MULTI-LAYER GALLIUM ARSENIDE-BASED FRESNEL PHASE-SHIFT DEVICE FOR INFRARED WAVELENGTH CONVERSION | Matter42 Literature
Patent
Atlas literature
Patent
US 8,619,356
MULTI-LAYER GALLIUM ARSENIDE-BASED FRESNEL PHASE-SHIFT DEVICE FOR INFRARED WAVELENGTH CONVERSION
David Weyburne
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a schematic side view of a layered structure for quasi-phase- matching according to the teachings of the present invention showing thin Al xGaixAs …
FIG. 2
apparatus side view
FIG. 2 is a schematic side view of a crystal structure according to the teachings of the present invention showing the input of a pump beam into the crystal …
FIG. 3
apparatus side view
FIG. 3 is a schematic side view of a crystal structure according to the teachings of the present invention showing pump beam propagation through the wafer and …
FIG. 4
FIG. 4 shows one possible implementation of the new invention. The GaAs crystal wafer is shown on its side. The epitaxial layers (not shown in this view) are …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
(orginal) A method for making a nonlinear optical crystal structure, comprising depositing contiguous alternating layers of gallium arsenide and aluminum gallium arsenide onto a substrate, wherein every layer of gallium arsenide is a first thickness greater than about 1 mm and every layer of aluminum gallium arsenide is a second, thinner, thickness. unknown
Additional fabrication and treatment steps described in the patent.
1
Epitaxial Growth
Step 1
Process details
description:Depositing contiguous alternating layers of GaAs and AlGaAs onto a GaAs substrate; GaAs layers are greater than about 1 mm thick; AlGaAs layers are thinner; total epitaxial thickness plus wafer approximately 1 mm; wafer may be ground/polished post-growth and cut into rectangles with beveled ends
Materials:GaAsAlGaAs
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
4–5 mm
—
Thickness
0.5–1 mm
Why these are connected
Related documents with shared materials, methods, properties, or citations.
MULTI-LAYER GALLIUM ARSENIDE-BASED FRESNEL PHASE-SHIFT DEVICE FOR INFRARED WAVELENGTH CONVERSION
David Weyburne
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a schematic side view of a layered structure for quasi-phase- matching according to the teachings of the present invention showing thin Al xGaixAs …
FIG. 2
apparatus side view
FIG. 2 is a schematic side view of a crystal structure according to the teachings of the present invention showing the input of a pump beam into the crystal …
FIG. 3
apparatus side view
FIG. 3 is a schematic side view of a crystal structure according to the teachings of the present invention showing pump beam propagation through the wafer and …
FIG. 4
FIG. 4 shows one possible implementation of the new invention. The GaAs crystal wafer is shown on its side. The epitaxial layers (not shown in this view) are …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
(orginal) A method for making a nonlinear optical crystal structure, comprising depositing contiguous alternating layers of gallium arsenide and aluminum gallium arsenide onto a substrate, wherein every layer of gallium arsenide is a first thickness greater than about 1 mm and every layer of aluminum gallium arsenide is a second, thinner, thickness. unknown
Additional fabrication and treatment steps described in the patent.
1
Epitaxial Growth
Step 1
Process details
description:Depositing contiguous alternating layers of GaAs and AlGaAs onto a GaAs substrate; GaAs layers are greater than about 1 mm thick; AlGaAs layers are thinner; total epitaxial thickness plus wafer approximately 1 mm; wafer may be ground/polished post-growth and cut into rectangles with beveled ends
Materials:GaAsAlGaAs
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
4–5 mm
—
Thickness
0.5–1 mm
Why these are connected
Related documents with shared materials, methods, properties, or citations.
MULTI-LAYER GALLIUM ARSENIDE-BASED FRESNEL PHASE-SHIFT DEVICE FOR INFRARED WAVELENGTH CONVERSION
David Weyburne
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a schematic side view of a layered structure for quasi-phase- matching according to the teachings of the present invention showing thin Al xGaixAs …
FIG. 2
apparatus side view
FIG. 2 is a schematic side view of a crystal structure according to the teachings of the present invention showing the input of a pump beam into the crystal …
FIG. 3
apparatus side view
FIG. 3 is a schematic side view of a crystal structure according to the teachings of the present invention showing pump beam propagation through the wafer and …
FIG. 4
FIG. 4 shows one possible implementation of the new invention. The GaAs crystal wafer is shown on its side. The epitaxial layers (not shown in this view) are …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
(orginal) A method for making a nonlinear optical crystal structure, comprising depositing contiguous alternating layers of gallium arsenide and aluminum gallium arsenide onto a substrate, wherein every layer of gallium arsenide is a first thickness greater than about 1 mm and every layer of aluminum gallium arsenide is a second, thinner, thickness. unknown
Additional fabrication and treatment steps described in the patent.
1
Epitaxial Growth
Step 1
Process details
description:Depositing contiguous alternating layers of GaAs and AlGaAs onto a GaAs substrate; GaAs layers are greater than about 1 mm thick; AlGaAs layers are thinner; total epitaxial thickness plus wafer approximately 1 mm; wafer may be ground/polished post-growth and cut into rectangles with beveled ends
Materials:GaAsAlGaAs
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
4–5 mm
—
Thickness
0.5–1 mm
Why these are connected
Related documents with shared materials, methods, properties, or citations.
MULTI-LAYER GALLIUM ARSENIDE-BASED FRESNEL PHASE-SHIFT DEVICE FOR INFRARED WAVELENGTH CONVERSION
David Weyburne
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
apparatus side view
FIG. 1 is a schematic side view of a layered structure for quasi-phase- matching according to the teachings of the present invention showing thin Al xGaixAs …
FIG. 2
apparatus side view
FIG. 2 is a schematic side view of a crystal structure according to the teachings of the present invention showing the input of a pump beam into the crystal …
FIG. 3
apparatus side view
FIG. 3 is a schematic side view of a crystal structure according to the teachings of the present invention showing pump beam propagation through the wafer and …
FIG. 4
FIG. 4 shows one possible implementation of the new invention. The GaAs crystal wafer is shown on its side. The epitaxial layers (not shown in this view) are …
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
(orginal) A method for making a nonlinear optical crystal structure, comprising depositing contiguous alternating layers of gallium arsenide and aluminum gallium arsenide onto a substrate, wherein every layer of gallium arsenide is a first thickness greater than about 1 mm and every layer of aluminum gallium arsenide is a second, thinner, thickness. unknown
Additional fabrication and treatment steps described in the patent.
1
Epitaxial Growth
Step 1
Process details
description:Depositing contiguous alternating layers of GaAs and AlGaAs onto a GaAs substrate; GaAs layers are greater than about 1 mm thick; AlGaAs layers are thinner; total epitaxial thickness plus wafer approximately 1 mm; wafer may be ground/polished post-growth and cut into rectangles with beveled ends
Materials:GaAsAlGaAs
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Thickness
4–5 mm
—
Thickness
0.5–1 mm
Why these are connected
Related documents with shared materials, methods, properties, or citations.