P-TYPE DOPING IN GaN LEDs FOR HIGH SPEED OPERATION AT LOW CURRENT DENSITIES | Matter42 Literature
Patent
Atlas literature
Patent
US 12,575,224 B2
P-TYPE DOPING IN GaN LEDs FOR HIGH SPEED OPERATION AT LOW CURRENT DENSITIES
Bardia Pezeshki, Cameron Danesh
AvicenaTech, Corp., Sunnyvale, CA (US)·Mar. 10, 2026·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1a.
FIG. 2
performance graph
FIG. 2 graphs measured 3 dB optical bandwidth versus current density for the structure of
FIG. 3
performance graph
FIG. 3 further graphs the measured 3 dB optical band- width versus current density for the structure of
FIG. 4
FIG. 4 is a block diagram of an optical communication or processing system making use of a GaN based LED as a 30 light source, in accordance with aspects of …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 2 dependent
1
IndependentGaNGaNInGaNGaNGaN/InGaN LED for optical data transmission
An optical processing system making use of an LED as a light source, comprising: a data source comprising a semiconductor chip with logic circuitry; LED drive circuitry coupled to the data source, the LED drive circuitry configured to generate current based on data received from the data source; an LED coupled to the LED drive circuitry so as to receive current to drive the LED to generate light encoding the data, the LED comprising a p type GaN layer, an n type GaN layer, and a plurality of alternating quantum well layers and barrier layers making up an active region of the LED between the p type GaN layer and the n type GaN layer, with the quantum well layers being undoped and with only barrier layers that are between the quantum well layers in the active region being p-doped by a p-doping concentration of at least 1019/cm3; and a detector to receive light generated by the LED, the detector configured to provide an electrical signal rep-resentative of data in the received light; wherein the drive circuitry is configured to drive the LED to generate light with a current density of greater than 4000 A/cm2.
2
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, further comprising a coherent fiber bundle optically between the LED and the detector.
3
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, wherein the logic circuitry includes a processor. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
P-TYPE DOPING IN GaN LEDs FOR HIGH SPEED OPERATION AT LOW CURRENT DENSITIES
Bardia Pezeshki, Cameron Danesh
AvicenaTech, Corp., Sunnyvale, CA (US)·Mar. 10, 2026·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1a.
FIG. 2
performance graph
FIG. 2 graphs measured 3 dB optical bandwidth versus current density for the structure of
FIG. 3
performance graph
FIG. 3 further graphs the measured 3 dB optical band- width versus current density for the structure of
FIG. 4
FIG. 4 is a block diagram of an optical communication or processing system making use of a GaN based LED as a 30 light source, in accordance with aspects of …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 2 dependent
1
IndependentGaNGaNInGaNGaNGaN/InGaN LED for optical data transmission
An optical processing system making use of an LED as a light source, comprising: a data source comprising a semiconductor chip with logic circuitry; LED drive circuitry coupled to the data source, the LED drive circuitry configured to generate current based on data received from the data source; an LED coupled to the LED drive circuitry so as to receive current to drive the LED to generate light encoding the data, the LED comprising a p type GaN layer, an n type GaN layer, and a plurality of alternating quantum well layers and barrier layers making up an active region of the LED between the p type GaN layer and the n type GaN layer, with the quantum well layers being undoped and with only barrier layers that are between the quantum well layers in the active region being p-doped by a p-doping concentration of at least 1019/cm3; and a detector to receive light generated by the LED, the detector configured to provide an electrical signal rep-resentative of data in the received light; wherein the drive circuitry is configured to drive the LED to generate light with a current density of greater than 4000 A/cm2.
2
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, further comprising a coherent fiber bundle optically between the LED and the detector.
3
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, wherein the logic circuitry includes a processor. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
P-TYPE DOPING IN GaN LEDs FOR HIGH SPEED OPERATION AT LOW CURRENT DENSITIES
Bardia Pezeshki, Cameron Danesh
AvicenaTech, Corp., Sunnyvale, CA (US)·Mar. 10, 2026·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1a.
FIG. 2
performance graph
FIG. 2 graphs measured 3 dB optical bandwidth versus current density for the structure of
FIG. 3
performance graph
FIG. 3 further graphs the measured 3 dB optical band- width versus current density for the structure of
FIG. 4
FIG. 4 is a block diagram of an optical communication or processing system making use of a GaN based LED as a 30 light source, in accordance with aspects of …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 2 dependent
1
IndependentGaNGaNInGaNGaNGaN/InGaN LED for optical data transmission
An optical processing system making use of an LED as a light source, comprising: a data source comprising a semiconductor chip with logic circuitry; LED drive circuitry coupled to the data source, the LED drive circuitry configured to generate current based on data received from the data source; an LED coupled to the LED drive circuitry so as to receive current to drive the LED to generate light encoding the data, the LED comprising a p type GaN layer, an n type GaN layer, and a plurality of alternating quantum well layers and barrier layers making up an active region of the LED between the p type GaN layer and the n type GaN layer, with the quantum well layers being undoped and with only barrier layers that are between the quantum well layers in the active region being p-doped by a p-doping concentration of at least 1019/cm3; and a detector to receive light generated by the LED, the detector configured to provide an electrical signal rep-resentative of data in the received light; wherein the drive circuitry is configured to drive the LED to generate light with a current density of greater than 4000 A/cm2.
