High-Side Gate Driver for Gallium Nitride Integrated Circuits | Matter42 Literature
Patent
Atlas literature
Patent
US 10,855,273
High-Side Gate Driver for Gallium Nitride Integrated Circuits
Zhanming Li
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
FIG. 8
FIG. 9
FIG. 10
FIG. 11
FIG. 12
FIG. 13
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
11 independent · 5 dependent
1
Independent
1-3. Canceled
3
Independent
Canceled
4
IndependentGaNGaN gate driver circuit with DCFL amplifier
A gate driver circuit for a gallium nitride (GaN) power transistor, comprising: a RS-fli p flo p that receives a first p ulse train at an S in p ut terminal and a second p ulse train at an R in p ut terminal, and p roduces an out p ut p ulse train; a direct-cou pl ed FET logic (DCFL) am pl ifier that am pl ifies the out p ut p ulse train and p roduces a gate driver signal for the GaN p ower transistor; wherein the first p ulse train and the second p ulse train are inde p endentl y controlled signals; wherein the DCFL amplifier comprises: a first stage input point, a first stage output point, a second stage high side input point, a second stage low side input point, and an amplifier output point; wherein the first stage input point is connected to a first stage and to the second stage high side input point; and wherein the first stage output point is connected to the second stage low side input point. Currently amended
5
Independent
5-7. Canceled
7
Independent
Canceled
8
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim [[1]]4, wherein the RS-flipflop is implemented on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein a first two of the EHEMTs are of a large channel width and are arranged back-to-back as main RS-flipflop transistors; wherein a second two of the EHEMTs are of a small channel width and are arranged as R and S input transistors; wherein the two DHEMTs are configured as nonlinear loads for the main RS-flipflop transistors. Currently amended
9
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, wherein a ratio of transistor channel widths for the two EHEMTs of a large channel width, the two EHEMTs of a small channel width, and the two DHEMTs is (100 ± 50):(30 ± 15):(1 ± 0.5), respectively. Previously presented
10
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, further comprising a device that outputs the first pulse train and the second pulse train; wherein a pulse width of the first pulse train is within a range of about 5 ns to 15 ns; and wherein a pulse width of the second pulse train is within a range of about 5 ns to 15 ns. Original
13
Independent
13-18. Canceled
18
Independent
Canceled
19
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
A method for im pl ementing a g ate driver circuit for a GaN p ower transistor, com p rising: using a RS-fli p flo p to receive a first p ulse train at an S in p ut terminal, receive a second p ulse train at an R input terminal, and produce an output pulse train; amplifying the output pulse train to produce a gate driver signal for the GaN power transistor; wherein the first pulse train and the second pulse train are independently controlled signals; the method further comprising implementing the RS-flipflop on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein channel width and are arranged back-to-back as two of the EHEMTs are of a small channel width wherein the two DHEMTs are configured as non-linear Currently amended
20
Dependent← claim 19GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The method of claim 19, wherein a ratio of a large channel width, the two EHEMTs of a small 50):(30 ± 15):(1 ± 0.5), respectively. Previously
21
Independent
21-23. Canceled
23
Independent
Canceled a first two of the EHEMTs are of a large main RS-flipflop transistors; wherein a second and are arranged as R and S input transistors; loads for the main RS-flipflop transistors. transistor channel widths for the two EHEMTs of channel width, and the two DHEMTs is (100 ± presented
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN gate driver circuit with DCFL amplifier
No layer stack recorded.
GaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
GaNnonlinear load DHEMTs
GaNRS input transistors small channel
GaNmain flipflop transistors large channel
Materials
Materials described outside the worked examples.
gallium nitride (GaN)
GaN
Semiconductor Material For Power Transistor And Monolithic Integrated Circuit
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
3–15 V
—
Thickness
800–2000 µm
Why these are connected
Related documents with shared materials, methods, properties, or citations.
