Patent
US 10,059,592Process for Producing Highly Oriented Graphene Films
Aruna Zhamu, Yanbo Wang, Lucy Fu, Bor Z. Jang
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 10,059,592Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG.4(A) Thermal conductivity values of the GO dispersion (suspension)-derived HOGF, GO gel-derived HOGF, stacked and compressed sheets of GO platelet paper, …
FIG. 5(D)). The (004) peak intensity relative to the (002) intensity on the same diffraction curve, or the I (004)/I (002) ratio, is a good indication of the …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 7(B), respectively. These data have demonstrated that the tensile strength of the tensile graphite foil-derived HOPG increases slightly with the final heat …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A process for producing a highly oriented graphene film said process comprising: (a) preparing a pristine graphene dispersion having oxygen-free pristine graphene sheets dispersed in a fluid medium; (b) dispensing and depositing said pristine graphene dispersion onto a surface of a supporting substrate to form a layer of pristine graphene, wherein said dispensing and depositing procedure includes subjecting said pristine graphene dispersion to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said layer of pristine graphene to form a layer of dried pristine graphene; (d) slicing said layer of dried pristine graphene into multiple pieces of dried pristine graphene or repeating steps (b) and (c) to produce multiple layers of dried pristine graphene, and stacking at least two layers of dried pristine graphene under an optional first compressive stress to form a mass of multiple layers of dried pristine graphene; and (e) heat-treating the mass of multiple layers of dried pristine graphene at a first heat treatment temperature higher than 2,000 0 C under a second compressive stress for a sufficient period of time to produce said highly oriented graphene film.
The process of claim 1, further comprising a dispersing agent added prior to step (b).
The process of claim 1, further comprising a compression step, after said step (e), to reduce a thickness of said highly oriented graphene film.
The process of claim 1, wherein said fluid medium is selected from water, alcohols or combinations thereof.
The process of claim 1, wherein said steps (b) and (c) include feeding a solid substrate material from a roller to a deposition zone, depositing a layer of pristine graphene dispersion onto a surface of said solid substrate material to form said first pristine graphene layer thereon, drying said pristine graphene layer to form a first dried pristine graphene layer- deposited substrate material, and collecting said first dried pristine graphene layer-deposited substrate material on a collector roller.
The process of claim 1, wherein said step of heat-treating induces chemical linking, merging, or chemical bonding of said pristine graphene sheets, or induces re- graphitization or re-organization of a graphitic structure.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 100 pm.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 20 pm.
The process of claim 1, wherein said highly oriented graphene film has a thickness less than 100 pm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content less than 0.01%, an inter-graphene spacing less than 0.337 nm, a thermal conductivity of at least 1,300 W/mK, or an electrical conductivity no less than 5,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content no greater than 0.001%, an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.7, a thermal conductivity of at least 1,500 W/mK, or an electrical conductivity no less than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.4, a thermal conductivity greater than 1,600 W/mK, or an electrical conductivity greater than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film exhibits an inter- graphene spacing less than 0.337 nm and a mosaic spread value less than 1.0.
The process of claim 1, wherein said highly oriented graphene film exhibits a degree of graphitization no less than 90% and/or a mosaic spread value no greater than 0.4.
The process of claim 1, wherein said highly oriented graphene film contains chemically bonded graphene planes that are parallel to one another.
The process of claim 1, wherein said highly oriented graphene film contains a combination of sp2 and sp3 electronic configurations. 46
The process of claim 1, wherein said highly oriented graphene film has an electrical conductivity greater than 5,000 S/cm, a thermal conductivity greater than 800 W/mK, a physical density greater than 1.9 g/cm3, a tensile strength greater than 80 MPa, and/or an elastic modulus greater than 60 GPa.
A highly oriented graphene structure having an inter-plane spacing d 002 less than 0.4 nm and an oxygen content less than 5% by weight produced by a process comprising: (a) preparing either a graphene oxide dispersion having graphene oxide sheets dispersed in a fluid medium or a graphene oxide gel having graphene oxide molecules dissolved in a fluid medium, wherein said graphene oxide sheets or graphene oxide molecules contain an oxygen content higher than 5% by weight; (b) dispensing and depositing said graphene oxide dispersion or graphene oxide gel onto a surface of a supporting substrate to form a first layer of graphene oxide, wherein said dispensing and depositing procedure includes subjecting said graphene oxide dispersion or graphene oxide gel to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said first layer of graphene oxide to form a first dried layer of graphene oxide having a layer thickness less than 200 p m and having an inter-plane spacing d002 from 0.4 nm to 1.2 nm as determined by X- ray diffraction and an oxygen content no less than 5% by weight; (d) cutting said dried layer of graphene oxide or repeating steps (a), (b), and (c) to create multiple dried layers of graphene oxide. (d) stacking then heat treating said multiple dried layers of graphene oxide or heat treating then stacking said multiple dried layers of graphene oxide.