2
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, further comprising a coherent fiber bundle optically between the LED and the detector.
3
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, wherein the logic circuitry includes a processor. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
P-TYPE DOPING IN GaN LEDs FOR HIGH SPEED OPERATION AT LOW CURRENT DENSITIES
Bardia Pezeshki, Cameron Danesh
AvicenaTech, Corp., Sunnyvale, CA (US)·Mar. 10, 2026·US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 1a.
FIG. 2
performance graph
FIG. 2 graphs measured 3 dB optical bandwidth versus current density for the structure of
FIG. 3
performance graph
FIG. 3 further graphs the measured 3 dB optical band- width versus current density for the structure of
FIG. 4
FIG. 4 is a block diagram of an optical communication or processing system making use of a GaN based LED as a 30 light source, in accordance with aspects of …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 2 dependent
1
IndependentGaNGaNInGaNGaNGaN/InGaN LED for optical data transmission
An optical processing system making use of an LED as a light source, comprising: a data source comprising a semiconductor chip with logic circuitry; LED drive circuitry coupled to the data source, the LED drive circuitry configured to generate current based on data received from the data source; an LED coupled to the LED drive circuitry so as to receive current to drive the LED to generate light encoding the data, the LED comprising a p type GaN layer, an n type GaN layer, and a plurality of alternating quantum well layers and barrier layers making up an active region of the LED between the p type GaN layer and the n type GaN layer, with the quantum well layers being undoped and with only barrier layers that are between the quantum well layers in the active region being p-doped by a p-doping concentration of at least 1019/cm3; and a detector to receive light generated by the LED, the detector configured to provide an electrical signal rep-resentative of data in the received light; wherein the drive circuitry is configured to drive the LED to generate light with a current density of greater than 4000 A/cm2.
2
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, further comprising a coherent fiber bundle optically between the LED and the detector.
3
Dependent← claim 1GaN/InGaN LED for optical data transmission
The optical processing system of claim 1, wherein the logic circuitry includes a processor. ∗ ∗ ∗ ∗ ∗
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
p-doping concentration in barrier layers (embodiment, higher)
≥ 100000000000000000000 cm⁻³
GaN
Thickness
2–4 um
—
Thickness
10–20 nm
—
Thickness
5–10 nm
—
Thickness
10–15 nm
—
US 2010/0019223 A12010/0019223 A1 * 1/2010 Kang................... H10H 20/812examiner
US 2010/0134697 A12010/0134697 A1 6/2010 Miller et al.
US 2012/0251045 A12012/0251045 A1 * 10/2012 Budd..................... G02B 6/425examiner
US 2018/0261716 A12018/0261716 A1 9/2018 Park
US 2019/0306945 A12019/0306945 A1 10/2019 Valentine
US 2021/0126164 A12021/0126164 A1 * 4/2021 Broell..................... H01L 33/06examiner
Cited non-patent literature · 12
International Search Report by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022.
GaN based Cyan light-emitting diodes with GHz bandwidth. Written Opinion by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022. Extended European Search Report from the European Patent Office in related EP Application No. 21901576.5 dated Aug. 19, 2024. W. Shi, et al., “GaN based Cyan light-emitting diodes with GHz bandwidth,” 2016 IEEE Photonics Conference (IPC), p. 623-624.
A Parallel Optical Interconnect Link With On-Chip Optical Access. Bockstaele et al., “A Parallel Optical Interconnect Link With On-Chip Optical Access”, Micro-Optics, VCSELs, and Photonic
Hybrid Integrated Platforms for Silicon Photonics. Liang et al., “Hybrid Integrated Platforms for Silicon Photonics”, Materials 2010, vol. 3, pp. 1782-1802, Match 12, 2010.
III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects. Roelkens et al., “III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects”, Laser Photonics Review 4, No. 6, pp. 751-779, Jan. 11, 2010.
Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications. Rooman et al., “Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications”, IEEE Journal of Solid-State Circuits, vol. 35, No. 7, Jul. 2000.
High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy. Rooman et al., “High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy”, IEEE Photonics Technology Letters, vol. 17, No. 12, Dec. 2005.
Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors. Rooman et al., “Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors”, Proceedings 27th 27th European Conference on Optical Communication (ECOC), pp. 296-297, Sep. 30, 2001-Oct. 4, 2001.
Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors. Rooman et al., “Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors”, IEEE Pro- ceedings, 2000 Digest of the LEOS Summer Topical Meetings, Jul. 24-28, 2000.
Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication. Windisch et al., “Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication”, IEEE Journal of Quantum electronics, vol. 36, No. 12, Dec. 2000.
Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes. Windisch et al., “Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes”, IEEE Journal on selected Topics in Quantum Electronics, vol. 8, No. 2, Mar./Apr. 2002.
p-doping concentration in barrier layers (embodiment, higher)
≥ 100000000000000000000 cm⁻³
GaN
Thickness
2–4 um
—
Thickness
10–20 nm
—
Thickness
5–10 nm
—
Thickness
10–15 nm
—
US 2010/0019223 A12010/0019223 A1 * 1/2010 Kang................... H10H 20/812examiner
US 2010/0134697 A12010/0134697 A1 6/2010 Miller et al.
US 2012/0251045 A12012/0251045 A1 * 10/2012 Budd..................... G02B 6/425examiner
US 2018/0261716 A12018/0261716 A1 9/2018 Park
US 2019/0306945 A12019/0306945 A1 10/2019 Valentine
US 2021/0126164 A12021/0126164 A1 * 4/2021 Broell..................... H01L 33/06examiner
Cited non-patent literature · 12
International Search Report by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022.
GaN based Cyan light-emitting diodes with GHz bandwidth. Written Opinion by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022. Extended European Search Report from the European Patent Office in related EP Application No. 21901576.5 dated Aug. 19, 2024. W. Shi, et al., “GaN based Cyan light-emitting diodes with GHz bandwidth,” 2016 IEEE Photonics Conference (IPC), p. 623-624.
A Parallel Optical Interconnect Link With On-Chip Optical Access. Bockstaele et al., “A Parallel Optical Interconnect Link With On-Chip Optical Access”, Micro-Optics, VCSELs, and Photonic
Hybrid Integrated Platforms for Silicon Photonics. Liang et al., “Hybrid Integrated Platforms for Silicon Photonics”, Materials 2010, vol. 3, pp. 1782-1802, Match 12, 2010.
III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects. Roelkens et al., “III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects”, Laser Photonics Review 4, No. 6, pp. 751-779, Jan. 11, 2010.
Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications. Rooman et al., “Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications”, IEEE Journal of Solid-State Circuits, vol. 35, No. 7, Jul. 2000.
High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy. Rooman et al., “High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy”, IEEE Photonics Technology Letters, vol. 17, No. 12, Dec. 2005.
Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors. Rooman et al., “Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors”, Proceedings 27th 27th European Conference on Optical Communication (ECOC), pp. 296-297, Sep. 30, 2001-Oct. 4, 2001.
Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors. Rooman et al., “Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors”, IEEE Pro- ceedings, 2000 Digest of the LEOS Summer Topical Meetings, Jul. 24-28, 2000.
Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication. Windisch et al., “Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication”, IEEE Journal of Quantum electronics, vol. 36, No. 12, Dec. 2000.
Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes. Windisch et al., “Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes”, IEEE Journal on selected Topics in Quantum Electronics, vol. 8, No. 2, Mar./Apr. 2002.
p-doping concentration in barrier layers (embodiment, higher)
≥ 100000000000000000000 cm⁻³
GaN
Thickness
2–4 um
—
Thickness
10–20 nm
—
Thickness
5–10 nm
—
Thickness
10–15 nm
—
US 2010/0019223 A12010/0019223 A1 * 1/2010 Kang................... H10H 20/812examiner
US 2010/0134697 A12010/0134697 A1 6/2010 Miller et al.
US 2012/0251045 A12012/0251045 A1 * 10/2012 Budd..................... G02B 6/425examiner
US 2018/0261716 A12018/0261716 A1 9/2018 Park
US 2019/0306945 A12019/0306945 A1 10/2019 Valentine
US 2021/0126164 A12021/0126164 A1 * 4/2021 Broell..................... H01L 33/06examiner
Cited non-patent literature · 12
International Search Report by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022.
GaN based Cyan light-emitting diodes with GHz bandwidth. Written Opinion by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022. Extended European Search Report from the European Patent Office in related EP Application No. 21901576.5 dated Aug. 19, 2024. W. Shi, et al., “GaN based Cyan light-emitting diodes with GHz bandwidth,” 2016 IEEE Photonics Conference (IPC), p. 623-624.
A Parallel Optical Interconnect Link With On-Chip Optical Access. Bockstaele et al., “A Parallel Optical Interconnect Link With On-Chip Optical Access”, Micro-Optics, VCSELs, and Photonic
Hybrid Integrated Platforms for Silicon Photonics. Liang et al., “Hybrid Integrated Platforms for Silicon Photonics”, Materials 2010, vol. 3, pp. 1782-1802, Match 12, 2010.
