NORMALLY OFF GALLIUM NITRIDE FIELD EFFECT TRANSISTORS (FET) | Matter42 Literature
Patent
Atlas literature
Patent
US 10,439,058
NORMALLY OFF GALLIUM NITRIDE FIELD EFFECT TRANSISTORS (FET)
Anup Bhalla
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 8 dependent
1
IndependentGaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
A method of forming a heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprising: forming a hetero-junction structure from a first semiconductor layer interfacing a second semiconductor layer having different band gaps to make a two dimensional gas (2DEG) at the hetero -j unction; forming a source electrode and drain electrode on opposite ends of the 2DEG; forming a floating gate wrapping around a segment of the hetero-junction structure between the source electrode and the drain electrode on top of the hetero-junction structure; and forming a gate electrode wrapping around the floating gate for controlling a current flow between said source and drain electrodes in said 2DEG layer. Original
2
Dependent← claim 1GaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the hetero -j unction structure further comprises a step of forming the first semiconductor layer comprising GaN interfacing the second semiconductor layer comprising Aluminum gallium nitride (AlGaN). Original
3
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of charging the gate insulation layer to deplete the 2DEG further comprises a step of forming the gate insulation layer with a built-in negative charge. Original
4
Dependent← claim 1sapphireheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming the HFET gallium nitride (GaN) semiconductor power device on a sapphire substrate for supporting the hetero -j unction structure thereon. Original
5
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming a gate insulation layer between the gate electrode and the hetero -j unction structure and charging the gate insulation layer to deplete the 2DEG for operating the HFET semiconductor device in a normally off condition. Original
8
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming the source electrode with an extended field plate extending from the source electrode and covering over the gate electrode. Original
9
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming an extended field plate extending from the source electrode and covering over the gate electrode wherein the field plate is insulated from the gate electrode with a thick insulation layer. Original
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
heterostructure field effect transistor (HFET) GaN semiconductor power device
AlGaNelectron supply layer
GaNchannel layer
sapphiresubstrate
Materials
Materials described outside the worked examples.
gallium nitride
GaN
First Semiconductor Layer Channel
aluminum gallium nitride
AlGaN
Second Semiconductor Layer Electron Supply
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
pinch off voltage shift from negative to positive (claimed minimum)
3 V
—
Why these are connected
Related documents with shared materials, methods, properties, or citations.
NORMALLY OFF GALLIUM NITRIDE FIELD EFFECT TRANSISTORS (FET)
Anup Bhalla
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 8 dependent
1
IndependentGaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
A method of forming a heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprising: forming a hetero-junction structure from a first semiconductor layer interfacing a second semiconductor layer having different band gaps to make a two dimensional gas (2DEG) at the hetero -j unction; forming a source electrode and drain electrode on opposite ends of the 2DEG; forming a floating gate wrapping around a segment of the hetero-junction structure between the source electrode and the drain electrode on top of the hetero-junction structure; and forming a gate electrode wrapping around the floating gate for controlling a current flow between said source and drain electrodes in said 2DEG layer. Original
2
Dependent← claim 1GaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the hetero -j unction structure further comprises a step of forming the first semiconductor layer comprising GaN interfacing the second semiconductor layer comprising Aluminum gallium nitride (AlGaN). Original
3
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of charging the gate insulation layer to deplete the 2DEG further comprises a step of forming the gate insulation layer with a built-in negative charge. Original
4
Dependent← claim 1sapphireheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming the HFET gallium nitride (GaN) semiconductor power device on a sapphire substrate for supporting the hetero -j unction structure thereon. Original
5
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming a gate insulation layer between the gate electrode and the hetero -j unction structure and charging the gate insulation layer to deplete the 2DEG for operating the HFET semiconductor device in a normally off condition. Original
8
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming the source electrode with an extended field plate extending from the source electrode and covering over the gate electrode. Original
9
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming an extended field plate extending from the source electrode and covering over the gate electrode wherein the field plate is insulated from the gate electrode with a thick insulation layer. Original
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
heterostructure field effect transistor (HFET) GaN semiconductor power device
AlGaNelectron supply layer
GaNchannel layer
sapphiresubstrate
Materials
Materials described outside the worked examples.
gallium nitride
GaN
First Semiconductor Layer Channel
aluminum gallium nitride
AlGaN
Second Semiconductor Layer Electron Supply
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
pinch off voltage shift from negative to positive (claimed minimum)
3 V
—
Why these are connected
Related documents with shared materials, methods, properties, or citations.