A highly oriented graphene structure having a thickness less than 100 p m produced by a process as defined in claim 18.
A heat dissipation film or thermal management device comprising the highly oriented graphene structure of claim 18, disposed for use in a smart phone, tablet computer, flat- panel TV display, or other microelectronic or communications device. 47
Layer stacks claimed or described, ordered top of device to substrate.
heat dissipation film/thermal management device
Materials described outside the worked examples.
pristine graphene
C
graphene oxide
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
inter-graphene spacing of HOGF (claim 10 lower bound) | ≤ 0.337 nm | C |
inter-graphene spacing of HOGF (claim 11 lower bound) | ≤ 0.336 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,059,592Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG.4(A) Thermal conductivity values of the GO dispersion (suspension)-derived HOGF, GO gel-derived HOGF, stacked and compressed sheets of GO platelet paper, …
FIG. 5(D)). The (004) peak intensity relative to the (002) intensity on the same diffraction curve, or the I (004)/I (002) ratio, is a good indication of the …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 7(B), respectively. These data have demonstrated that the tensile strength of the tensile graphite foil-derived HOPG increases slightly with the final heat …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A process for producing a highly oriented graphene film said process comprising: (a) preparing a pristine graphene dispersion having oxygen-free pristine graphene sheets dispersed in a fluid medium; (b) dispensing and depositing said pristine graphene dispersion onto a surface of a supporting substrate to form a layer of pristine graphene, wherein said dispensing and depositing procedure includes subjecting said pristine graphene dispersion to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said layer of pristine graphene to form a layer of dried pristine graphene; (d) slicing said layer of dried pristine graphene into multiple pieces of dried pristine graphene or repeating steps (b) and (c) to produce multiple layers of dried pristine graphene, and stacking at least two layers of dried pristine graphene under an optional first compressive stress to form a mass of multiple layers of dried pristine graphene; and (e) heat-treating the mass of multiple layers of dried pristine graphene at a first heat treatment temperature higher than 2,000 0 C under a second compressive stress for a sufficient period of time to produce said highly oriented graphene film.
The process of claim 1, further comprising a dispersing agent added prior to step (b).
The process of claim 1, further comprising a compression step, after said step (e), to reduce a thickness of said highly oriented graphene film.
The process of claim 1, wherein said fluid medium is selected from water, alcohols or combinations thereof.
The process of claim 1, wherein said steps (b) and (c) include feeding a solid substrate material from a roller to a deposition zone, depositing a layer of pristine graphene dispersion onto a surface of said solid substrate material to form said first pristine graphene layer thereon, drying said pristine graphene layer to form a first dried pristine graphene layer- deposited substrate material, and collecting said first dried pristine graphene layer-deposited substrate material on a collector roller.
The process of claim 1, wherein said step of heat-treating induces chemical linking, merging, or chemical bonding of said pristine graphene sheets, or induces re- graphitization or re-organization of a graphitic structure.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 100 pm.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 20 pm.
The process of claim 1, wherein said highly oriented graphene film has a thickness less than 100 pm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content less than 0.01%, an inter-graphene spacing less than 0.337 nm, a thermal conductivity of at least 1,300 W/mK, or an electrical conductivity no less than 5,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content no greater than 0.001%, an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.7, a thermal conductivity of at least 1,500 W/mK, or an electrical conductivity no less than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.4, a thermal conductivity greater than 1,600 W/mK, or an electrical conductivity greater than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film exhibits an inter- graphene spacing less than 0.337 nm and a mosaic spread value less than 1.0.
The process of claim 1, wherein said highly oriented graphene film exhibits a degree of graphitization no less than 90% and/or a mosaic spread value no greater than 0.4.
The process of claim 1, wherein said highly oriented graphene film contains chemically bonded graphene planes that are parallel to one another.
The process of claim 1, wherein said highly oriented graphene film contains a combination of sp2 and sp3 electronic configurations. 46
The process of claim 1, wherein said highly oriented graphene film has an electrical conductivity greater than 5,000 S/cm, a thermal conductivity greater than 800 W/mK, a physical density greater than 1.9 g/cm3, a tensile strength greater than 80 MPa, and/or an elastic modulus greater than 60 GPa.
