Patent
US 8,653,503LED or Laser Diode structure with IQE > 15% and EQE > 1%
Gallium Nitride
GaN
| 10–30 % |
AlxIn₁-xNAlyInzGa₁-y-zN |
IQE of AlInGaN-based LEDs (background/prior art reference) | 15 % | AlyInzGa₁-y-zN |
Pressure | 5–760 torr | — |
Temperature | 600–1000 °C | — |
Thickness | 3–10 nm | — |
Temperature | 10–80 °C | — |
Duration | 1–10 minutes | — |
Thickness | ≤ 360 nm | — |
Thickness | ≤ 1000000 cm | — |
LED or Laser Diode structure with IQE > 15% and EQE > 1%
Gallium Nitride
GaN
| 10–30 % |
AlxIn₁-xNAlyInzGa₁-y-zN |
IQE of AlInGaN-based LEDs (background/prior art reference) | 15 % | AlyInzGa₁-y-zN |
Pressure | 5–760 torr | — |
Temperature | 600–1000 °C | — |
Thickness | 3–10 nm | — |
Temperature | 10–80 °C | — |
Duration | 1–10 minutes | — |
Thickness | ≤ 360 nm | — |
Thickness | ≤ 1000000 cm | — |
LED or Laser Diode structure with IQE > 15% and EQE > 1%
Gallium Nitride
GaN
| 10–30 % |
AlxIn₁-xNAlyInzGa₁-y-zN |
IQE of AlInGaN-based LEDs (background/prior art reference) | 15 % | AlyInzGa₁-y-zN |
Pressure | 5–760 torr | — |
Temperature | 600–1000 °C | — |
Thickness | 3–10 nm | — |
Temperature | 10–80 °C | — |
Duration | 1–10 minutes | — |
Thickness | ≤ 360 nm | — |
Thickness | ≤ 1000000 cm | — |
LED or Laser Diode structure with IQE > 15% and EQE > 1%
Gallium Nitride
GaN
| 10–30 % |
AlxIn₁-xNAlyInzGa₁-y-zN |
IQE of AlInGaN-based LEDs (background/prior art reference) | 15 % | AlyInzGa₁-y-zN |
Pressure | 5–760 torr | — |
Temperature | 600–1000 °C | — |
Thickness | 3–10 nm | — |
Temperature | 10–80 °C | — |
Duration | 1–10 minutes | — |
Thickness | ≤ 360 nm | — |
Thickness | ≤ 1000000 cm | — |