Patent
US 11,415,518Patent
Atlas literature
Patent
US 11,415,518Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A illustrates an ideal vertical GaN diode comprising a defect-free N+ GaN substrate 101, an N- GaN epitaxial layer 102 formed on an upper surface of …
FIG. 2 is an image illustrating a map of leakage current exhibited by an area of a GaN substrate having a smooth, defect-free surface versus an area of the …
FIG. 3 is a plot showing the results of Raman spectroscopy performed on three different regions of a GaN surface, showing the wavenumbers at which the …
FIG. 4A illustrates the effect of carrier concentration on the A i (LO) peak wavenumber. The A i (LO) peak wavenumber at a given location on the GaN wafer can …
FIG. 5 A, the wavenumbers for the Raman E 2 peaks at each of a plurality of points on the GaN surface are shown by means of the color intensity legend …
FIG. 6B) of uniform, regular non-uniform, and irregular non-uniform GaN samples. In the optical images shown in
FIG. 7B shows the long-term electrical stress test of devices on and off the features (circled regions in FIG 5 A and S B) by applying a constant 100 mA …
FIG. 8 is an exemplary Raman map produced in accordance with the present invention, showing specific areas on the GaN surface exhibiting peak wavenumbers …
FIGS. 9A-9B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIGS. 10A-lO B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIG. 12B) bias of PIN devices in the regions of high and low carrier concentration (n) of varying diameters. The regions are identified using the same Raman …
FIG. 13D. It has a success rate of 60% instead of 85% due to fewer false positives. The cutoff ratio for the A i (LO) peak can also be established by comparing …
FIG. 14 of an exemplary photoluminescence (PL) spectrum, showing a band edge peak at 3.4 eV (365 nm), a donor acceptor peak around 400 nm, and a yellow band …
FIGS. 15 A and 15B depict exemplary PL images of Type I and Type II wafers, respectively. It is rare for GaN wafers to have no defect peaks and most wafers …
FIG. 16A depicts a PL map of the intensity of the band edge peak with a corresponding Ai (LO) Raman map being shown in FIG 16B. In the PL map, there are areas …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for identifying a density of defects in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an E 2 peak wavenumber associated with an E 2 phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the E 2 peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of defects at each of the plurality of locations in the GaN sample.
A method for identifying a density of charge carriers in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an A i (LO) peak wavenumber associated with an A i (LO) phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the A i (LO) peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of charge carriers at each of the plurality of locations in the G aN sample.
A method for identifying a presence of grain boundaries in a G aN sample, the method including the steps of. performing Raman spectroscopy at on a predetermined plurality of locations on a surface of the G aN sample; receiving, at a processor programmed with appropriate software, data of an A i (TO) peak wavenumber associated with an A i (TO) phonon peak of the G aN sample at each of the plurality of locations on the G aN sample surface, the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the G aN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the A i (TO) peak wavenumber at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of a location of the at least one grain boundary in the G aN sample.
A method for identifying at least one area on a surface of a G aN sample suitable for electronic device fabrication, the method including the steps of. performing Raman spectroscopy at a predetermined plurality of locations on the surface of the G aN sample; for each of the plurality of locations on the G aN sample surface, receiving, at a processor programmed with appropriate software, data of at least one of an E 2 peak wavenumber associated with an E 2 phonon peak of the G aN sample, an A i (LO) peak wavenumber associated with an Ai (LO) phonon peak of the G aN sample, and an A i (TO) peak wavenumber associated with an Ai (TO) phonon peak of the G aN sample, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location, and the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the GaN sample at that location; using the processor, generating at least one map of the GaN sample surface, the map providing an indicia of the E 2, A i (LO), or A i (TO) peak wavenumber at each of the plurality of locations on the GaN substrate surface; and using the generated map, identifying areas of the GaN sample surface satisfying at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion for fabrication of a predetermined electronic device on the GaN substrate.
The method according to claim 4, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge car rier concentration, or grain boundary density criterion.
A method for identifying a conductivity of a GaN sample, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the GaN sample.