A highly oriented graphene structure having an inter-plane spacing d 002 less than 0.4 nm and an oxygen content less than 5% by weight produced by a process comprising: (a) preparing either a graphene oxide dispersion having graphene oxide sheets dispersed in a fluid medium or a graphene oxide gel having graphene oxide molecules dissolved in a fluid medium, wherein said graphene oxide sheets or graphene oxide molecules contain an oxygen content higher than 5% by weight; (b) dispensing and depositing said graphene oxide dispersion or graphene oxide gel onto a surface of a supporting substrate to form a first layer of graphene oxide, wherein said dispensing and depositing procedure includes subjecting said graphene oxide dispersion or graphene oxide gel to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said first layer of graphene oxide to form a first dried layer of graphene oxide having a layer thickness less than 200 p m and having an inter-plane spacing d002 from 0.4 nm to 1.2 nm as determined by X- ray diffraction and an oxygen content no less than 5% by weight; (d) cutting said dried layer of graphene oxide or repeating steps (a), (b), and (c) to create multiple dried layers of graphene oxide. (d) stacking then heat treating said multiple dried layers of graphene oxide or heat treating then stacking said multiple dried layers of graphene oxide.
A highly oriented graphene structure having a thickness less than 100 p m produced by a process as defined in claim 18.
A heat dissipation film or thermal management device comprising the highly oriented graphene structure of claim 18, disposed for use in a smart phone, tablet computer, flat- panel TV display, or other microelectronic or communications device. 47
Layer stacks claimed or described, ordered top of device to substrate.
heat dissipation film/thermal management device
Materials described outside the worked examples.
pristine graphene
C
graphene oxide
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
inter-graphene spacing of HOGF (claim 10 lower bound) | ≤ 0.337 nm | C |
inter-graphene spacing of HOGF (claim 11 lower bound) | ≤ 0.336 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,059,592Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG.4(A) Thermal conductivity values of the GO dispersion (suspension)-derived HOGF, GO gel-derived HOGF, stacked and compressed sheets of GO platelet paper, …
FIG. 5(D)). The (004) peak intensity relative to the (002) intensity on the same diffraction curve, or the I (004)/I (002) ratio, is a good indication of the …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 7(B), respectively. These data have demonstrated that the tensile strength of the tensile graphite foil-derived HOPG increases slightly with the final heat …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A process for producing a highly oriented graphene film said process comprising: (a) preparing a pristine graphene dispersion having oxygen-free pristine graphene sheets dispersed in a fluid medium; (b) dispensing and depositing said pristine graphene dispersion onto a surface of a supporting substrate to form a layer of pristine graphene, wherein said dispensing and depositing procedure includes subjecting said pristine graphene dispersion to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said layer of pristine graphene to form a layer of dried pristine graphene; (d) slicing said layer of dried pristine graphene into multiple pieces of dried pristine graphene or repeating steps (b) and (c) to produce multiple layers of dried pristine graphene, and stacking at least two layers of dried pristine graphene under an optional first compressive stress to form a mass of multiple layers of dried pristine graphene; and (e) heat-treating the mass of multiple layers of dried pristine graphene at a first heat treatment temperature higher than 2,000 0 C under a second compressive stress for a sufficient period of time to produce said highly oriented graphene film.
The process of claim 1, further comprising a dispersing agent added prior to step (b).
The process of claim 1, further comprising a compression step, after said step (e), to reduce a thickness of said highly oriented graphene film.
The process of claim 1, wherein said fluid medium is selected from water, alcohols or combinations thereof.
The process of claim 1, wherein said steps (b) and (c) include feeding a solid substrate material from a roller to a deposition zone, depositing a layer of pristine graphene dispersion onto a surface of said solid substrate material to form said first pristine graphene layer thereon, drying said pristine graphene layer to form a first dried pristine graphene layer- deposited substrate material, and collecting said first dried pristine graphene layer-deposited substrate material on a collector roller.
The process of claim 1, wherein said step of heat-treating induces chemical linking, merging, or chemical bonding of said pristine graphene sheets, or induces re- graphitization or re-organization of a graphitic structure.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 100 pm.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 20 pm.
The process of claim 1, wherein said highly oriented graphene film has a thickness less than 100 pm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content less than 0.01%, an inter-graphene spacing less than 0.337 nm, a thermal conductivity of at least 1,300 W/mK, or an electrical conductivity no less than 5,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content no greater than 0.001%, an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.7, a thermal conductivity of at least 1,500 W/mK, or an electrical conductivity no less than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.4, a thermal conductivity greater than 1,600 W/mK, or an electrical conductivity greater than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film exhibits an inter- graphene spacing less than 0.337 nm and a mosaic spread value less than 1.0.
