etcher:Oxford PlasmaLab 150 Inductively Coupled Etcher
pitch nm:[240,242,244]
etch recipe:Cl2:BCl3:N₂ = 11:3:11
ion energy ev:138
rf power tuned:true
ipc power tuned:true
groove depths nm:[40,90,130]
grating dimensions um:[300,50]
filling factor range percent:[30,75]