A method for identifying at least one area on a surface of a GaN sample suitable for electronic device fabrication, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the G aN sample; and using the generated map, identifying areas of the G aN sample surface satisfying a predetermined conductivity criterion for fabrication of a predetermined electronic device on the G aN substrate.
The method according to claim 9, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the predetermined conductivity criterion.
Layer stacks claimed or described, ordered top of device to substrate.
vertical GaN P-i-N diode
Materials described outside the worked examples.
GaN
Measurements and analyses referenced in the patent, with their drawing references.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 566.45–566.55 cm | — |
Thickness | ≤ 100000000000000000 cm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,415,518Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A illustrates an ideal vertical GaN diode comprising a defect-free N+ GaN substrate 101, an N- GaN epitaxial layer 102 formed on an upper surface of …
FIG. 2 is an image illustrating a map of leakage current exhibited by an area of a GaN substrate having a smooth, defect-free surface versus an area of the …
FIG. 3 is a plot showing the results of Raman spectroscopy performed on three different regions of a GaN surface, showing the wavenumbers at which the …
FIG. 4A illustrates the effect of carrier concentration on the A i (LO) peak wavenumber. The A i (LO) peak wavenumber at a given location on the GaN wafer can …
FIG. 5 A, the wavenumbers for the Raman E 2 peaks at each of a plurality of points on the GaN surface are shown by means of the color intensity legend …
FIG. 6B) of uniform, regular non-uniform, and irregular non-uniform GaN samples. In the optical images shown in
FIG. 7B shows the long-term electrical stress test of devices on and off the features (circled regions in FIG 5 A and S B) by applying a constant 100 mA …
FIG. 8 is an exemplary Raman map produced in accordance with the present invention, showing specific areas on the GaN surface exhibiting peak wavenumbers …
FIGS. 9A-9B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIGS. 10A-lO B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIG. 12B) bias of PIN devices in the regions of high and low carrier concentration (n) of varying diameters. The regions are identified using the same Raman …
FIG. 13D. It has a success rate of 60% instead of 85% due to fewer false positives. The cutoff ratio for the A i (LO) peak can also be established by comparing …
FIG. 14 of an exemplary photoluminescence (PL) spectrum, showing a band edge peak at 3.4 eV (365 nm), a donor acceptor peak around 400 nm, and a yellow band …
FIGS. 15 A and 15B depict exemplary PL images of Type I and Type II wafers, respectively. It is rare for GaN wafers to have no defect peaks and most wafers …
FIG. 16A depicts a PL map of the intensity of the band edge peak with a corresponding Ai (LO) Raman map being shown in FIG 16B. In the PL map, there are areas …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for identifying a density of defects in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an E 2 peak wavenumber associated with an E 2 phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the E 2 peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of defects at each of the plurality of locations in the GaN sample.
A method for identifying a density of charge carriers in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an A i (LO) peak wavenumber associated with an A i (LO) phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the A i (LO) peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of charge carriers at each of the plurality of locations in the G aN sample.
A method for identifying a presence of grain boundaries in a G aN sample, the method including the steps of. performing Raman spectroscopy at on a predetermined plurality of locations on a surface of the G aN sample; receiving, at a processor programmed with appropriate software, data of an A i (TO) peak wavenumber associated with an A i (TO) phonon peak of the G aN sample at each of the plurality of locations on the G aN sample surface, the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the G aN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the A i (TO) peak wavenumber at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of a location of the at least one grain boundary in the G aN sample.
A method for identifying at least one area on a surface of a G aN sample suitable for electronic device fabrication, the method including the steps of. performing Raman spectroscopy at a predetermined plurality of locations on the surface of the G aN sample; for each of the plurality of locations on the G aN sample surface, receiving, at a processor programmed with appropriate software, data of at least one of an E 2 peak wavenumber associated with an E 2 phonon peak of the G aN sample, an A i (LO) peak wavenumber associated with an Ai (LO) phonon peak of the G aN sample, and an A i (TO) peak wavenumber associated with an Ai (TO) phonon peak of the G aN sample, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location, and the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the GaN sample at that location; using the processor, generating at least one map of the GaN sample surface, the map providing an indicia of the E 2, A i (LO), or A i (TO) peak wavenumber at each of the plurality of locations on the GaN substrate surface; and using the generated map, identifying areas of the GaN sample surface satisfying at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion for fabrication of a predetermined electronic device on the GaN substrate.