The process of claim 1, wherein said highly oriented graphene film exhibits a degree of graphitization no less than 90% and/or a mosaic spread value no greater than 0.4.
The process of claim 1, wherein said highly oriented graphene film contains chemically bonded graphene planes that are parallel to one another.
The process of claim 1, wherein said highly oriented graphene film contains a combination of sp2 and sp3 electronic configurations. 46
The process of claim 1, wherein said highly oriented graphene film has an electrical conductivity greater than 5,000 S/cm, a thermal conductivity greater than 800 W/mK, a physical density greater than 1.9 g/cm3, a tensile strength greater than 80 MPa, and/or an elastic modulus greater than 60 GPa.
A highly oriented graphene structure having an inter-plane spacing d 002 less than 0.4 nm and an oxygen content less than 5% by weight produced by a process comprising: (a) preparing either a graphene oxide dispersion having graphene oxide sheets dispersed in a fluid medium or a graphene oxide gel having graphene oxide molecules dissolved in a fluid medium, wherein said graphene oxide sheets or graphene oxide molecules contain an oxygen content higher than 5% by weight; (b) dispensing and depositing said graphene oxide dispersion or graphene oxide gel onto a surface of a supporting substrate to form a first layer of graphene oxide, wherein said dispensing and depositing procedure includes subjecting said graphene oxide dispersion or graphene oxide gel to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said first layer of graphene oxide to form a first dried layer of graphene oxide having a layer thickness less than 200 p m and having an inter-plane spacing d002 from 0.4 nm to 1.2 nm as determined by X- ray diffraction and an oxygen content no less than 5% by weight; (d) cutting said dried layer of graphene oxide or repeating steps (a), (b), and (c) to create multiple dried layers of graphene oxide. (d) stacking then heat treating said multiple dried layers of graphene oxide or heat treating then stacking said multiple dried layers of graphene oxide.
A highly oriented graphene structure having a thickness less than 100 p m produced by a process as defined in claim 18.
A heat dissipation film or thermal management device comprising the highly oriented graphene structure of claim 18, disposed for use in a smart phone, tablet computer, flat- panel TV display, or other microelectronic or communications device. 47
Layer stacks claimed or described, ordered top of device to substrate.
heat dissipation film/thermal management device
Materials described outside the worked examples.
pristine graphene
C
graphene oxide
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
inter-graphene spacing of HOGF (claim 10 lower bound) | ≤ 0.337 nm | C |
inter-graphene spacing of HOGF (claim 11 lower bound) | ≤ 0.336 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 10,059,592Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG.4(A) Thermal conductivity values of the GO dispersion (suspension)-derived HOGF, GO gel-derived HOGF, stacked and compressed sheets of GO platelet paper, …
FIG. 5(D)). The (004) peak intensity relative to the (002) intensity on the same diffraction curve, or the I (004)/I (002) ratio, is a good indication of the …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 7(B), respectively. These data have demonstrated that the tensile strength of the tensile graphite foil-derived HOPG increases slightly with the final heat …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A process for producing a highly oriented graphene film said process comprising: (a) preparing a pristine graphene dispersion having oxygen-free pristine graphene sheets dispersed in a fluid medium; (b) dispensing and depositing said pristine graphene dispersion onto a surface of a supporting substrate to form a layer of pristine graphene, wherein said dispensing and depositing procedure includes subjecting said pristine graphene dispersion to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said layer of pristine graphene to form a layer of dried pristine graphene; (d) slicing said layer of dried pristine graphene into multiple pieces of dried pristine graphene or repeating steps (b) and (c) to produce multiple layers of dried pristine graphene, and stacking at least two layers of dried pristine graphene under an optional first compressive stress to form a mass of multiple layers of dried pristine graphene; and (e) heat-treating the mass of multiple layers of dried pristine graphene at a first heat treatment temperature higher than 2,000 0 C under a second compressive stress for a sufficient period of time to produce said highly oriented graphene film.
The process of claim 1, further comprising a dispersing agent added prior to step (b).
The process of claim 1, further comprising a compression step, after said step (e), to reduce a thickness of said highly oriented graphene film.
The process of claim 1, wherein said fluid medium is selected from water, alcohols or combinations thereof.
