Research paper
Experimental GrowthExperimental CharacterizationEach sample groups how it was prepared, characterized, and measured. Click a card to expand.
8 preparations5 characterizations22 properties3 figures
3 preparations2 characterizations4 properties2 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Misorientation | wafer misorientation range | within ±0.5° | — | |||
| Layer Thickness | GaAs epilayer thickness | 420nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.91nm | — | |||
| Threading Dislocation Density | TDD | 49000000cm⁻² | — | |||
| Layer Thickness | GaAs buffer thickness | 300nm | — | |||
| Layer Thickness | InGaAs quantum well thickness | 8nm | — | |||
| Layer Thickness | lower cladding thickness | 1.5um | — | |||
| Layer Thickness | upper cladding thickness | 1.5um | — | |||
| Layer Thickness | n-GaAs contact layer thickness | 800nm | — | |||
| Layer Thickness | p-GaAs contact layer thickness | 200nm | — | |||
| Surface Roughness Rms | RMS roughness | 3.81nm | — | |||
| PL Peak | QW emission peak | around 980nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 14.1nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 9.2nm | — | |||
| Fet Threshold Voltage | threshold current | 165.1mA | — | |||
| Fet Threshold Voltage | threshold current density | 768A/cm² | — | |||
| Fet Threshold Voltage | threshold current | 70.5mA | — | |||
| Fet Threshold Voltage | threshold current density | 328A/cm² | — | |||
| Fet Sheet Resistance | differential resistance | 3.75ohm | — | |||
| Fet Sheet Resistance | differential resistance | 8.76ohm | — | |||
| Fet On Off Ratio | slope efficiency | 0.113W/A | — | |||
| Fet On Off Ratio | single-facet output power | 15.5mW | — | |||
| Fet On Off Ratio | single-facet output power | 22.5mW | — | |||
| Fet On Off Ratio | lasing wavelength | around 980nm | — | |||
| Surface Roughness Rms | template roughness | 0.91nm | — | |||
| PL Peak | regex-detected PL peak | 420nm | — | — | — | — |
Related documents with shared materials, methods, properties, or citations.
Energy–time entanglement from a monolithically integrated quantum dot on silicon
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Development and Performance Study of Vertical GaN α-Particle Detector with High Energy Resolution
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High-quality single InGaAs/GaAs quantum dot growth on a CMOS-compatible silicon substrate for quantum photonic applications
Low-threshold lasing of optically pumped micropillar lasers with Al0.2Ga0.8As/Al0.9Ga0.1As distributed Bragg reflectors
Microwave Performance of all MOCVD-grown AlScN/GaN MIS-HEMTs on Semi-Insulating GaN Substrates
Direct Epitaxial Growth and Deterministic Device Integration of high-quality Telecom O-Band InGaAs Quantum Dots on Silicon Substrate
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Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
8 preparations5 characterizations22 properties3 figures
3 preparations2 characterizations4 properties2 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Misorientation | wafer misorientation range | within ±0.5° | — | |||
| Layer Thickness | GaAs epilayer thickness | 420nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.91nm | — | |||
| Threading Dislocation Density | TDD | 49000000cm⁻² | — | |||
| Layer Thickness | GaAs buffer thickness | 300nm | — | |||
| Layer Thickness | InGaAs quantum well thickness | 8nm | — | |||
| Layer Thickness | lower cladding thickness | 1.5um | — | |||
| Layer Thickness | upper cladding thickness | 1.5um | — | |||
| Layer Thickness | n-GaAs contact layer thickness | 800nm | — | |||
| Layer Thickness | p-GaAs contact layer thickness | 200nm | — | |||
| Surface Roughness Rms | RMS roughness | 3.81nm | — | |||
| PL Peak | QW emission peak | around 980nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 14.1nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 9.2nm | — | |||
| Fet Threshold Voltage | threshold current | 165.1mA | — | |||
| Fet Threshold Voltage | threshold current density | 768A/cm² | — | |||
| Fet Threshold Voltage | threshold current | 70.5mA | — | |||
| Fet Threshold Voltage | threshold current density | 328A/cm² | — | |||
| Fet Sheet Resistance | differential resistance | 3.75ohm | — | |||
| Fet Sheet Resistance | differential resistance | 8.76ohm | — | |||
| Fet On Off Ratio | slope efficiency | 0.113W/A | — | |||
| Fet On Off Ratio | single-facet output power | 15.5mW | — | |||
| Fet On Off Ratio | single-facet output power | 22.5mW | — | |||
| Fet On Off Ratio | lasing wavelength | around 980nm | — | |||
| Surface Roughness Rms | template roughness | 0.91nm | — | |||
| PL Peak | regex-detected PL peak | 420nm | — | — | — | — |
Related documents with shared materials, methods, properties, or citations.