The method according to claim 4, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge car rier concentration, or grain boundary density criterion.
A method for identifying a conductivity of a GaN sample, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the GaN sample.
A method for identifying at least one area on a surface of a GaN sample suitable for electronic device fabrication, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the G aN sample; and using the generated map, identifying areas of the G aN sample surface satisfying a predetermined conductivity criterion for fabrication of a predetermined electronic device on the G aN substrate.
The method according to claim 9, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the predetermined conductivity criterion.
Layer stacks claimed or described, ordered top of device to substrate.
vertical GaN P-i-N diode
Materials described outside the worked examples.
GaN
Measurements and analyses referenced in the patent, with their drawing references.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 566.45–566.55 cm | — |
Thickness | ≤ 100000000000000000 cm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,415,518Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A illustrates an ideal vertical GaN diode comprising a defect-free N+ GaN substrate 101, an N- GaN epitaxial layer 102 formed on an upper surface of …
FIG. 2 is an image illustrating a map of leakage current exhibited by an area of a GaN substrate having a smooth, defect-free surface versus an area of the …
FIG. 3 is a plot showing the results of Raman spectroscopy performed on three different regions of a GaN surface, showing the wavenumbers at which the …
FIG. 4A illustrates the effect of carrier concentration on the A i (LO) peak wavenumber. The A i (LO) peak wavenumber at a given location on the GaN wafer can …
FIG. 5 A, the wavenumbers for the Raman E 2 peaks at each of a plurality of points on the GaN surface are shown by means of the color intensity legend …
FIG. 6B) of uniform, regular non-uniform, and irregular non-uniform GaN samples. In the optical images shown in
FIG. 7B shows the long-term electrical stress test of devices on and off the features (circled regions in FIG 5 A and S B) by applying a constant 100 mA …
FIG. 8 is an exemplary Raman map produced in accordance with the present invention, showing specific areas on the GaN surface exhibiting peak wavenumbers …
FIGS. 9A-9B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIGS. 10A-lO B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIG. 12B) bias of PIN devices in the regions of high and low carrier concentration (n) of varying diameters. The regions are identified using the same Raman …
FIG. 13D. It has a success rate of 60% instead of 85% due to fewer false positives. The cutoff ratio for the A i (LO) peak can also be established by comparing …
FIG. 14 of an exemplary photoluminescence (PL) spectrum, showing a band edge peak at 3.4 eV (365 nm), a donor acceptor peak around 400 nm, and a yellow band …
FIGS. 15 A and 15B depict exemplary PL images of Type I and Type II wafers, respectively. It is rare for GaN wafers to have no defect peaks and most wafers …
FIG. 16A depicts a PL map of the intensity of the band edge peak with a corresponding Ai (LO) Raman map being shown in FIG 16B. In the PL map, there are areas …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for identifying a density of defects in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an E 2 peak wavenumber associated with an E 2 phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the E 2 peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of defects at each of the plurality of locations in the GaN sample.
A method for identifying a density of charge carriers in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an A i (LO) peak wavenumber associated with an A i (LO) phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the A i (LO) peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of charge carriers at each of the plurality of locations in the G aN sample.
A method for identifying a presence of grain boundaries in a G aN sample, the method including the steps of. performing Raman spectroscopy at on a predetermined plurality of locations on a surface of the G aN sample; receiving, at a processor programmed with appropriate software, data of an A i (TO) peak wavenumber associated with an A i (TO) phonon peak of the G aN sample at each of the plurality of locations on the G aN sample surface, the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the G aN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the A i (TO) peak wavenumber at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of a location of the at least one grain boundary in the G aN sample.