The process of claim 1, wherein said steps (b) and (c) include feeding a solid substrate material from a roller to a deposition zone, depositing a layer of pristine graphene dispersion onto a surface of said solid substrate material to form said first pristine graphene layer thereon, drying said pristine graphene layer to form a first dried pristine graphene layer- deposited substrate material, and collecting said first dried pristine graphene layer-deposited substrate material on a collector roller.
The process of claim 1, wherein said step of heat-treating induces chemical linking, merging, or chemical bonding of said pristine graphene sheets, or induces re- graphitization or re-organization of a graphitic structure.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 100 pm.
The process of claim 1, wherein said first layer of dried pristine graphene, said second layer of dried pristine graphene, or said multiple layers of dried pristine graphene have a thickness no greater than 20 pm.
The process of claim 1, wherein said highly oriented graphene film has a thickness less than 100 pm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content less than 0.01%, an inter-graphene spacing less than 0.337 nm, a thermal conductivity of at least 1,300 W/mK, or an electrical conductivity no less than 5,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an oxygen content no greater than 0.001%, an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.7, a thermal conductivity of at least 1,500 W/mK, or an electrical conductivity no less than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film has an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.4, a thermal conductivity greater than 1,600 W/mK, or an electrical conductivity greater than 10,000 S/cm.
The process of claim 1, wherein said highly oriented graphene film exhibits an inter- graphene spacing less than 0.337 nm and a mosaic spread value less than 1.0.
The process of claim 1, wherein said highly oriented graphene film exhibits a degree of graphitization no less than 90% and/or a mosaic spread value no greater than 0.4.
The process of claim 1, wherein said highly oriented graphene film contains chemically bonded graphene planes that are parallel to one another.
The process of claim 1, wherein said highly oriented graphene film contains a combination of sp2 and sp3 electronic configurations. 46
The process of claim 1, wherein said highly oriented graphene film has an electrical conductivity greater than 5,000 S/cm, a thermal conductivity greater than 800 W/mK, a physical density greater than 1.9 g/cm3, a tensile strength greater than 80 MPa, and/or an elastic modulus greater than 60 GPa.
A highly oriented graphene structure having an inter-plane spacing d 002 less than 0.4 nm and an oxygen content less than 5% by weight produced by a process comprising: (a) preparing either a graphene oxide dispersion having graphene oxide sheets dispersed in a fluid medium or a graphene oxide gel having graphene oxide molecules dissolved in a fluid medium, wherein said graphene oxide sheets or graphene oxide molecules contain an oxygen content higher than 5% by weight; (b) dispensing and depositing said graphene oxide dispersion or graphene oxide gel onto a surface of a supporting substrate to form a first layer of graphene oxide, wherein said dispensing and depositing procedure includes subjecting said graphene oxide dispersion or graphene oxide gel to an orientation-inducing stress; (c) partially or completely removing said fluid medium from said first layer of graphene oxide to form a first dried layer of graphene oxide having a layer thickness less than 200 p m and having an inter-plane spacing d002 from 0.4 nm to 1.2 nm as determined by X- ray diffraction and an oxygen content no less than 5% by weight; (d) cutting said dried layer of graphene oxide or repeating steps (a), (b), and (c) to create multiple dried layers of graphene oxide. (d) stacking then heat treating said multiple dried layers of graphene oxide or heat treating then stacking said multiple dried layers of graphene oxide.
A highly oriented graphene structure having a thickness less than 100 p m produced by a process as defined in claim 18.
A heat dissipation film or thermal management device comprising the highly oriented graphene structure of claim 18, disposed for use in a smart phone, tablet computer, flat- panel TV display, or other microelectronic or communications device. 47
Layer stacks claimed or described, ordered top of device to substrate.
heat dissipation film/thermal management device
Materials described outside the worked examples.
pristine graphene
C
graphene oxide
Additional fabrication and treatment steps described in the patent.
Measurements and analyses referenced in the patent, with their drawing references.
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
inter-graphene spacing of HOGF (claim 10 lower bound) | ≤ 0.337 nm | C |
inter-graphene spacing of HOGF (claim 11 lower bound) | ≤ 0.336 nm |
Related documents with shared materials, methods, properties, or citations.