Energy–time entanglement from a monolithically integrated quantum dot on silicon
GaAs nano-ridge laser diodes fully fabricated in a 300 mm CMOS pilot line
Development and Performance Study of Vertical GaN α-Particle Detector with High Energy Resolution
Strain-Engineered Deterministic Quantum Dots for Telecom O-Band Emission Using Buried Stressors
Circularly polarized cavity-mode emission from quantum dots in a semiconductor three-dimensional chiral photonic crystal
High-quality single InGaAs/GaAs quantum dot growth on a CMOS-compatible silicon substrate for quantum photonic applications
Low-threshold lasing of optically pumped micropillar lasers with Al0.2Ga0.8As/Al0.9Ga0.1As distributed Bragg reflectors
Microwave Performance of all MOCVD-grown AlScN/GaN MIS-HEMTs on Semi-Insulating GaN Substrates
Direct Epitaxial Growth and Deterministic Device Integration of high-quality Telecom O-Band InGaAs Quantum Dots on Silicon Substrate
3 kV Monolithic Bidirectional GaN HEMT on Sapphire
Excited-State Trions in a Quantum Well
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
8 preparations5 characterizations22 properties3 figures
3 preparations2 characterizations4 properties2 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Misorientation | wafer misorientation range | within ±0.5° | — | |||
| Layer Thickness | GaAs epilayer thickness | 420nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.91nm | — | |||
| Threading Dislocation Density | TDD | 49000000cm⁻² | — | |||
| Layer Thickness | GaAs buffer thickness | 300nm | — | |||
| Layer Thickness | InGaAs quantum well thickness | 8nm | — | |||
| Layer Thickness | lower cladding thickness | 1.5um | — | |||
| Layer Thickness | upper cladding thickness | 1.5um | — | |||
| Layer Thickness | n-GaAs contact layer thickness | 800nm | — | |||
| Layer Thickness | p-GaAs contact layer thickness | 200nm | — | |||
| Surface Roughness Rms | RMS roughness | 3.81nm | — | |||
| PL Peak | QW emission peak | around 980nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 14.1nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 9.2nm | — | |||
| Fet Threshold Voltage | threshold current | 165.1mA | — | |||
| Fet Threshold Voltage | threshold current density | 768A/cm² | — | |||
| Fet Threshold Voltage | threshold current | 70.5mA | — | |||
| Fet Threshold Voltage | threshold current density | 328A/cm² | — | |||
| Fet Sheet Resistance | differential resistance | 3.75ohm | — | |||
| Fet Sheet Resistance | differential resistance | 8.76ohm | — | |||
| Fet On Off Ratio | slope efficiency | 0.113W/A | — | |||
| Fet On Off Ratio | single-facet output power | 15.5mW | — | |||
| Fet On Off Ratio | single-facet output power | 22.5mW | — | |||
| Fet On Off Ratio | lasing wavelength | around 980nm | — | |||
| Surface Roughness Rms | template roughness | 0.91nm | — | |||
| PL Peak | regex-detected PL peak | 420nm | — | — | — | — |
Related documents with shared materials, methods, properties, or citations.