High-Side Gate Driver for Gallium Nitride Integrated Circuits
Zhanming Li
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
FIG. 8
FIG. 9
FIG. 10
FIG. 11
FIG. 12
FIG. 13
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
11 independent · 5 dependent
1
Independent
1-3. Canceled
3
Independent
Canceled
4
IndependentGaNGaN gate driver circuit with DCFL amplifier
A gate driver circuit for a gallium nitride (GaN) power transistor, comprising: a RS-fli p flo p that receives a first p ulse train at an S in p ut terminal and a second p ulse train at an R in p ut terminal, and p roduces an out p ut p ulse train; a direct-cou pl ed FET logic (DCFL) am pl ifier that am pl ifies the out p ut p ulse train and p roduces a gate driver signal for the GaN p ower transistor; wherein the first p ulse train and the second p ulse train are inde p endentl y controlled signals; wherein the DCFL amplifier comprises: a first stage input point, a first stage output point, a second stage high side input point, a second stage low side input point, and an amplifier output point; wherein the first stage input point is connected to a first stage and to the second stage high side input point; and wherein the first stage output point is connected to the second stage low side input point. Currently amended
5
Independent
5-7. Canceled
7
Independent
Canceled
8
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim [[1]]4, wherein the RS-flipflop is implemented on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein a first two of the EHEMTs are of a large channel width and are arranged back-to-back as main RS-flipflop transistors; wherein a second two of the EHEMTs are of a small channel width and are arranged as R and S input transistors; wherein the two DHEMTs are configured as nonlinear loads for the main RS-flipflop transistors. Currently amended
9
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, wherein a ratio of transistor channel widths for the two EHEMTs of a large channel width, the two EHEMTs of a small channel width, and the two DHEMTs is (100 ± 50):(30 ± 15):(1 ± 0.5), respectively. Previously presented
10
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, further comprising a device that outputs the first pulse train and the second pulse train; wherein a pulse width of the first pulse train is within a range of about 5 ns to 15 ns; and wherein a pulse width of the second pulse train is within a range of about 5 ns to 15 ns. Original
13
Independent
13-18. Canceled
18
Independent
Canceled
19
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
A method for im pl ementing a g ate driver circuit for a GaN p ower transistor, com p rising: using a RS-fli p flo p to receive a first p ulse train at an S in p ut terminal, receive a second p ulse train at an R input terminal, and produce an output pulse train; amplifying the output pulse train to produce a gate driver signal for the GaN power transistor; wherein the first pulse train and the second pulse train are independently controlled signals; the method further comprising implementing the RS-flipflop on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein channel width and are arranged back-to-back as two of the EHEMTs are of a small channel width wherein the two DHEMTs are configured as non-linear Currently amended
20
Dependent← claim 19GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The method of claim 19, wherein a ratio of a large channel width, the two EHEMTs of a small 50):(30 ± 15):(1 ± 0.5), respectively. Previously
21
Independent
21-23. Canceled
23
Independent
Canceled a first two of the EHEMTs are of a large main RS-flipflop transistors; wherein a second and are arranged as R and S input transistors; loads for the main RS-flipflop transistors. transistor channel widths for the two EHEMTs of channel width, and the two DHEMTs is (100 ± presented
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN gate driver circuit with DCFL amplifier
No layer stack recorded.
GaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
GaNnonlinear load DHEMTs
GaNRS input transistors small channel
GaNmain flipflop transistors large channel
Materials
Materials described outside the worked examples.
gallium nitride (GaN)
GaN
Semiconductor Material For Power Transistor And Monolithic Integrated Circuit
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
3–15 V
—
Thickness
800–2000 µm
Why these are connected
Related documents with shared materials, methods, properties, or citations.