highly oriented graphene structure from graphene oxide
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
thermal conductivity of HOGF (claim 10) | ≥ 1300 W/mK | C |
electrical conductivity of HOGF (claim 10) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 11) | ≥ 1500 W/mK | C |
electrical conductivity of HOGF (claim 11) | ≥ 10000 S/cm | C |
thermal conductivity of HOGF (claim 12) | ≥ 1600 W/mK | C |
electrical conductivity of HOGF (claim 17) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 17) | ≥ 800 W/mK | C |
physical density of HOGF (claim 17) | ≥ 1.9 g/cm3 | C |
tensile strength of HOGF (claim 17) | ≥ 80 MPa | C |
elastic modulus of HOGF (claim 17) | ≥ 60 GPa | C |
inter-plane spacing d002 of dried GO layer (claim 18 intermediate) | 0.4–1.2 nm | graphene oxide |
inter-plane spacing d002 of final HOGF (claim 18 product) | ≤ 0.4 nm | highly oriented graphene structure from graphene oxide |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Duration | 15–120 s | — |
Temperature | 100–500 °C | — |
Duration | 900–7200 s | — |
Duration | 0.2–1 hour | — |
Duration | 48–72 hours | — |
Duration | 1–5 hours | — |
Pressure | 14–29 MPa | — |
Pressure | 23–52 MPa | — |
Temperature | 700–2800 °C | — |
Temperature | 100–300 °C | — |
Temperature | 1500–3200 °C | — |
Temperature | 280–300 °C | — |
Thickness | 0.6–1.2 nm | — |
— | 800–1200 W | — |
— | 1200–1500 W | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
— | 140–300 W | — |
— | 10–30 W | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–10 hours | — |
Duration | 0.5–5 hours | — |
Temperature | 3000–3250 °C | — |
Temperature | 500–1500 °C | — |
Temperature | 1500–2000 °C | — |
Temperature | 2500–3000 °C | — |
Thickness | ≤ 2 mm | — |
Thickness | ≤ 1 mm | — |
Thickness | ≤ 0.5 mm | — |
Thickness | ≤ 0.2 mm | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
— | ≤ 400 W | — |
— | ≤ 0.1 ev | — |
— | ≤ 1 W | — |
Thickness | ≥ 0.1 mm | — |
Thickness | ≥ 1 mm | — |
Duration | ≥ 1 hour | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 500 °C | — |
— | ≥ 1700 W | — |
Thickness | ≥ 1 nm | — |
Temperature | ≥ 1500 °C | — |
Temperature | ≥ 2000 °C | — |
— | ≥ 440 W | — |
— | ≥ 860 W | — |
— | ≥ 1730 W | — |
Pressure | ≥ 120 MPa | — |
— | ≥ 1300 W | — |
— | ≥ 1500 W | — |
— | ≥ 1600 W | — |
— | ≥ 800 W | — |
Temperature | 1500–2100 °C | — |
Thickness | ≤ 0.345 nm | — |
— | ≥ 1 W | — |
— | ≥ 1200 W | — |
Pressure | ≥ 1 MPa | — |
highly oriented graphene structure from graphene oxide
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
thermal conductivity of HOGF (claim 10) | ≥ 1300 W/mK | C |
electrical conductivity of HOGF (claim 10) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 11) | ≥ 1500 W/mK | C |
electrical conductivity of HOGF (claim 11) | ≥ 10000 S/cm | C |
thermal conductivity of HOGF (claim 12) | ≥ 1600 W/mK | C |
electrical conductivity of HOGF (claim 17) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 17) | ≥ 800 W/mK | C |
physical density of HOGF (claim 17) | ≥ 1.9 g/cm3 | C |
tensile strength of HOGF (claim 17) | ≥ 80 MPa | C |
elastic modulus of HOGF (claim 17) | ≥ 60 GPa | C |
inter-plane spacing d002 of dried GO layer (claim 18 intermediate) | 0.4–1.2 nm | graphene oxide |
inter-plane spacing d002 of final HOGF (claim 18 product) | ≤ 0.4 nm | highly oriented graphene structure from graphene oxide |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Duration | 15–120 s | — |
Temperature | 100–500 °C | — |
Duration | 900–7200 s | — |
Duration | 0.2–1 hour | — |
Duration | 48–72 hours | — |
Duration | 1–5 hours | — |
Pressure | 14–29 MPa | — |
Pressure | 23–52 MPa | — |
Temperature | 700–2800 °C | — |
Temperature | 100–300 °C | — |