NORMALLY OFF GALLIUM NITRIDE FIELD EFFECT TRANSISTORS (FET)
Anup Bhalla
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 8 dependent
1
IndependentGaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
A method of forming a heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprising: forming a hetero-junction structure from a first semiconductor layer interfacing a second semiconductor layer having different band gaps to make a two dimensional gas (2DEG) at the hetero -j unction; forming a source electrode and drain electrode on opposite ends of the 2DEG; forming a floating gate wrapping around a segment of the hetero-junction structure between the source electrode and the drain electrode on top of the hetero-junction structure; and forming a gate electrode wrapping around the floating gate for controlling a current flow between said source and drain electrodes in said 2DEG layer. Original
2
Dependent← claim 1GaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the hetero -j unction structure further comprises a step of forming the first semiconductor layer comprising GaN interfacing the second semiconductor layer comprising Aluminum gallium nitride (AlGaN). Original
3
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of charging the gate insulation layer to deplete the 2DEG further comprises a step of forming the gate insulation layer with a built-in negative charge. Original
4
Dependent← claim 1sapphireheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming the HFET gallium nitride (GaN) semiconductor power device on a sapphire substrate for supporting the hetero -j unction structure thereon. Original
5
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming a gate insulation layer between the gate electrode and the hetero -j unction structure and charging the gate insulation layer to deplete the 2DEG for operating the HFET semiconductor device in a normally off condition. Original
8
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming the source electrode with an extended field plate extending from the source electrode and covering over the gate electrode. Original
9
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming an extended field plate extending from the source electrode and covering over the gate electrode wherein the field plate is insulated from the gate electrode with a thick insulation layer. Original
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
heterostructure field effect transistor (HFET) GaN semiconductor power device
AlGaNelectron supply layer
GaNchannel layer
sapphiresubstrate
Materials
Materials described outside the worked examples.
gallium nitride
GaN
First Semiconductor Layer Channel
aluminum gallium nitride
AlGaN
Second Semiconductor Layer Electron Supply
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
pinch off voltage shift from negative to positive (claimed minimum)
3 V
—
Why these are connected
Related documents with shared materials, methods, properties, or citations.
NORMALLY OFF GALLIUM NITRIDE FIELD EFFECT TRANSISTORS (FET)
Anup Bhalla
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
1 independent · 8 dependent
1
IndependentGaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
A method of forming a heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprising: forming a hetero-junction structure from a first semiconductor layer interfacing a second semiconductor layer having different band gaps to make a two dimensional gas (2DEG) at the hetero -j unction; forming a source electrode and drain electrode on opposite ends of the 2DEG; forming a floating gate wrapping around a segment of the hetero-junction structure between the source electrode and the drain electrode on top of the hetero-junction structure; and forming a gate electrode wrapping around the floating gate for controlling a current flow between said source and drain electrodes in said 2DEG layer. Original
2
Dependent← claim 1GaNAlGaNheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the hetero -j unction structure further comprises a step of forming the first semiconductor layer comprising GaN interfacing the second semiconductor layer comprising Aluminum gallium nitride (AlGaN). Original
3
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of charging the gate insulation layer to deplete the 2DEG further comprises a step of forming the gate insulation layer with a built-in negative charge. Original
4
Dependent← claim 1sapphireheterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming the HFET gallium nitride (GaN) semiconductor power device on a sapphire substrate for supporting the hetero -j unction structure thereon. Original
5
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 further comprising: forming a gate insulation layer between the gate electrode and the hetero -j unction structure and charging the gate insulation layer to deplete the 2DEG for operating the HFET semiconductor device in a normally off condition. Original
8
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming the source electrode with an extended field plate extending from the source electrode and covering over the gate electrode. Original
9
Dependent← claim 1heterostructure field effect transistor (HFET) GaN semiconductor power device
The method of claim 1 wherein: the step of forming the source electrode further includes a step of forming an extended field plate extending from the source electrode and covering over the gate electrode wherein the field plate is insulated from the gate electrode with a thick insulation layer. Original
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
heterostructure field effect transistor (HFET) GaN semiconductor power device
AlGaNelectron supply layer
GaNchannel layer
sapphiresubstrate
Materials
Materials described outside the worked examples.
gallium nitride
GaN
First Semiconductor Layer Channel
aluminum gallium nitride
AlGaN
Second Semiconductor Layer Electron Supply
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
pinch off voltage shift from negative to positive (claimed minimum)
3 V
—
Why these are connected
Related documents with shared materials, methods, properties, or citations.