Patent
US 8,974,617METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF A SUBSTRATE FOR USE IN SEMICONDUCTOR DEVICE PACKAGE
Yu-Hsiang Hu
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 8,974,617Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 A to 1 F illustrate the steps of the method according to an embodiment. 25 [0016]
FIG. 2 illustrates a method for producing an imprinter device. [0017]
FIGS. 3A to 3C illustrate the bonding process for attaching two substrates, each provided with copper bumps covered by a graphene layer. 30 [0018]
FIGS. 4A and 4B illustrate how a connection between copper bumps covered by a graphene layer can be separated. [0019]
FIG. 5 illustrates two steps of the method according to a preferred embodiment, wherein said rim 6 portion is not protruding outward with respect to said front …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a sheet of graphene to a metal contact bump, comprising: providing a substrate comprising one or more 5 metal contact bumps on a surface of the substrate, the metal contact bumps being surrounded by a passivation layer; placing a sheet of graphene on the substrate, the sheet of graphene covering the one or more metal 10 contact bumps, aligning an imprinter device with respect to the substrate, the imprinter device comprising an imprinter substrate having a front surface that is provided with one or more cavities through the front surface, each cavity having a rim portion, wherein a number of the one or more cavities is at least the same as a number of the one or more metal contact bumps, wherein the imprinter device is positioned so that each of the one or more metal contact bumps is 20 aligned with one of the cavities; lowering the imprinter device with respect to the substrate so that each of the one or more metal contact bumps becomes enclosed within a corresponding cavity, thereby arranging the sheet of graphene such 25 that it is in contact with top and side surfaces of the one or more metal contact bumps; pushing down the imprinter device until each rim portion cuts through the sheet of graphene; lifting up the imprinter device, so as to leave a 30 graphene sheet portion attached to the substrate and covering each of the one or more metal contact bumps, with unattached graphene sheet portions remaining on the substrate in between each of the one or more metal contact bumps; and 19 removing the unattached graphene sheet portions by cleaning.
The method according to Claim 1, wherein each rim portion protrudes outward with respect to said the surface 5 of the imprinter substrate.
The method according to Claim 1, wherein the one or more metal contact bumps are copper bumps.
The method according to Claim 1, wherein each rim portion is pushed into a surface of the passivation layer, 10 thereby imprinting each rim portion into the passivation layer, and thereby attaching the graphene sheet portions to the passivation layer.
The method according to Claim 1, wherein the substrate is an integrated circuit or a substrate 15 configured for receiving a plurality of integrated circuits on its surface.
The method according to Claim 1, wherein the imprinter substrate is selected from the group consisting of a metal substrate, a silicon substrate, and a silicon 20 substrate with a silicon nitride layer provided on thereon.
An imprinter device configured to perform the method of Claim 1.
A method for debonding a stack of two substrates, comprising: 30 providing a first substrate and a second substrate, wherein each substrate has one or more metal contact bumps, wherein the one or more metal contact bumps are each covered with a graphene sheet portion, and wherein the one or more metal contact 20 bumps of the first substrate are in contact with the one or more metal contact bumps of the second substrate, and wherein the first substrate and the second substrate are held together by a removable 5 bonding means; and removing the bonding means, whereby contact between the one or more metal contact bumps of the first substrate are released from the one or more metal contact bumps of the second substrate, such that 10 the first substrate is released from the second substrate, and such are fully separated.
The method according to Claim 9, wherein wherein 15 removing the bonding means consists
Layer stacks claimed or described, ordered top of device to substrate.
imprinter device
semiconductor device package substrate with graphene-covered copper bumps
Materials described outside the worked examples.
graphene
copper
Cu
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Temperature | 25–1000 °C | — |
Pressure |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,974,617Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 A to 1 F illustrate the steps of the method according to an embodiment. 25 [0016]
FIG. 2 illustrates a method for producing an imprinter device. [0017]
FIGS. 3A to 3C illustrate the bonding process for attaching two substrates, each provided with copper bumps covered by a graphene layer. 30 [0018]
FIGS. 4A and 4B illustrate how a connection between copper bumps covered by a graphene layer can be separated. [0019]
FIG. 5 illustrates two steps of the method according to a preferred embodiment, wherein said rim 6 portion is not protruding outward with respect to said front …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a sheet of graphene to a metal contact bump, comprising: providing a substrate comprising one or more 5 metal contact bumps on a surface of the substrate, the metal contact bumps being surrounded by a passivation layer; placing a sheet of graphene on the substrate, the sheet of graphene covering the one or more metal 10 contact bumps, aligning an imprinter device with respect to the substrate, the imprinter device comprising an imprinter substrate having a front surface that is provided with one or more cavities through the front surface, each cavity having a rim portion, wherein a number of the one or more cavities is at least the same as a number of the one or more metal contact bumps, wherein the imprinter device is positioned so that each of the one or more metal contact bumps is 20 aligned with one of the cavities; lowering the imprinter device with respect to the substrate so that each of the one or more metal contact bumps becomes enclosed within a corresponding cavity, thereby arranging the sheet of graphene such 25 that it is in contact with top and side surfaces of the one or more metal contact bumps; pushing down the imprinter device until each rim portion cuts through the sheet of graphene; lifting up the imprinter device, so as to leave a 30 graphene sheet portion attached to the substrate and covering each of the one or more metal contact bumps, with unattached graphene sheet portions remaining on the substrate in between each of the one or more metal contact bumps; and 19 removing the unattached graphene sheet portions by cleaning.