Temperature | 1500–3200 °C | — |
Temperature | 280–300 °C | — |
Thickness | 0.6–1.2 nm | — |
— | 800–1200 W | — |
— | 1200–1500 W | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
— | 140–300 W | — |
— | 10–30 W | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–10 hours | — |
Duration | 0.5–5 hours | — |
Temperature | 3000–3250 °C | — |
Temperature | 500–1500 °C | — |
Temperature | 1500–2000 °C | — |
Temperature | 2500–3000 °C | — |
Thickness | ≤ 2 mm | — |
Thickness | ≤ 1 mm | — |
Thickness | ≤ 0.5 mm | — |
Thickness | ≤ 0.2 mm | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
— | ≤ 400 W | — |
— | ≤ 0.1 ev | — |
— | ≤ 1 W | — |
Thickness | ≥ 0.1 mm | — |
Thickness | ≥ 1 mm | — |
Duration | ≥ 1 hour | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 500 °C | — |
— | ≥ 1700 W | — |
Thickness | ≥ 1 nm | — |
Temperature | ≥ 1500 °C | — |
Temperature | ≥ 2000 °C | — |
— | ≥ 440 W | — |
— | ≥ 860 W | — |
— | ≥ 1730 W | — |
Pressure | ≥ 120 MPa | — |
— | ≥ 1300 W | — |
— | ≥ 1500 W | — |
— | ≥ 1600 W | — |
— | ≥ 800 W | — |
Temperature | 1500–2100 °C | — |
Thickness | ≤ 0.345 nm | — |
— | ≥ 1 W | — |
— | ≥ 1200 W | — |
Pressure | ≥ 1 MPa | — |
highly oriented graphene structure from graphene oxide
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
thermal conductivity of HOGF (claim 10) | ≥ 1300 W/mK | C |
electrical conductivity of HOGF (claim 10) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 11) | ≥ 1500 W/mK | C |
electrical conductivity of HOGF (claim 11) | ≥ 10000 S/cm | C |
thermal conductivity of HOGF (claim 12) | ≥ 1600 W/mK | C |
electrical conductivity of HOGF (claim 17) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 17) | ≥ 800 W/mK | C |
physical density of HOGF (claim 17) | ≥ 1.9 g/cm3 | C |
tensile strength of HOGF (claim 17) | ≥ 80 MPa | C |
elastic modulus of HOGF (claim 17) | ≥ 60 GPa | C |
inter-plane spacing d002 of dried GO layer (claim 18 intermediate) | 0.4–1.2 nm | graphene oxide |
inter-plane spacing d002 of final HOGF (claim 18 product) | ≤ 0.4 nm | highly oriented graphene structure from graphene oxide |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Duration | 15–120 s | — |
Temperature | 100–500 °C | — |
Duration | 900–7200 s | — |
Duration | 0.2–1 hour | — |
Duration | 48–72 hours | — |
Duration | 1–5 hours | — |
Pressure | 14–29 MPa | — |
Pressure | 23–52 MPa | — |
Temperature | 700–2800 °C | — |
Temperature | 100–300 °C | — |
Temperature | 1500–3200 °C | — |
Temperature | 280–300 °C | — |
Thickness | 0.6–1.2 nm | — |
— | 800–1200 W | — |
— | 1200–1500 W | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
— | 140–300 W | — |
— | 10–30 W | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–10 hours | — |
Duration | 0.5–5 hours | — |
Temperature | 3000–3250 °C | — |
Temperature | 500–1500 °C | — |
Temperature | 1500–2000 °C | — |
Temperature | 2500–3000 °C | — |
Thickness | ≤ 2 mm | — |
Thickness | ≤ 1 mm | — |
Thickness | ≤ 0.5 mm | — |
Thickness | ≤ 0.2 mm | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
— | ≤ 400 W | — |
— | ≤ 0.1 ev | — |
— | ≤ 1 W | — |
Thickness | ≥ 0.1 mm | — |
Thickness | ≥ 1 mm | — |
Duration | ≥ 1 hour | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 500 °C | — |
— | ≥ 1700 W | — |
Thickness | ≥ 1 nm | — |
Temperature | ≥ 1500 °C | — |
Temperature | ≥ 2000 °C | — |
— | ≥ 440 W | — |
— | ≥ 860 W | — |
— | ≥ 1730 W | — |
Pressure | ≥ 120 MPa | — |
— | ≥ 1300 W | — |
— | ≥ 1500 W | — |
— | ≥ 1600 W | — |
— | ≥ 800 W | — |
Temperature | 1500–2100 °C | — |
Thickness | ≤ 0.345 nm | — |
— | ≥ 1 W | — |
— | ≥ 1200 W | — |
Pressure | ≥ 1 MPa | — |
highly oriented graphene structure from graphene oxide