III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects. Roelkens et al., “III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects”, Laser Photonics Review 4, No. 6, pp. 751-779, Jan. 11, 2010.
Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications. Rooman et al., “Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications”, IEEE Journal of Solid-State Circuits, vol. 35, No. 7, Jul. 2000.
High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy. Rooman et al., “High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy”, IEEE Photonics Technology Letters, vol. 17, No. 12, Dec. 2005.
Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors. Rooman et al., “Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors”, Proceedings 27th 27th European Conference on Optical Communication (ECOC), pp. 296-297, Sep. 30, 2001-Oct. 4, 2001.
Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors. Rooman et al., “Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors”, IEEE Pro- ceedings, 2000 Digest of the LEOS Summer Topical Meetings, Jul. 24-28, 2000.
Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication. Windisch et al., “Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication”, IEEE Journal of Quantum electronics, vol. 36, No. 12, Dec. 2000.
Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes. Windisch et al., “Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes”, IEEE Journal on selected Topics in Quantum Electronics, vol. 8, No. 2, Mar./Apr. 2002.
p-doping concentration in barrier layers (embodiment, higher)
≥ 100000000000000000000 cm⁻³
GaN
Thickness
2–4 um
—
Thickness
10–20 nm
—
Thickness
5–10 nm
—
Thickness
10–15 nm
—
US 2010/0019223 A12010/0019223 A1 * 1/2010 Kang................... H10H 20/812examiner
US 2010/0134697 A12010/0134697 A1 6/2010 Miller et al.
US 2012/0251045 A12012/0251045 A1 * 10/2012 Budd..................... G02B 6/425examiner
US 2018/0261716 A12018/0261716 A1 9/2018 Park
US 2019/0306945 A12019/0306945 A1 10/2019 Valentine
US 2021/0126164 A12021/0126164 A1 * 4/2021 Broell..................... H01L 33/06examiner
Cited non-patent literature · 12
International Search Report by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022.
GaN based Cyan light-emitting diodes with GHz bandwidth. Written Opinion by International Searching Authority (KIPO) in related PCT Application No. PCT/US2021/061899 dated Mar. 29, 2022. Extended European Search Report from the European Patent Office in related EP Application No. 21901576.5 dated Aug. 19, 2024. W. Shi, et al., “GaN based Cyan light-emitting diodes with GHz bandwidth,” 2016 IEEE Photonics Conference (IPC), p. 623-624.
A Parallel Optical Interconnect Link With On-Chip Optical Access. Bockstaele et al., “A Parallel Optical Interconnect Link With On-Chip Optical Access”, Micro-Optics, VCSELs, and Photonic
Hybrid Integrated Platforms for Silicon Photonics. Liang et al., “Hybrid Integrated Platforms for Silicon Photonics”, Materials 2010, vol. 3, pp. 1782-1802, Match 12, 2010.
III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects. Roelkens et al., “III-V/Silicon Photonics for On-chip and Inter-chip Optical Interconnects”, Laser Photonics Review 4, No. 6, pp. 751-779, Jan. 11, 2010.
Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications. Rooman et al., “Asynchronous 250-Mb/s Optical Receivers with Integrated Detector in Standard CMOS Technology for Optocoupler Applications”, IEEE Journal of Solid-State Circuits, vol. 35, No. 7, Jul. 2000.
High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy. Rooman et al., “High-Efficiency AlGalnP Thin-Film LEDs Using surface-Texturing and Waferbonding with Conductive Epoxy”, IEEE Photonics Technology Letters, vol. 17, No. 12, Dec. 2005.
Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors. Rooman et al., “Inter-Chip Optical Interconnects Using Imaging Fiber Bundles and Integrated CMOS Detectors”, Proceedings 27th 27th European Conference on Optical Communication (ECOC), pp. 296-297, Sep. 30, 2001-Oct. 4, 2001.
Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors. Rooman et al., “Low-Power Short-Distance Optical Interconnect using Imaging Fibre Bundles and CMOS Detectors”, IEEE Pro- ceedings, 2000 Digest of the LEOS Summer Topical Meetings, Jul. 24-28, 2000.
Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication. Windisch et al., “Large-Signal-Modulation of High-Efficiency Light- Emitting Diodes for Optical Communication”, IEEE Journal of Quantum electronics, vol. 36, No. 12, Dec. 2000.
Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes. Windisch et al., “Light-Extraction Mechanisms in High-Efficiency surface-Textured Light-Emitting Diodes”, IEEE Journal on selected Topics in Quantum Electronics, vol. 8, No. 2, Mar./Apr. 2002.