The method according to Claim 1, wherein each rim portion protrudes outward with respect to said the surface 5 of the imprinter substrate.
The method according to Claim 1, wherein the one or more metal contact bumps are copper bumps.
The method according to Claim 1, wherein each rim portion is pushed into a surface of the passivation layer, 10 thereby imprinting each rim portion into the passivation layer, and thereby attaching the graphene sheet portions to the passivation layer.
The method according to Claim 1, wherein the substrate is an integrated circuit or a substrate 15 configured for receiving a plurality of integrated circuits on its surface.
The method according to Claim 1, wherein the imprinter substrate is selected from the group consisting of a metal substrate, a silicon substrate, and a silicon 20 substrate with a silicon nitride layer provided on thereon.
An imprinter device configured to perform the method of Claim 1.
A method for debonding a stack of two substrates, comprising: 30 providing a first substrate and a second substrate, wherein each substrate has one or more metal contact bumps, wherein the one or more metal contact bumps are each covered with a graphene sheet portion, and wherein the one or more metal contact 20 bumps of the first substrate are in contact with the one or more metal contact bumps of the second substrate, and wherein the first substrate and the second substrate are held together by a removable 5 bonding means; and removing the bonding means, whereby contact between the one or more metal contact bumps of the first substrate are released from the one or more metal contact bumps of the second substrate, such that 10 the first substrate is released from the second substrate, and such are fully separated.
The method according to Claim 9, wherein wherein 15 removing the bonding means consists
Layer stacks claimed or described, ordered top of device to substrate.
imprinter device
semiconductor device package substrate with graphene-covered copper bumps
Materials described outside the worked examples.
graphene
copper
Cu
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Temperature | 25–1000 °C | — |
Pressure |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,974,617Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 A to 1 F illustrate the steps of the method according to an embodiment. 25 [0016]
FIG. 2 illustrates a method for producing an imprinter device. [0017]
FIGS. 3A to 3C illustrate the bonding process for attaching two substrates, each provided with copper bumps covered by a graphene layer. 30 [0018]
FIGS. 4A and 4B illustrate how a connection between copper bumps covered by a graphene layer can be separated. [0019]
FIG. 5 illustrates two steps of the method according to a preferred embodiment, wherein said rim 6 portion is not protruding outward with respect to said front …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a sheet of graphene to a metal contact bump, comprising: providing a substrate comprising one or more 5 metal contact bumps on a surface of the substrate, the metal contact bumps being surrounded by a passivation layer; placing a sheet of graphene on the substrate, the sheet of graphene covering the one or more metal 10 contact bumps, aligning an imprinter device with respect to the substrate, the imprinter device comprising an imprinter substrate having a front surface that is provided with one or more cavities through the front surface, each cavity having a rim portion, wherein a number of the one or more cavities is at least the same as a number of the one or more metal contact bumps, wherein the imprinter device is positioned so that each of the one or more metal contact bumps is 20 aligned with one of the cavities; lowering the imprinter device with respect to the substrate so that each of the one or more metal contact bumps becomes enclosed within a corresponding cavity, thereby arranging the sheet of graphene such 25 that it is in contact with top and side surfaces of the one or more metal contact bumps; pushing down the imprinter device until each rim portion cuts through the sheet of graphene; lifting up the imprinter device, so as to leave a 30 graphene sheet portion attached to the substrate and covering each of the one or more metal contact bumps, with unattached graphene sheet portions remaining on the substrate in between each of the one or more metal contact bumps; and 19 removing the unattached graphene sheet portions by cleaning.
The method according to Claim 1, wherein each rim portion protrudes outward with respect to said the surface 5 of the imprinter substrate.
The method according to Claim 1, wherein the one or more metal contact bumps are copper bumps.
The method according to Claim 1, wherein each rim portion is pushed into a surface of the passivation layer, 10 thereby imprinting each rim portion into the passivation layer, and thereby attaching the graphene sheet portions to the passivation layer.
The method according to Claim 1, wherein the substrate is an integrated circuit or a substrate 15 configured for receiving a plurality of integrated circuits on its surface.
The method according to Claim 1, wherein the imprinter substrate is selected from the group consisting of a metal substrate, a silicon substrate, and a silicon 20 substrate with a silicon nitride layer provided on thereon.
An imprinter device configured to perform the method of Claim 1.
A method for debonding a stack of two substrates, comprising: 30 providing a first substrate and a second substrate, wherein each substrate has one or more metal contact bumps, wherein the one or more metal contact bumps are each covered with a graphene sheet portion, and wherein the one or more metal contact 20 bumps of the first substrate are in contact with the one or more metal contact bumps of the second substrate, and wherein the first substrate and the second substrate are held together by a removable 5 bonding means; and removing the bonding means, whereby contact between the one or more metal contact bumps of the first substrate are released from the one or more metal contact bumps of the second substrate, such that 10 the first substrate is released from the second substrate, and such are fully separated.