FIG. 1(A) illustrates a typical process for producing prior art pyrolytic graphitic films from a polymer. The process begins with carbonizing a polymer film 46 …
FIG.2 (B) An SEM image of a cross-section of a flexible graphite foil, showing many graphite flakes with orientations not parallel to the flexible graphite foil …
FIG. 3(D) is a plausible chemical linking mechanism where only 2 aligned GO molecules are shown as an example, although a large number of GO molecules can be …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 6(D). All these stacked and compressed samples have comparable thickness values. It is of significance to point out that a heat treatment temperature as …
FIG. 8. The result was quite shockingly different. The compressed film is highly porous with constituent GO sheets being 20 very poorly oriented and incapable of …
FIG.9 Thermal conductivity of HOGF samples (prepared with a final heat treatment temperature of 1,000 ° C and a final thickness of approximately 50 pm) plotted …
thermal conductivity of HOGF (claim 10) | ≥ 1300 W/mK | C |
electrical conductivity of HOGF (claim 10) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 11) | ≥ 1500 W/mK | C |
electrical conductivity of HOGF (claim 11) | ≥ 10000 S/cm | C |
thermal conductivity of HOGF (claim 12) | ≥ 1600 W/mK | C |
electrical conductivity of HOGF (claim 17) | ≥ 5000 S/cm | C |
thermal conductivity of HOGF (claim 17) | ≥ 800 W/mK | C |
physical density of HOGF (claim 17) | ≥ 1.9 g/cm3 | C |
tensile strength of HOGF (claim 17) | ≥ 80 MPa | C |
elastic modulus of HOGF (claim 17) | ≥ 60 GPa | C |
inter-plane spacing d002 of dried GO layer (claim 18 intermediate) | 0.4–1.2 nm | graphene oxide |
inter-plane spacing d002 of final HOGF (claim 18 product) | ≤ 0.4 nm | highly oriented graphene structure from graphene oxide |
Temperature | 1500–2500 °C | — |
Temperature | 300–1500 °C | — |
Thickness | 0.3354–0.36 nm | — |
Duration | 15–120 s | — |
Temperature | 100–500 °C | — |
Duration | 900–7200 s | — |
Duration | 0.2–1 hour | — |
Duration | 48–72 hours | — |
Duration | 1–5 hours | — |
Pressure | 14–29 MPa | — |
Pressure | 23–52 MPa | — |
Temperature | 700–2800 °C | — |
Temperature | 100–300 °C | — |
Temperature | 1500–3200 °C | — |
Temperature | 280–300 °C | — |
Thickness | 0.6–1.2 nm | — |
— | 800–1200 W | — |
— | 1200–1500 W | — |
Duration | 1–4 hours | — |
Duration | 1–2 hours | — |
Duration | 0.5–2 hours | — |
Temperature | 800–1050 °C | — |
— | 140–300 W | — |
— | 10–30 W | — |
Duration | 5–16 hours | — |
Temperature | 80–350 °C | — |
Duration | 1–8 hours | — |
Temperature | 1500–2850 °C | — |
Duration | 48–96 hours | — |
Duration | 10–100 minutes | — |
Temperature | 80–500 °C | — |
Duration | 1–10 hours | — |
Duration | 0.5–5 hours | — |
Temperature | 3000–3250 °C | — |
Temperature | 500–1500 °C | — |
Temperature | 1500–2000 °C | — |
Temperature | 2500–3000 °C | — |
Thickness | ≤ 2 mm | — |
Thickness | ≤ 1 mm | — |
Thickness | ≤ 0.5 mm | — |
Thickness | ≤ 0.2 mm | — |
Thickness | ≤ 0.344 nm | — |
Temperature | ≤ 2500 °C | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 10 nm | — |
— | ≤ 400 W | — |
— | ≤ 0.1 ev | — |
— | ≤ 1 W | — |
Thickness | ≥ 0.1 mm | — |
Thickness | ≥ 1 mm | — |
Duration | ≥ 1 hour | — |
Temperature | ≥ 80 °C | — |
Temperature | ≥ 1 °C | — |
Temperature | ≥ 500 °C | — |
— | ≥ 1700 W | — |
Thickness | ≥ 1 nm | — |
Temperature | ≥ 1500 °C | — |
Temperature | ≥ 2000 °C | — |
— | ≥ 440 W | — |
— | ≥ 860 W | — |
— | ≥ 1730 W | — |
Pressure | ≥ 120 MPa | — |
— | ≥ 1300 W | — |
— | ≥ 1500 W | — |
— | ≥ 1600 W | — |
— | ≥ 800 W | — |
Temperature | 1500–2100 °C | — |
Thickness | ≤ 0.345 nm | — |
— | ≥ 1 W | — |
— | ≥ 1200 W | — |
Pressure | ≥ 1 MPa | — |