Patent
US 8,278,656support material (sapphire, silicon carbide, silicon, metal, quartz, ZnO, spinel, or glassy/amorphous material)
silica glass (strain point ≥ 550 °C)
alkali-ion barrier sublayer (SiOC, Si₃N4, SiO2, TiN, Al₂O₃ or mixtures)
zinc tin oxide (intermediate layer)
gallium nitride
GaN
intermediate layer comprising oxides of at least two elements from Sn, Zn, In, Ga, Sb
| — |
Thickness | 2–100 nm | — |
GALLIUM NITRIDE-BASED SINTERED BODY AND METHOD FOR MANUFACTURING SAME
support material (sapphire, silicon carbide, silicon, metal, quartz, ZnO, spinel, or glassy/amorphous material)
silica glass (strain point ≥ 550 °C)
alkali-ion barrier sublayer (SiOC, Si₃N4, SiO2, TiN, Al₂O₃ or mixtures)
zinc tin oxide (intermediate layer)
gallium nitride
GaN
intermediate layer comprising oxides of at least two elements from Sn, Zn, In, Ga, Sb
| — |
Thickness | 2–100 nm | — |
GALLIUM NITRIDE-BASED SINTERED BODY AND METHOD FOR MANUFACTURING SAME
support material (sapphire, silicon carbide, silicon, metal, quartz, ZnO, spinel, or glassy/amorphous material)
silica glass (strain point ≥ 550 °C)
alkali-ion barrier sublayer (SiOC, Si₃N4, SiO2, TiN, Al₂O₃ or mixtures)
zinc tin oxide (intermediate layer)
gallium nitride
GaN
intermediate layer comprising oxides of at least two elements from Sn, Zn, In, Ga, Sb
| — |
Thickness | 2–100 nm | — |
GALLIUM NITRIDE-BASED SINTERED BODY AND METHOD FOR MANUFACTURING SAME
support material (sapphire, silicon carbide, silicon, metal, quartz, ZnO, spinel, or glassy/amorphous material)
silica glass (strain point ≥ 550 °C)
alkali-ion barrier sublayer (SiOC, Si₃N4, SiO2, TiN, Al₂O₃ or mixtures)
zinc tin oxide (intermediate layer)
gallium nitride
GaN
intermediate layer comprising oxides of at least two elements from Sn, Zn, In, Ga, Sb
| — |
Thickness | 2–100 nm | — |
GALLIUM NITRIDE-BASED SINTERED BODY AND METHOD FOR MANUFACTURING SAME