High-Side Gate Driver for Gallium Nitride Integrated Circuits
Zhanming Li
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
FIG. 8
FIG. 9
FIG. 10
FIG. 11
FIG. 12
FIG. 13
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
11 independent · 5 dependent
1
Independent
1-3. Canceled
3
Independent
Canceled
4
IndependentGaNGaN gate driver circuit with DCFL amplifier
A gate driver circuit for a gallium nitride (GaN) power transistor, comprising: a RS-fli p flo p that receives a first p ulse train at an S in p ut terminal and a second p ulse train at an R in p ut terminal, and p roduces an out p ut p ulse train; a direct-cou pl ed FET logic (DCFL) am pl ifier that am pl ifies the out p ut p ulse train and p roduces a gate driver signal for the GaN p ower transistor; wherein the first p ulse train and the second p ulse train are inde p endentl y controlled signals; wherein the DCFL amplifier comprises: a first stage input point, a first stage output point, a second stage high side input point, a second stage low side input point, and an amplifier output point; wherein the first stage input point is connected to a first stage and to the second stage high side input point; and wherein the first stage output point is connected to the second stage low side input point. Currently amended
5
Independent
5-7. Canceled
7
Independent
Canceled
8
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim [[1]]4, wherein the RS-flipflop is implemented on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein a first two of the EHEMTs are of a large channel width and are arranged back-to-back as main RS-flipflop transistors; wherein a second two of the EHEMTs are of a small channel width and are arranged as R and S input transistors; wherein the two DHEMTs are configured as nonlinear loads for the main RS-flipflop transistors. Currently amended
9
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, wherein a ratio of transistor channel widths for the two EHEMTs of a large channel width, the two EHEMTs of a small channel width, and the two DHEMTs is (100 ± 50):(30 ± 15):(1 ± 0.5), respectively. Previously presented
10
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, further comprising a device that outputs the first pulse train and the second pulse train; wherein a pulse width of the first pulse train is within a range of about 5 ns to 15 ns; and wherein a pulse width of the second pulse train is within a range of about 5 ns to 15 ns. Original
13
Independent
13-18. Canceled
18
Independent
Canceled
19
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
A method for im pl ementing a g ate driver circuit for a GaN p ower transistor, com p rising: using a RS-fli p flo p to receive a first p ulse train at an S in p ut terminal, receive a second p ulse train at an R input terminal, and produce an output pulse train; amplifying the output pulse train to produce a gate driver signal for the GaN power transistor; wherein the first pulse train and the second pulse train are independently controlled signals; the method further comprising implementing the RS-flipflop on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein channel width and are arranged back-to-back as two of the EHEMTs are of a small channel width wherein the two DHEMTs are configured as non-linear Currently amended
20
Dependent← claim 19GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The method of claim 19, wherein a ratio of a large channel width, the two EHEMTs of a small 50):(30 ± 15):(1 ± 0.5), respectively. Previously
21
Independent
21-23. Canceled
23
Independent
Canceled a first two of the EHEMTs are of a large main RS-flipflop transistors; wherein a second and are arranged as R and S input transistors; loads for the main RS-flipflop transistors. transistor channel widths for the two EHEMTs of channel width, and the two DHEMTs is (100 ± presented
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN gate driver circuit with DCFL amplifier
No layer stack recorded.
GaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
GaNnonlinear load DHEMTs
GaNRS input transistors small channel
GaNmain flipflop transistors large channel
Materials
Materials described outside the worked examples.
gallium nitride (GaN)
GaN
Semiconductor Material For Power Transistor And Monolithic Integrated Circuit
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
3–15 V
—
Thickness
800–2000 µm
Why these are connected
Related documents with shared materials, methods, properties, or citations.
