rocking curve FWHM of m-plane HVPE GaN wafer at center (background reference)
13 arcsec
—
Thickness
5–250 µm
—
examiner
US 2009/0081110 A12009/0081110 A1 3/2009 Shibata et al.
US 2009/0127664 A12009/0127664 A1 5/2009 Okahisa et al.
US 2012/0034149 A12012/0034149 A1 2/2012 Fujiwara et al.
US 2012/0326169 A12012/0326169 A1 12/2012 Sakai et al.
US 2017/0327971 A12017/0327971 A1 11/2017 Fujisawa et al.
US 2019/0189438 A12019/0189438 A1 6/2019 Mikawa et al.
JP 2009126723 AJP 2009126723 A 6/2009
JP 2009269816 AJP 2009269816 A 11/2009
JP 2011256082 AJP 2011256082 A 12/2011
JP 2015214441 AJP 2015214441 A 12/2015
Cited non-patent literature · 6
Combined Chinese Office Action and Search Report issued Aug. 10, 2022 in Patent Application No. 201980053810.4 (with English translation).
Combined Chinese Office Action and Search Report issued Jan. 29, 2022 in Patent Application No. 201980053810.4 (with English translation), 20 pages. Combined Taiwanese Office Action and Search Report issued Nov. 27, 2023 in Patent Application No. 108126120 (with English translation), 78 pages. Extended European Search Report issued Sep. 21, 2021 in Patent Application No. 19849371.0, 11 pages.
HVPE GaN wafers with improved crystalline and electrical properties. Freitas et al., “HVPE GaN wafers with improved crystalline and electrical properties”, Journal of Crystal Growth, vol. 456, XP029836153, 2016, pp. 113-120.
Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN. H. Amano, “Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN”, Japanese Journal of Applied Physics, 52, 2013, 050001-1-050001-10. International Preliminary Report on Patentability and Written Opin- ion issued Feb. 23, 2021 in PCT/JP2019/028991 (English transla- tion only), 23 pages. International Search Report issued Oct. 21, 2019 in PCT/JP2019/028991 (English translation only), 6 pages. Iwinska, M. et al., “Crystal growth of HVPE-GaN doped with germanium”, Journal of Crystal Growth, 2017, vol. 480, pp. 102- 107. Iwinska, M. et al., “Homoepitaxial growth of HVPE-GaN doped with Si”, Journal of Crystal Growth, 2016, vol. 456, pp. 91-96.
Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates. J. Z. Domagala et al., “Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates”, Journal of Crystal Growth, 2016, vol. 456, pp. 80-85. Office Action issued Apr. 5, 2022 in Japanese Patent Application No. 2021-007728 (with English machine translation), 19 pages. Office Action issued Mar. 5, 2024 in Japanese Patent Application No. 2020-537396 (with machine English translation), 7 pages. Office Action issued Sep. 5, 2023 in Japanese Patent Application No. 2020-537396 (with English translation), 15 pages.
High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds. Y. Tsukada et al., “High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds”, Japanese Journal of Applied Physics, 55, 2016, 05FC01-1-05FC01-5. Office Action issued Mar. 22, 2024 in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English transla- tion), 49 pages. Office Action issued Mar. 28, 2024 in corresponding European Patent Application No. 19849371.0, 7 pages. Final Office Action issued Dec. 30, 2024, in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English translation), 8 pages.
characterization XRDproperty XRD structurematerial GaN
FIG. 3, on the first main surface 11 over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained 10 at 40 measurement points that are …
FIG. 6, by performing a ω-scan along a single line L on the first main surface 21 of the wafer 20 over B₂ a length of 40 mm at 1-mm intervals, a (004) XRD …
FIG. 7, over a length of 40 mm at 1-mm intervals, a (004) XRD rocking curve can be obtained at 40 measurement points that are aligned at a pitch of 1 mm on the …
FIG. 13. Next, a second c-plane GaN wafer having a thickness of 0.4 mm was formed by processing the thus grown GaN 50 crystal layer. A Ga-polar surface of the …
FIG. 16 is a transmission X-ray topographic image (draw- ing substitute) having a square area of 20 mm×20 mm, which was obtained in Experiment 7 from a c-plane …
(002) XRD rocking curve FWHM of Si-doped GaN grown by HVPE (background reference)
32 arcsec
—
(002) XRD rocking curve FWHM of Ge-doped GaN grown by HVPE (background reference)
67 arcsec
—
(200) XRD rocking curve FWHM of m-plane HVPE GaN wafer at center (background reference)
13 arcsec
—
Thickness
5–250 µm
—
examiner
US 2009/0081110 A12009/0081110 A1 3/2009 Shibata et al.
