Patent
US 10,374,106insulator material
silicon
Si
boron nitride
BN
silicon dioxide
SiO₂
silicon carbide
SiC
silicon on insulator (SOI) substrate
buried oxide
SiOx
non-planar stressed graphene
| — |
Thickness | 2–3 µm | — |
insulator material
silicon
Si
boron nitride
BN
silicon dioxide
SiO₂
silicon carbide
SiC
silicon on insulator (SOI) substrate
buried oxide
SiOx
non-planar stressed graphene
| — |
Thickness | 2–3 µm | — |
insulator material
silicon
Si
boron nitride
BN
silicon dioxide
SiO₂
silicon carbide
SiC
silicon on insulator (SOI) substrate
buried oxide
SiOx
non-planar stressed graphene
| — |
Thickness | 2–3 µm | — |
insulator material
silicon
Si
boron nitride
BN
silicon dioxide
SiO₂
silicon carbide
SiC
silicon on insulator (SOI) substrate
buried oxide
SiOx
non-planar stressed graphene
| — |
Thickness | 2–3 µm | — |