High-Side Gate Driver for Gallium Nitride Integrated Circuits
Zhanming Li
US
Drawings
Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1
FIG. 2
FIG. 3
FIG. 4
FIG. 5
FIG. 6
FIG. 7
FIG. 8
FIG. 9
FIG. 10
FIG. 11
FIG. 12
FIG. 13
Claims
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
11 independent · 5 dependent
1
Independent
1-3. Canceled
3
Independent
Canceled
4
IndependentGaNGaN gate driver circuit with DCFL amplifier
A gate driver circuit for a gallium nitride (GaN) power transistor, comprising: a RS-fli p flo p that receives a first p ulse train at an S in p ut terminal and a second p ulse train at an R in p ut terminal, and p roduces an out p ut p ulse train; a direct-cou pl ed FET logic (DCFL) am pl ifier that am pl ifies the out p ut p ulse train and p roduces a gate driver signal for the GaN p ower transistor; wherein the first p ulse train and the second p ulse train are inde p endentl y controlled signals; wherein the DCFL amplifier comprises: a first stage input point, a first stage output point, a second stage high side input point, a second stage low side input point, and an amplifier output point; wherein the first stage input point is connected to a first stage and to the second stage high side input point; and wherein the first stage output point is connected to the second stage low side input point. Currently amended
5
Independent
5-7. Canceled
7
Independent
Canceled
8
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim [[1]]4, wherein the RS-flipflop is implemented on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein a first two of the EHEMTs are of a large channel width and are arranged back-to-back as main RS-flipflop transistors; wherein a second two of the EHEMTs are of a small channel width and are arranged as R and S input transistors; wherein the two DHEMTs are configured as nonlinear loads for the main RS-flipflop transistors. Currently amended
9
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, wherein a ratio of transistor channel widths for the two EHEMTs of a large channel width, the two EHEMTs of a small channel width, and the two DHEMTs is (100 ± 50):(30 ± 15):(1 ± 0.5), respectively. Previously presented
10
Dependent← claim 8GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The gate driver circuit of claim 8, further comprising a device that outputs the first pulse train and the second pulse train; wherein a pulse width of the first pulse train is within a range of about 5 ns to 15 ns; and wherein a pulse width of the second pulse train is within a range of about 5 ns to 15 ns. Original
13
Independent
13-18. Canceled
18
Independent
Canceled
19
IndependentGaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
A method for im pl ementing a g ate driver circuit for a GaN p ower transistor, com p rising: using a RS-fli p flo p to receive a first p ulse train at an S in p ut terminal, receive a second p ulse train at an R input terminal, and produce an output pulse train; amplifying the output pulse train to produce a gate driver signal for the GaN power transistor; wherein the first pulse train and the second pulse train are independently controlled signals; the method further comprising implementing the RS-flipflop on a GaN monolithic integrated circuit; wherein the RS-flipflop comprises: four EHEMTs and two DHEMTs; wherein channel width and are arranged back-to-back as two of the EHEMTs are of a small channel width wherein the two DHEMTs are configured as non-linear Currently amended
20
Dependent← claim 19GaNGaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
The method of claim 19, wherein a ratio of a large channel width, the two EHEMTs of a small 50):(30 ± 15):(1 ± 0.5), respectively. Previously
21
Independent
21-23. Canceled
23
Independent
Canceled a first two of the EHEMTs are of a large main RS-flipflop transistors; wherein a second and are arranged as R and S input transistors; loads for the main RS-flipflop transistors. transistor channel widths for the two EHEMTs of channel width, and the two DHEMTs is (100 ± presented
Device structures
Layer stacks claimed or described, ordered top of device to substrate.
GaN gate driver circuit with DCFL amplifier
No layer stack recorded.
GaN monolithic integrated circuit RS-flipflop with EHEMTs and DHEMTs
GaNnonlinear load DHEMTs
GaNRS input transistors small channel
GaNmain flipflop transistors large channel
Materials
Materials described outside the worked examples.
gallium nitride (GaN)
GaN
Semiconductor Material For Power Transistor And Monolithic Integrated Circuit
Reported properties
Performance values and ranges asserted in the specification or claims.
Property
Value
Material
Voltage
3–15 V
—
Thickness
800–2000 µm
Why these are connected
Related documents with shared materials, methods, properties, or citations.