Patent
US 10,663,277average surface roughness m2 on second main surface (claim 1) | 0.4–3 nm | InP |
standard deviation σ2 of surface roughness on second main surface (claim 1) | ≤ 10 % of average value m2 | InP |
average surface roughness m1 on first main surface (claim 2) | 0.1–0.3 nm | InP |
average surface roughness m2 on second main surface (claim 2) | 0.5–2 nm | InP |
Thickness | 1250–1500 nm | — |
Thickness | ≤ 0.2 nm | — |
Thickness | ≥ 0.4 nm | — |
BIASING METHOD FOR InP MACH-ZEHNDER MODULATORS DIRECTLY COUPLED TO RF DRIVER CIRCUITS
average surface roughness m2 on second main surface (claim 1) | 0.4–3 nm | InP |
standard deviation σ2 of surface roughness on second main surface (claim 1) | ≤ 10 % of average value m2 | InP |
average surface roughness m1 on first main surface (claim 2) | 0.1–0.3 nm | InP |
average surface roughness m2 on second main surface (claim 2) | 0.5–2 nm | InP |
Thickness | 1250–1500 nm | — |
Thickness | ≤ 0.2 nm | — |
Thickness | ≥ 0.4 nm | — |
BIASING METHOD FOR InP MACH-ZEHNDER MODULATORS DIRECTLY COUPLED TO RF DRIVER CIRCUITS
average surface roughness m2 on second main surface (claim 1) | 0.4–3 nm | InP |
standard deviation σ2 of surface roughness on second main surface (claim 1) | ≤ 10 % of average value m2 | InP |
average surface roughness m1 on first main surface (claim 2) | 0.1–0.3 nm | InP |
average surface roughness m2 on second main surface (claim 2) | 0.5–2 nm | InP |
Thickness | 1250–1500 nm | — |
Thickness | ≤ 0.2 nm | — |
Thickness | ≥ 0.4 nm | — |
BIASING METHOD FOR InP MACH-ZEHNDER MODULATORS DIRECTLY COUPLED TO RF DRIVER CIRCUITS
average surface roughness m2 on second main surface (claim 1) | 0.4–3 nm | InP |
standard deviation σ2 of surface roughness on second main surface (claim 1) | ≤ 10 % of average value m2 | InP |
average surface roughness m1 on first main surface (claim 2) | 0.1–0.3 nm | InP |
average surface roughness m2 on second main surface (claim 2) | 0.5–2 nm | InP |
Thickness | 1250–1500 nm | — |
Thickness | ≤ 0.2 nm | — |
Thickness | ≥ 0.4 nm | — |
BIASING METHOD FOR InP MACH-ZEHNDER MODULATORS DIRECTLY COUPLED TO RF DRIVER CIRCUITS