US 2009/0127664 A12009/0127664 A1 5/2009 Okahisa et al.
US 2012/0034149 A12012/0034149 A1 2/2012 Fujiwara et al.
US 2012/0326169 A12012/0326169 A1 12/2012 Sakai et al.
US 2017/0327971 A12017/0327971 A1 11/2017 Fujisawa et al.
US 2019/0189438 A12019/0189438 A1 6/2019 Mikawa et al.
JP 2009126723 AJP 2009126723 A 6/2009
JP 2009269816 AJP 2009269816 A 11/2009
JP 2011256082 AJP 2011256082 A 12/2011
JP 2015214441 AJP 2015214441 A 12/2015
Cited non-patent literature · 6
Combined Chinese Office Action and Search Report issued Aug. 10, 2022 in Patent Application No. 201980053810.4 (with English translation).
Combined Chinese Office Action and Search Report issued Jan. 29, 2022 in Patent Application No. 201980053810.4 (with English translation), 20 pages. Combined Taiwanese Office Action and Search Report issued Nov. 27, 2023 in Patent Application No. 108126120 (with English translation), 78 pages. Extended European Search Report issued Sep. 21, 2021 in Patent Application No. 19849371.0, 11 pages.
HVPE GaN wafers with improved crystalline and electrical properties. Freitas et al., “HVPE GaN wafers with improved crystalline and electrical properties”, Journal of Crystal Growth, vol. 456, XP029836153, 2016, pp. 113-120.
Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN. H. Amano, “Progress and Prospect of the Growth of Wide-Band- Gap Group III Nitrides: Development of the Growth Method for Single-Crystal Bulk GaN”, Japanese Journal of Applied Physics, 52, 2013, 050001-1-050001-10. International Preliminary Report on Patentability and Written Opin- ion issued Feb. 23, 2021 in PCT/JP2019/028991 (English transla- tion only), 23 pages. International Search Report issued Oct. 21, 2019 in PCT/JP2019/028991 (English translation only), 6 pages. Iwinska, M. et al., “Crystal growth of HVPE-GaN doped with germanium”, Journal of Crystal Growth, 2017, vol. 480, pp. 102- 107. Iwinska, M. et al., “Homoepitaxial growth of HVPE-GaN doped with Si”, Journal of Crystal Growth, 2016, vol. 456, pp. 91-96.
Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates. J. Z. Domagala et al., “Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates”, Journal of Crystal Growth, 2016, vol. 456, pp. 80-85. Office Action issued Apr. 5, 2022 in Japanese Patent Application No. 2021-007728 (with English machine translation), 19 pages. Office Action issued Mar. 5, 2024 in Japanese Patent Application No. 2020-537396 (with machine English translation), 7 pages. Office Action issued Sep. 5, 2023 in Japanese Patent Application No. 2020-537396 (with English translation), 15 pages.
High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds. Y. Tsukada et al., “High-quality, 2-inch-diameter m-plane GaN substrates grown by hydride vapor phase epitaxy on acidic ammonothermal seeds”, Japanese Journal of Applied Physics, 55, 2016, 05FC01-1-05FC01-5. Office Action issued Mar. 22, 2024 in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English transla- tion), 49 pages. Office Action issued Mar. 28, 2024 in corresponding European Patent Application No. 19849371.0, 7 pages. Final Office Action issued Dec. 30, 2024, in corresponding Korean Patent Application No. 10-2021-7007730 (with machine English translation), 8 pages.
characterization XRDproperty XRD structurematerial GaN