Energy–time entanglement from a monolithically integrated quantum dot on silicon
GaAs nano-ridge laser diodes fully fabricated in a 300 mm CMOS pilot line
Development and Performance Study of Vertical GaN α-Particle Detector with High Energy Resolution
Strain-Engineered Deterministic Quantum Dots for Telecom O-Band Emission Using Buried Stressors
Circularly polarized cavity-mode emission from quantum dots in a semiconductor three-dimensional chiral photonic crystal
High-quality single InGaAs/GaAs quantum dot growth on a CMOS-compatible silicon substrate for quantum photonic applications
Low-threshold lasing of optically pumped micropillar lasers with Al0.2Ga0.8As/Al0.9Ga0.1As distributed Bragg reflectors
Microwave Performance of all MOCVD-grown AlScN/GaN MIS-HEMTs on Semi-Insulating GaN Substrates
Direct Epitaxial Growth and Deterministic Device Integration of high-quality Telecom O-Band InGaAs Quantum Dots on Silicon Substrate
3 kV Monolithic Bidirectional GaN HEMT on Sapphire
Excited-State Trions in a Quantum Well
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
8 preparations5 characterizations22 properties3 figures
3 preparations2 characterizations4 properties2 figures
| Type | Label | Value | Material | Sample | Condition | Source |
|---|---|---|---|---|---|---|
| Substrate Misorientation | wafer misorientation range | within ±0.5° | — | |||
| Layer Thickness | GaAs epilayer thickness | 420nm | — | |||
| Surface Roughness Rms | RMS roughness | 0.91nm | — | |||
| Threading Dislocation Density | TDD | 49000000cm⁻² | — | |||
| Layer Thickness | GaAs buffer thickness | 300nm | — | |||
| Layer Thickness | InGaAs quantum well thickness | 8nm | — | |||
| Layer Thickness | lower cladding thickness | 1.5um | — | |||
| Layer Thickness | upper cladding thickness | 1.5um | — | |||
| Layer Thickness | n-GaAs contact layer thickness | 800nm | — | |||
| Layer Thickness | p-GaAs contact layer thickness | 200nm | — | |||
| Surface Roughness Rms | RMS roughness | 3.81nm | — | |||
| PL Peak | QW emission peak | around 980nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 14.1nm | — | |||
| Pl Peak Fwhm | PL spectrum FWHM | 9.2nm | — | |||
| Fet Threshold Voltage | threshold current | 165.1mA | — | |||
| Fet Threshold Voltage | threshold current density | 768A/cm² | — | |||
| Fet Threshold Voltage | threshold current | 70.5mA | — | |||
| Fet Threshold Voltage | threshold current density | 328A/cm² | — | |||
| Fet Sheet Resistance | differential resistance | 3.75ohm | — | |||
| Fet Sheet Resistance | differential resistance | 8.76ohm | — | |||
| Fet On Off Ratio | slope efficiency | 0.113W/A | — | |||
| Fet On Off Ratio | single-facet output power | 15.5mW | — | |||
| Fet On Off Ratio | single-facet output power | 22.5mW | — | |||
| Fet On Off Ratio | lasing wavelength | around 980nm | — | |||
| Surface Roughness Rms | template roughness | 0.91nm | — | |||
| PL Peak | regex-detected PL peak | 420nm | — | — | — | — |
Related documents with shared materials, methods, properties, or citations.
Energy–time entanglement from a monolithically integrated quantum dot on silicon
GaAs nano-ridge laser diodes fully fabricated in a 300 mm CMOS pilot line
Development and Performance Study of Vertical GaN α-Particle Detector with High Energy Resolution
Strain-Engineered Deterministic Quantum Dots for Telecom O-Band Emission Using Buried Stressors
Circularly polarized cavity-mode emission from quantum dots in a semiconductor three-dimensional chiral photonic crystal
High-quality single InGaAs/GaAs quantum dot growth on a CMOS-compatible silicon substrate for quantum photonic applications
Low-threshold lasing of optically pumped micropillar lasers with Al0.2Ga0.8As/Al0.9Ga0.1As distributed Bragg reflectors
Microwave Performance of all MOCVD-grown AlScN/GaN MIS-HEMTs on Semi-Insulating GaN Substrates
Direct Epitaxial Growth and Deterministic Device Integration of high-quality Telecom O-Band InGaAs Quantum Dots on Silicon Substrate
3 kV Monolithic Bidirectional GaN HEMT on Sapphire
Excited-State Trions in a Quantum Well