A method for identifying at least one area on a surface of a G aN sample suitable for electronic device fabrication, the method including the steps of. performing Raman spectroscopy at a predetermined plurality of locations on the surface of the G aN sample; for each of the plurality of locations on the G aN sample surface, receiving, at a processor programmed with appropriate software, data of at least one of an E 2 peak wavenumber associated with an E 2 phonon peak of the G aN sample, an A i (LO) peak wavenumber associated with an Ai (LO) phonon peak of the G aN sample, and an A i (TO) peak wavenumber associated with an Ai (TO) phonon peak of the G aN sample, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location, and the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the GaN sample at that location; using the processor, generating at least one map of the GaN sample surface, the map providing an indicia of the E 2, A i (LO), or A i (TO) peak wavenumber at each of the plurality of locations on the GaN substrate surface; and using the generated map, identifying areas of the GaN sample surface satisfying at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion for fabrication of a predetermined electronic device on the GaN substrate.
The method according to claim 4, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge car rier concentration, or grain boundary density criterion.
A method for identifying a conductivity of a GaN sample, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the GaN sample.
A method for identifying at least one area on a surface of a GaN sample suitable for electronic device fabrication, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the G aN sample; and using the generated map, identifying areas of the G aN sample surface satisfying a predetermined conductivity criterion for fabrication of a predetermined electronic device on the G aN substrate.
The method according to claim 9, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the predetermined conductivity criterion.
Layer stacks claimed or described, ordered top of device to substrate.
vertical GaN P-i-N diode
Materials described outside the worked examples.
GaN
Measurements and analyses referenced in the patent, with their drawing references.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 566.45–566.55 cm | — |
Thickness | ≤ 100000000000000000 cm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 11,415,518Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1 A illustrates an ideal vertical GaN diode comprising a defect-free N+ GaN substrate 101, an N- GaN epitaxial layer 102 formed on an upper surface of …
FIG. 2 is an image illustrating a map of leakage current exhibited by an area of a GaN substrate having a smooth, defect-free surface versus an area of the …
FIG. 3 is a plot showing the results of Raman spectroscopy performed on three different regions of a GaN surface, showing the wavenumbers at which the …
FIG. 4A illustrates the effect of carrier concentration on the A i (LO) peak wavenumber. The A i (LO) peak wavenumber at a given location on the GaN wafer can …
FIG. 5 A, the wavenumbers for the Raman E 2 peaks at each of a plurality of points on the GaN surface are shown by means of the color intensity legend …
FIG. 6B) of uniform, regular non-uniform, and irregular non-uniform GaN samples. In the optical images shown in
FIG. 7B shows the long-term electrical stress test of devices on and off the features (circled regions in FIG 5 A and S B) by applying a constant 100 mA …
FIG. 8 is an exemplary Raman map produced in accordance with the present invention, showing specific areas on the GaN surface exhibiting peak wavenumbers …
FIGS. 9A-9B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIGS. 10A-lO B illustrate aspects of use of the Raman mapping method for evaluating GaN wafers in accordance with the present invention to identify relatively …
FIG. 12B) bias of PIN devices in the regions of high and low carrier concentration (n) of varying diameters. The regions are identified using the same Raman …
FIG. 13D. It has a success rate of 60% instead of 85% due to fewer false positives. The cutoff ratio for the A i (LO) peak can also be established by comparing …
FIG. 14 of an exemplary photoluminescence (PL) spectrum, showing a band edge peak at 3.4 eV (365 nm), a donor acceptor peak around 400 nm, and a yellow band …
FIGS. 15 A and 15B depict exemplary PL images of Type I and Type II wafers, respectively. It is rare for GaN wafers to have no defect peaks and most wafers …
FIG. 16A depicts a PL map of the intensity of the band edge peak with a corresponding Ai (LO) Raman map being shown in FIG 16B. In the PL map, there are areas …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for identifying a density of defects in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an E 2 peak wavenumber associated with an E 2 phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the E 2 peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of defects at each of the plurality of locations in the GaN sample.