The method according to Claim 9, wherein wherein 15 removing the bonding means consists
Layer stacks claimed or described, ordered top of device to substrate.
imprinter device
semiconductor device package substrate with graphene-covered copper bumps
Materials described outside the worked examples.
graphene
copper
Cu
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Temperature | 25–1000 °C | — |
Pressure |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 8,974,617Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 A to 1 F illustrate the steps of the method according to an embodiment. 25 [0016]
FIG. 2 illustrates a method for producing an imprinter device. [0017]
FIGS. 3A to 3C illustrate the bonding process for attaching two substrates, each provided with copper bumps covered by a graphene layer. 30 [0018]
FIGS. 4A and 4B illustrate how a connection between copper bumps covered by a graphene layer can be separated. [0019]
FIG. 5 illustrates two steps of the method according to a preferred embodiment, wherein said rim 6 portion is not protruding outward with respect to said front …
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method for transferring a sheet of graphene to a metal contact bump, comprising: providing a substrate comprising one or more 5 metal contact bumps on a surface of the substrate, the metal contact bumps being surrounded by a passivation layer; placing a sheet of graphene on the substrate, the sheet of graphene covering the one or more metal 10 contact bumps, aligning an imprinter device with respect to the substrate, the imprinter device comprising an imprinter substrate having a front surface that is provided with one or more cavities through the front surface, each cavity having a rim portion, wherein a number of the one or more cavities is at least the same as a number of the one or more metal contact bumps, wherein the imprinter device is positioned so that each of the one or more metal contact bumps is 20 aligned with one of the cavities; lowering the imprinter device with respect to the substrate so that each of the one or more metal contact bumps becomes enclosed within a corresponding cavity, thereby arranging the sheet of graphene such 25 that it is in contact with top and side surfaces of the one or more metal contact bumps; pushing down the imprinter device until each rim portion cuts through the sheet of graphene; lifting up the imprinter device, so as to leave a 30 graphene sheet portion attached to the substrate and covering each of the one or more metal contact bumps, with unattached graphene sheet portions remaining on the substrate in between each of the one or more metal contact bumps; and 19 removing the unattached graphene sheet portions by cleaning.
The method according to Claim 1, wherein each rim portion protrudes outward with respect to said the surface 5 of the imprinter substrate.
The method according to Claim 1, wherein the one or more metal contact bumps are copper bumps.
The method according to Claim 1, wherein each rim portion is pushed into a surface of the passivation layer, 10 thereby imprinting each rim portion into the passivation layer, and thereby attaching the graphene sheet portions to the passivation layer.
The method according to Claim 1, wherein the substrate is an integrated circuit or a substrate 15 configured for receiving a plurality of integrated circuits on its surface.
The method according to Claim 1, wherein the imprinter substrate is selected from the group consisting of a metal substrate, a silicon substrate, and a silicon 20 substrate with a silicon nitride layer provided on thereon.
An imprinter device configured to perform the method of Claim 1.
A method for debonding a stack of two substrates, comprising: 30 providing a first substrate and a second substrate, wherein each substrate has one or more metal contact bumps, wherein the one or more metal contact bumps are each covered with a graphene sheet portion, and wherein the one or more metal contact 20 bumps of the first substrate are in contact with the one or more metal contact bumps of the second substrate, and wherein the first substrate and the second substrate are held together by a removable 5 bonding means; and removing the bonding means, whereby contact between the one or more metal contact bumps of the first substrate are released from the one or more metal contact bumps of the second substrate, such that 10 the first substrate is released from the second substrate, and such are fully separated.
The method according to Claim 9, wherein wherein 15 removing the bonding means consists
Layer stacks claimed or described, ordered top of device to substrate.
imprinter device
semiconductor device package substrate with graphene-covered copper bumps
Materials described outside the worked examples.
graphene
copper
Cu
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Temperature | 25–1000 °C | — |
Pressure |
Related documents with shared materials, methods, properties, or citations.
passivation layer
metal substrate (imprinter)
silicon substrate (imprinter)
Si
silicon substrate with silicon nitride layer (imprinter)
cured underfill layer
solidified solder balls
BCB or polyimide film (passivation layer)
PMMA
| — |
passivation layer
metal substrate (imprinter)
silicon substrate (imprinter)
Si
silicon substrate with silicon nitride layer (imprinter)
cured underfill layer
solidified solder balls
BCB or polyimide film (passivation layer)
PMMA
| — |
passivation layer
metal substrate (imprinter)
silicon substrate (imprinter)
Si
silicon substrate with silicon nitride layer (imprinter)
cured underfill layer
solidified solder balls
BCB or polyimide film (passivation layer)
PMMA
| — |
passivation layer
metal substrate (imprinter)
silicon substrate (imprinter)
Si
silicon substrate with silicon nitride layer (imprinter)
cured underfill layer
solidified solder balls
BCB or polyimide film (passivation layer)
PMMA
| — |