A method for identifying a density of charge carriers in a GaN sample, the method including the steps of: performing Raman spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of an A i (LO) peak wavenumber associated with an A i (LO) phonon peak of the GaN sample at each of the plurality of locations on the GaN sample surface, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the A i (LO) peak wavenumber at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the density of charge carriers at each of the plurality of locations in the G aN sample.
A method for identifying a presence of grain boundaries in a G aN sample, the method including the steps of. performing Raman spectroscopy at on a predetermined plurality of locations on a surface of the G aN sample; receiving, at a processor programmed with appropriate software, data of an A i (TO) peak wavenumber associated with an A i (TO) phonon peak of the G aN sample at each of the plurality of locations on the G aN sample surface, the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the G aN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the A i (TO) peak wavenumber at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of a location of the at least one grain boundary in the G aN sample.
A method for identifying at least one area on a surface of a G aN sample suitable for electronic device fabrication, the method including the steps of. performing Raman spectroscopy at a predetermined plurality of locations on the surface of the G aN sample; for each of the plurality of locations on the G aN sample surface, receiving, at a processor programmed with appropriate software, data of at least one of an E 2 peak wavenumber associated with an E 2 phonon peak of the G aN sample, an A i (LO) peak wavenumber associated with an Ai (LO) phonon peak of the G aN sample, and an A i (TO) peak wavenumber associated with an Ai (TO) phonon peak of the G aN sample, the E 2 peak wavenumber at each location being indicative of a determinable density of defects within the GaN sample at that location, the A i (LO) peak wavenumber at each location being indicative of a determinable density of charge carriers within the GaN sample at that location, and the A i (TO) peak wavenumber at each location being indicative of a presence of at least one grain boundary within the GaN sample at that location; using the processor, generating at least one map of the GaN sample surface, the map providing an indicia of the E 2, A i (LO), or A i (TO) peak wavenumber at each of the plurality of locations on the GaN substrate surface; and using the generated map, identifying areas of the GaN sample surface satisfying at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion for fabrication of a predetermined electronic device on the GaN substrate.
The method according to claim 4, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge carrier concentration, or grain boundary density criterion.
The method according to claim 4, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the at least one predetermined defect density, charge car rier concentration, or grain boundary density criterion.
A method for identifying a conductivity of a GaN sample, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the GaN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the GaN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the GaN sample.
A method for identifying at least one area on a surface of a GaN sample suitable for electronic device fabrication, the method including the steps of: performing photoluminescence (PL) spectroscopy at a predetermined plurality of locations on a surface of the GaN sample; receiving, at a processor programmed with appropriate software, data of a wavenumber at which the photoluminescence spectroscopy exhibits a peak intensity at each of the plurality of locations on the GaN surface, the wavenumber having the peak intensity being indicative of a determinable conductivity of the GaN sample at that location; and using the processor, generating a map of the G aN sample surface, the map providing an indicia of the wavenumber having the peak intensity at each of the plurality of locations on the G aN sample surface; wherein the map provides an indicia of the conductivity at each of the plurality of locations in the G aN sample; and using the generated map, identifying areas of the G aN sample surface satisfying a predetermined conductivity criterion for fabrication of a predetermined electronic device on the G aN substrate.
The method according to claim 9, further including the step of determining a size of the predetermined electronic device that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a number of the predetermined electronic devices that can be fabricated on the area on the G aN substrate surface satisfying the predetermined conductivity criterion.
The method according to claim 9, further including the step of determining a placement of at least one of the predetermined electronic device that can be fabricated on the area on the GaN substrate surface satisfying the predetermined conductivity criterion.
Layer stacks claimed or described, ordered top of device to substrate.
vertical GaN P-i-N diode
Materials described outside the worked examples.
GaN
Measurements and analyses referenced in the patent, with their drawing references.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 566.45–566.55 cm | — |
Thickness | ≤ 100000000000000000 cm |
Related documents with shared materials, methods, properties, or citations.
| — |
Thickness | ≤ 566.4 cm | — |
| — |
Thickness | ≤ 566.4 cm | — |
| — |
Thickness | ≤ 566.4 cm | — |
| — |
Thickness | ≤ 566.4 cm | — |
